by chemical means

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CPC
H01L21/28556

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/28556by chemical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Formation and in-situ etching processes for metal layers
- Patent number 12,170,202
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing gate structure and method of manufacturing...
- Patent number 12,170,280
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,148,621
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Koei Kuribayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices
- Patent number 12,148,622
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protection layer and method for fabricati...
- Patent number 12,112,950
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,112,973
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for filling a gap
- Patent number 12,104,244
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming a metallic film on a substrate by cyclical depo...
- Patent number 12,106,965
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Katja Väyrynen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,087,637
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,084,757
- Issue date Sep 10, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature deposition of pure molybdenum films
- Patent number 12,080,558
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Kunal Bhatnagar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,074,023
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Ji-woon Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,068,163
- Issue date Aug 20, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with barrier layer
- Patent number 12,046,662
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon and/or oxygen doped polysilicon resistor
- Patent number 12,027,515
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Yanbiao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment apparatus and manufacturing method of semicondu...
- Patent number 12,027,367
- Issue date Jul 2, 2024
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,020,947
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-An Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of low temperature thin film deposition and in-si...
- Patent number 12,018,374
- Issue date Jun 25, 2024
- DSGI Technologies, Inc.
- Jeffrey Edward Kowalski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistivity DRAM buried word line stack
- Patent number 12,022,650
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for forming graphene structure
- Patent number 12,014,907
- Issue date Jun 18, 2024
- Tokyo Electron Limited
- Ryota Ifuku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with carbon-density-decreasing region
- Patent number 11,996,449
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Tsunenobu Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing display device, and electro...
- Patent number 11,985,857
- Issue date May 14, 2024
- Sony Group Corporation
- Hitoshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and film forming system
- Patent number 11,984,319
- Issue date May 14, 2024
- Tokyo Electron Limited
- Kensaku Narushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dynamic precursor dosing for atomic layer deposition
- Patent number 11,970,772
- Issue date Apr 30, 2024
- Lam Research Corporation
- Purushottam Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming nickel silicide materials
- Patent number 11,965,236
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Minrui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Combined RF generator and RF solid-state matching network
- Patent number 11,948,775
- Issue date Apr 2, 2024
- ASM AMERICA, INC.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unconsumed precursor monitoring
- Patent number 11,929,270
- Issue date Mar 12, 2024
- Mohamed Buhary Rinzan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method for Metal Gapfill
- Publication number 20240395614
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...
- Publication number 20240387190
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guangyan Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structure of Semiconductor Device and Method of Forming Same
- Publication number 20240379812
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240371645
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION AND IN-SITU ETCHING PROCESSES FOR METAL LAYERS
- Publication number 20240363350
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240363424
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FILLING A GAP
- Publication number 20240352576
- Publication date Oct 24, 2024
- ASM IP HOLDING B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...
- Publication number 20240355499
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- CHANG SEOK LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...
- Publication number 20240347610
- Publication date Oct 17, 2024
- Intel Corporation
- Koustav GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240332024
- Publication date Oct 3, 2024
- Kokusai Electric Corporation
- Yutaka MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240312792
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon and/or Oxygen Doped Polysilicon Resistor
- Publication number 20240312984
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yanbiao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PACKAGING MANUFACTURING METHOD AND SEMICONDUCTOR DEVICES MAN...
- Publication number 20240312782
- Publication date Sep 19, 2024
- Seoul National University R&DB Foundation
- Woo Young CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CARBON-DENSITY-DECREASING REGION
- Publication number 20240258380
- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Tsunenobu KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION
- Publication number 20240240316
- Publication date Jul 18, 2024
- LAM RESEARCH CORPORATION
- Purushottam Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20240218503
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Diamond Semiconductor System And Method
- Publication number 20240213024
- Publication date Jun 27, 2024
- AKHAN Semiconductor, Inc.
- Adam Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR STRUCTURE AND FABRICATING METHOD OF THE SAME
- Publication number 20240213304
- Publication date Jun 27, 2024
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT DEVICE AND METHOD
- Publication number 20240186145
- Publication date Jun 6, 2024
- ASML Netherlands B.V.
- Monim AZIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Gapfill
- Publication number 20240178062
- Publication date May 30, 2024
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DIAGNOSING PLASMA CHAMBER
- Publication number 20240177970
- Publication date May 30, 2024
- ASM IP HOLDING B.V.
- Imran Ahmed BHUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Formation of Conductor Nanowires
- Publication number 20240153870
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM...
- Publication number 20240145301
- Publication date May 2, 2024
- Soulbrain Co., LTD
- Chang Bong YEON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240136191
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED MOLYBDENUM DEPOSITION
- Publication number 20240102157
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- TUERXUN AILIHUMAER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HALOALKYNYL DICOBALT HEXACARBONYL PRECURSORS FOR CHEMICAL VAPOR DEP...
- Publication number 20240096631
- Publication date Mar 21, 2024
- Entegris, Inc.
- Sangbum Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GATE STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240096883
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURE, FIN FIELD-EFFECT TRANSISTOR, AND METHOD OF MANUFACT...
- Publication number 20240088144
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

by chemical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Formation and in-situ etching processes for metal layers

Method of manufacturing gate structure and method of manufacturing...

Method of processing substrate, method of manufacturing semiconduct...

Semiconductor devices

Method of forming semiconductor device

Methods for forming recesses in source/drain regions and devices fo...

Semiconductor device with protection layer and method for fabricati...

Semiconductor structure and method for manufacturing the same

Methods and systems for filling a gap

Methods for forming a metallic film on a substrate by cyclical depo...

Semiconductor device and method of manufacture

Method of manufacturing semiconductor device, substrate processing...

Low temperature deposition of pure molybdenum films

Methods of manufacturing semiconductor devices

Method for forming semiconductor structure

Semiconductor device structure with barrier layer

Carbon and/or oxygen doped polysilicon resistor

Substrate treatment apparatus and manufacturing method of semicondu...

Method of manufacturing semiconductor devices and semiconductor dev...

System and method of low temperature thin film deposition and in-si...

Low resistivity DRAM buried word line stack

Method and device for forming graphene structure

Semiconductor device with carbon-density-decreasing region

Display device, method of manufacturing display device, and electro...

Substrate processing method and film forming system

Dynamic precursor dosing for atomic layer deposition

Method of forming nickel silicide materials

Selective cobalt deposition on copper surfaces

Combined RF generator and RF solid-state matching network

Unconsumed precursor monitoring

Patents Applicationslast 30 patents

Method for Metal Gapfill

FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...

Method of Forming Semiconductor Device

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

Gate Structure of Semiconductor Device and Method of Forming Same

SEMICONDUCTOR DEVICES

FORMATION AND IN-SITU ETCHING PROCESSES FOR METAL LAYERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHODS AND SYSTEMS FOR FILLING A GAP

SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...

CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Carbon and/or Oxygen Doped Polysilicon Resistor

VACUUM PACKAGING MANUFACTURING METHOD AND SEMICONDUCTOR DEVICES MAN...

SEMICONDUCTOR DEVICE WITH CARBON-DENSITY-DECREASING REGION

DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

Diamond Semiconductor System And Method

MIM CAPACITOR STRUCTURE AND FABRICATING METHOD OF THE SAME

SURFACE TREATMENT DEVICE AND METHOD

Method for Gapfill

SYSTEM AND METHOD FOR DIAGNOSING PLASMA CHAMBER

Selective Formation of Conductor Nanowires

METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM...

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME

PLASMA-ENHANCED MOLYBDENUM DEPOSITION

HALOALKYNYL DICOBALT HEXACARBONYL PRECURSORS FOR CHEMICAL VAPOR DEP...

METHOD OF MANUFACTURING GATE STRUCTURE AND METHOD OF MANUFACTURING...

GATE STRUCTURE, FIN FIELD-EFFECT TRANSISTOR, AND METHOD OF MANUFACT...