by chemical mechanical polishing [CMP]

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CPC
H01L21/3212

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3212by chemical mechanical polishing [CMP]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contact resistance between via and conductive line
- Patent number 12,266,566
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition, polishing method, and method for manufacturi...
- Patent number 12,258,492
- Issue date Mar 25, 2025
- Fujimi Incorporated
- Jingzhi Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device
- Patent number 12,261,228
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chung Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry compositions for chemical mechanical planarization
- Patent number 12,261,055
- Issue date Mar 25, 2025
- TAIWAN SSEMICONDUCTOR MANUFACTURING CO., LTD.
- An-Hsuan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Local gate height tuning by CMP and dummy gate design
- Patent number 12,243,782
- Issue date Mar 4, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING C0., LTD.
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical solution, etching method, and method for manufacturing sem...
- Patent number 12,243,751
- Issue date Mar 4, 2025
- Kioxia Corporation
- Hakuba Kitagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,237,398
- Issue date Feb 25, 2025
- United Microelectronics Corp.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP composition including anionic and cationic inhibitors
- Patent number 12,234,382
- Issue date Feb 25, 2025
- CMC MATERIALS LLC
- Hsin-Yen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dishing oxide CMP polishing compositions for shallow trench iso...
- Patent number 12,234,383
- Issue date Feb 25, 2025
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 12,218,247
- Issue date Feb 4, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal gate and poly gate
- Patent number 12,217,975
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled substrate carrier and polishing components
- Patent number 12,217,979
- Issue date Feb 4, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 12,211,700
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-damage-resistant interconnect structure and methods for form...
- Patent number 12,205,901
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atmospheric plasma in wafer processing system optimization
- Patent number 12,198,935
- Issue date Jan 14, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,191,143
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head membrane with regions of different roughness
- Patent number 12,172,264
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Young J. Paik
- B24 - GRINDING POLISHING
Information Patent Grant
Embedded metal lines
- Patent number 12,170,268
- Issue date Dec 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays drivers
- Patent number 12,166,024
- Issue date Dec 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metal gate devices and resulting structures
- Patent number 12,159,916
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for polysilicon CMP
- Patent number 12,157,834
- Issue date Dec 3, 2024
- CMC MATERIALS LLC
- Sarah Brosnan
- B24 - GRINDING POLISHING
Information Patent Grant
Ferroelectric MFM capacitor array and methods of making the same
- Patent number 12,154,938
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry composition for polishing tungsten pattern wafer and met...
- Patent number 12,139,642
- Issue date Nov 12, 2024
- Samsung SDI Co., Ltd.
- Eui Rang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of modifying portions of layer stacks
- Patent number 12,142,487
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURI...
- Publication number 20250109319
- Publication date Apr 3, 2025
- FUJIMI INCORPORATED
- Masashi ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING...
- Publication number 20250112050
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Hao JHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250113538
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- YI CHEN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-CHEMICAL MECHANICAL POLISHING CLEANING COMPOSITION, POST-CHEMI...
- Publication number 20250109353
- Publication date Apr 3, 2025
- Fujimi Incorporated
- Takahiro ITO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
- Publication number 20250101263
- Publication date Mar 27, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Eric Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS
- Publication number 20250105234
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP POLISHING SOLUTION, STORAGE SOLUTION, AND POLISHING METHOD
- Publication number 20250101260
- Publication date Mar 27, 2025
- Resonac Corporation
- Keisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND METHOD FOR POLISHING SUBSTRATE USING THE...
- Publication number 20250084281
- Publication date Mar 13, 2025
- Fujimi Incorporated
- Shogo ONISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TITANIUM OXIDE-BASED CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR...
- Publication number 20250075104
- Publication date Mar 6, 2025
- Entegris, Inc.
- Alex Villani-Gale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING
- Publication number 20250062163
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054764
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- KE-JING YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL LINES
- Publication number 20250038152
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...
- Publication number 20250038008
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsiang Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20250038161
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten Chemical Mechanical Polishing Slurries
- Publication number 20250019568
- Publication date Jan 16, 2025
- VERSUM MATERIALS US, LLC
- MATTHIAS STENDER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS
- Publication number 20250022870
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250011624
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Hyune Jea LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING
- Publication number 20250006518
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...
- Publication number 20240425723
- Publication date Dec 26, 2024
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Publication number 20240420978
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
- Publication number 20240417595
- Publication date Dec 19, 2024
- FUJIMI INCORPORATED
- Tzu-Chun TSENG
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404870
- Publication date Dec 5, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsung-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...
- Publication number 20240399535
- Publication date Dec 5, 2024
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...
- Publication number 20240400861
- Publication date Dec 5, 2024
- VERSUM MATERIALS US, LLC
- Gregor Larbig
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
- Publication number 20240392214
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Naotsugu MURO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

by chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact resistance between via and conductive line

Polishing composition, polishing method, and method for manufacturi...

Semiconductor device

Slurry compositions for chemical mechanical planarization

Local gate height tuning by CMP and dummy gate design

Chemical solution, etching method, and method for manufacturing sem...

Semiconductor device and method for fabricating the same

CMP composition including anionic and cationic inhibitors

Low dishing oxide CMP polishing compositions for shallow trench iso...

Metal-insulator-metal structure

Metal heterojunction structure with capping metal layer

Semiconductor device and manufacturing method of the semiconductor...

Semiconductor device having metal gate and poly gate

Temperature controlled substrate carrier and polishing components

Deep trench intersections

Semiconductor structure cutting process and structures formed thereby

Selective removal of an etching stop layer for improving overlay sh...

Plasma-damage-resistant interconnect structure and methods for form...

Semiconductor device and a manufacturing method thereof

Method of direct-bonded optoelectronic devices

Atmospheric plasma in wafer processing system optimization

Semiconductor device and method for forming the same

Carrier head membrane with regions of different roughness

Embedded metal lines

Direct-bonded LED arrays drivers

Method for fabricating metal gate devices and resulting structures

Composition and method for polysilicon CMP

Ferroelectric MFM capacitor array and methods of making the same

CMP slurry composition for polishing tungsten pattern wafer and met...

Methods of modifying portions of layer stacks

Patents Applicationslast 30 patents

POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURI...

POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POST-CHEMICAL MECHANICAL POLISHING CLEANING COMPOSITION, POST-CHEMI...

POLISHING COMPOSITIONS AND METHODS OF USE THEREOF

DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS

CMP POLISHING SOLUTION, STORAGE SOLUTION, AND POLISHING METHOD

POLISHING COMPOSITION AND METHOD FOR POLISHING SUBSTRATE USING THE...

TITANIUM OXIDE-BASED CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR...

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED METAL LINES

METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...

DIRECT-BONDED OPTOELECTRONIC DEVICES

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

Tungsten Chemical Mechanical Polishing Slurries

SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...

RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING

POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT