by chemical mechanical polishing [CMP]

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CPC
H01L21/3212

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3212by chemical mechanical polishing [CMP]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 12,211,700
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-damage-resistant interconnect structure and methods for form...
- Patent number 12,205,901
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atmospheric plasma in wafer processing system optimization
- Patent number 12,198,935
- Issue date Jan 14, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,191,143
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head membrane with regions of different roughness
- Patent number 12,172,264
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Young J. Paik
- B24 - GRINDING POLISHING
Information Patent Grant
Embedded metal lines
- Patent number 12,170,268
- Issue date Dec 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays drivers
- Patent number 12,166,024
- Issue date Dec 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metal gate devices and resulting structures
- Patent number 12,159,916
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for polysilicon CMP
- Patent number 12,157,834
- Issue date Dec 3, 2024
- CMC MATERIALS LLC
- Sarah Brosnan
- B24 - GRINDING POLISHING
Information Patent Grant
Ferroelectric MFM capacitor array and methods of making the same
- Patent number 12,154,938
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry composition for polishing tungsten pattern wafer and met...
- Patent number 12,139,642
- Issue date Nov 12, 2024
- Samsung SDI Co., Ltd.
- Eui Rang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of modifying portions of layer stacks
- Patent number 12,142,487
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention structure embedded in a gate electrode
- Patent number 12,142,488
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 12,136,574
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pit-less chemical mechanical planarization process and device struc...
- Patent number 12,131,915
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Polishing composition for semiconductor process and method for manu...
- Patent number 12,116,503
- Issue date Oct 15, 2024
- SK ENPULSE CO., LTD.
- Seung Chul Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-stopping polishing composition and method for high topological...
- Patent number 12,116,502
- Issue date Oct 15, 2024
- CMC MATERIALS LLC
- Juyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for semiconductor processing and method of fabricating...
- Patent number 12,110,421
- Issue date Oct 8, 2024
- SK ENPULSE CO., LTD.
- Seung Chul Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for chemical-mechanical polishing and chemical-mechanic...
- Patent number 12,104,087
- Issue date Oct 1, 2024
- JSR Corporation
- Yuuya Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and structure for metal gates
- Patent number 12,100,627
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Huang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnection structure and method for forming the same
- Patent number 12,100,652
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zhang-Ying Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing slurry and use thereof
- Patent number 12,098,299
- Issue date Sep 24, 2024
- Anji Microelectronics (Shanghai) Co., Ltd.
- Wenting Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Platen rotation device
- Patent number 12,090,602
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bruce Cho
- B24 - GRINDING POLISHING
Information Patent Grant
Butted contacts and methods of fabricating the same in semiconducto...
- Patent number 12,094,942
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-up wafer electrochemical planarization apparatus
- Patent number 12,090,600
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device having inter-metal dielectric patterns and met...
- Patent number 12,094,820
- Issue date Sep 17, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Bin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-healing polishing pad
- Patent number 12,087,590
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Kung
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED METAL LINES
- Publication number 20250038152
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...
- Publication number 20250038008
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsiang Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20250038161
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten Chemical Mechanical Polishing Slurries
- Publication number 20250019568
- Publication date Jan 16, 2025
- VERSUM MATERIALS US, LLC
- MATTHIAS STENDER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS
- Publication number 20250022870
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250011624
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Hyune Jea LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING
- Publication number 20250006518
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...
- Publication number 20240425723
- Publication date Dec 26, 2024
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Publication number 20240420978
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
- Publication number 20240417595
- Publication date Dec 19, 2024
- FUJIMI INCORPORATED
- Tzu-Chun TSENG
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404870
- Publication date Dec 5, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsung-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...
- Publication number 20240399535
- Publication date Dec 5, 2024
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...
- Publication number 20240400861
- Publication date Dec 5, 2024
- VERSUM MATERIALS US, LLC
- Gregor Larbig
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
- Publication number 20240392214
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Naotsugu MURO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...
- Publication number 20240395610
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE
- Publication number 20240395562
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD,...
- Publication number 20240392162
- Publication date Nov 28, 2024
- Resonac Corporation
- Shogo ARATA
- B24 - GRINDING POLISHING
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240387658
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES
- Publication number 20240387678
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE
- Publication number 20240387191
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383100
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20240379379
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240379595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION
- Publication number 20240379358
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsong-Hua Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS
- Publication number 20240379775
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Huan Jao
- H01 - BASIC ELECTRIC ELEMENTS

by chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective removal of an etching stop layer for improving overlay sh...

Plasma-damage-resistant interconnect structure and methods for form...

Semiconductor device and a manufacturing method thereof

Method of direct-bonded optoelectronic devices

Atmospheric plasma in wafer processing system optimization

Semiconductor device and method for forming the same

Carrier head membrane with regions of different roughness

Embedded metal lines

Direct-bonded LED arrays drivers

Method for fabricating metal gate devices and resulting structures

Composition and method for polysilicon CMP

Ferroelectric MFM capacitor array and methods of making the same

CMP slurry composition for polishing tungsten pattern wafer and met...

Methods of modifying portions of layer stacks

Dishing prevention structure embedded in a gate electrode

Technique for training neural network for use in in-situ monitoring...

Semiconductor structure cutting process and structures formed thereby

Pit-less chemical mechanical planarization process and device struc...

Polishing composition for semiconductor process and method for manu...

Self-stopping polishing composition and method for high topological...

Composition for semiconductor processing and method of fabricating...

Composition for chemical-mechanical polishing and chemical-mechanic...

Method and structure for metal gates

Multilevel interconnection structure and method for forming the same

Chemical mechanical polishing slurry and use thereof

Platen rotation device

Butted contacts and methods of fabricating the same in semiconducto...

Face-up wafer electrochemical planarization apparatus

Semiconductor device having inter-metal dielectric patterns and met...

Self-healing polishing pad

Patents Applicationslast 30 patents

EMBEDDED METAL LINES

METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING A...

DIRECT-BONDED OPTOELECTRONIC DEVICES

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

Tungsten Chemical Mechanical Polishing Slurries

SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...

RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING

POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...

Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...

CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE

POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD,...

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES

DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE

VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION

PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS