by chemical mechanical polishing [CMP]

Industry

CPC
H01L21/3212

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3212by chemical mechanical polishing [CMP]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing solution
- Patent number 12,365,814
- Issue date Jul 22, 2025
- ANJI MICROELCTRONICS (SHANGHAI) CO., LTD
- Shoutian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate cleaning apparatus, substrate processing apparatus, subst...
- Patent number 12,368,059
- Issue date Jul 22, 2025
- Ebara Corporation
- Shuji Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid dispersion and powder of cerium based core-shell particles,...
- Patent number 12,359,091
- Issue date Jul 15, 2025
- RHODIA OPERATIONS
- Marie Plissonneau
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition and method for polishing and integrated circuit
- Patent number 12,359,090
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,362,170
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad and method for preparing semiconductor device using t...
- Patent number 12,362,232
- Issue date Jul 15, 2025
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing of substrates containing copper and r...
- Patent number 12,351,737
- Issue date Jul 8, 2025
- BASF SE
- Haci Osman Guevenc
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Replacement buried power rail in backside power delivery
- Patent number 12,354,991
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Hoyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor within a via
- Patent number 12,347,769
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,349,455
- Issue date Jul 1, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Dengfeng Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride inhibitors for high selectivity of TiN—SiN CMP applications
- Patent number 12,338,369
- Issue date Jun 24, 2025
- CMC MATERIALS LLC
- Chih-Hsien Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,342,615
- Issue date Jun 24, 2025
- Sony Group Corporation
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 12,341,023
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polish slurry and method of manufacture
- Patent number 12,327,734
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric fluid field cluster catalytic method for atomic-scale...
- Patent number 12,325,017
- Issue date Jun 10, 2025
- Zhejiang University
- Wule Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing compositions and methods of using the same
- Patent number 12,319,843
- Issue date Jun 3, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Qingmin Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Liner structures
- Patent number 12,324,232
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry composition for chemical mechanical polishing
- Patent number 12,319,841
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Inkwon Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Displacement measurements in semiconductor wafer processing
- Patent number 12,322,662
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Justin Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry composition for polishing polycrystalline silicon and po...
- Patent number 12,305,079
- Issue date May 20, 2025
- KCTECH Co., Ltd.
- Jae Woo Lee
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods for processing semiconductor wafers having a polycrystallin...
- Patent number 12,308,247
- Issue date May 20, 2025
- GlobalWafers Co., Ltd.
- Alexis Grabbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
- Patent number 12,300,543
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric MFM capacitor array and methods of making the same
- Patent number 12,302,590
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method
- Patent number 12,300,508
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for CMP temperature control
- Patent number 12,296,427
- Issue date May 13, 2025
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and structure for source/drain contacts
- Patent number 12,300,727
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Huan Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry composition and method for polishing and integrated circuit
- Patent number 12,297,375
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
- Publication number 20250240981
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyun-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250241014
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chung JEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250234614
- Publication date Jul 17, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20250218792
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVELY CHARGED SILICA PARTICLES, METHOD OF PRODUCING SUCH PARTI...
- Publication number 20250215296
- Publication date Jul 3, 2025
- Merck Patent GmbH
- Eric JACQUINOT
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polycationic Polymer Or Copolymer Having Different Cation Types For...
- Publication number 20250215130
- Publication date Jul 3, 2025
- Merck Patent GmbH
- GREGOR LARBIG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20250205847
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local Gate Height Tuning by CMP And Dummy Gate Design
- Publication number 20250204017
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Using Amino-Polyorganosiloxane-Co...
- Publication number 20250197703
- Publication date Jun 19, 2025
- VERSUM MATERIALS US, LLC
- Gerhard Jonschker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250204011
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Seongdong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20250192026
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL SOLUTION, ETCHING METHOD, AND METHOD FOR MANUFACTURING SEM...
- Publication number 20250183049
- Publication date Jun 5, 2025
- KIOXIA Corporation
- Hakuba KITAGAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR ENABLING CHEMICAL MECHANICAL POLISHING AND BONDING OF A...
- Publication number 20250183037
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Maria Gorchichko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY
- Publication number 20250183177
- Publication date Jun 5, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhongwang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stable Chemical Mechanical Planarization Polishing Compositions And...
- Publication number 20250171658
- Publication date May 29, 2025
- VERSUM MATERIALS US, LLC
- Maitland Graham
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250169140
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Removal of an Etching Stop Layer for Improving Overlay Sh...
- Publication number 20250167002
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...
- Publication number 20250145857
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND MANUFACTURING M...
- Publication number 20250145860
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...
- Publication number 20250136842
- Publication date May 1, 2025
- SK enpulse Co., Ltd.
- Han Teo PARK
- B24 - GRINDING POLISHING
Information Patent Application
PLANARIZATION METHOD
- Publication number 20250132168
- Publication date Apr 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...
- Publication number 20250132258
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH INTERSECTIONS
- Publication number 20250133780
- Publication date Apr 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250129267
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Yoonseok KO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20250126883
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...
- Publication number 20250122408
- Publication date Apr 17, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Yuta SHIMADA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...
- Publication number 20250125185
- Publication date Apr 17, 2025
- National Cheng Kung University
- Shih-kang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLI...
- Publication number 20250115785
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Wonki HUR
- B24 - GRINDING POLISHING

by chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemical mechanical polishing solution

Substrate cleaning apparatus, substrate processing apparatus, subst...

Liquid dispersion and powder of cerium based core-shell particles,...

Composition and method for polishing and integrated circuit

Semiconductor device and method for forming the same

Polishing pad and method for preparing semiconductor device using t...

Methods of performing chemical-mechanical polishing process in semi...

Chemical mechanical polishing of substrates containing copper and r...

Replacement buried power rail in backside power delivery

Resistor within a via

Semiconductor structure and fabrication method thereof

Nitride inhibitors for high selectivity of TiN—SiN CMP applications

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing a semiconductor de...

Chemical mechanical polish slurry and method of manufacture

Contact with a silicide region

Photoelectric fluid field cluster catalytic method for atomic-scale...

Polishing compositions and methods of using the same

Liner structures

Slurry composition for chemical mechanical polishing

Displacement measurements in semiconductor wafer processing

Graphene barrier layer for reduced contact resistance

CMP slurry composition for polishing polycrystalline silicon and po...

Methods for processing semiconductor wafers having a polycrystallin...

Method for manufacturing a semiconductor device having a dummy section

Ferroelectric MFM capacitor array and methods of making the same

Chemical mechanical polishing method

Apparatus and method for CMP temperature control

Process and structure for source/drain contacts

Slurry composition and method for polishing and integrated circuit

Patents Applicationslast 30 patents

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION

NEGATIVELY CHARGED SILICA PARTICLES, METHOD OF PRODUCING SUCH PARTI...

Polycationic Polymer Or Copolymer Having Different Cation Types For...

METHOD FOR CMP TEMPERATURE CONTROL

Local Gate Height Tuning by CMP And Dummy Gate Design

Chemical Mechanical Planarization Using Amino-Polyorganosiloxane-Co...

SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME

Metal-Insulator-Metal Structure

CHEMICAL SOLUTION, ETCHING METHOD, AND METHOD FOR MANUFACTURING SEM...

METHODS FOR ENABLING CHEMICAL MECHANICAL POLISHING AND BONDING OF A...

CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY

Stable Chemical Mechanical Planarization Polishing Compositions And...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Selective Removal of an Etching Stop Layer for Improving Overlay Sh...

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND MANUFACTURING M...

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...

PLANARIZATION METHOD

PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...

DEEP TRENCH INTERSECTIONS

POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Structure Cutting Process and Structures Formed Thereby

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...

METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...

SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLI...