by chemical mechanical polishing [CMP]

Industry

CPC
H01L21/3212

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3212by chemical mechanical polishing [CMP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ferroelectric MFM capacitor array and methods of making the same
- Patent number 12,154,938
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of modifying portions of layer stacks
- Patent number 12,142,487
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry composition for polishing tungsten pattern wafer and met...
- Patent number 12,139,642
- Issue date Nov 12, 2024
- Samsung SDI Co., Ltd.
- Eui Rang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention structure embedded in a gate electrode
- Patent number 12,142,488
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 12,136,574
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pit-less chemical mechanical planarization process and device struc...
- Patent number 12,131,915
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Polishing composition for semiconductor process and method for manu...
- Patent number 12,116,503
- Issue date Oct 15, 2024
- SK ENPULSE CO., LTD.
- Seung Chul Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-stopping polishing composition and method for high topological...
- Patent number 12,116,502
- Issue date Oct 15, 2024
- CMC MATERIALS LLC
- Juyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for semiconductor processing and method of fabricating...
- Patent number 12,110,421
- Issue date Oct 8, 2024
- SK ENPULSE CO., LTD.
- Seung Chul Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for chemical-mechanical polishing and chemical-mechanic...
- Patent number 12,104,087
- Issue date Oct 1, 2024
- JSR Corporation
- Yuuya Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and structure for metal gates
- Patent number 12,100,627
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Huang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing slurry and use thereof
- Patent number 12,098,299
- Issue date Sep 24, 2024
- Anji Microelectronics (Shanghai) Co., Ltd.
- Wenting Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilevel interconnection structure and method for forming the same
- Patent number 12,100,652
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zhang-Ying Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platen rotation device
- Patent number 12,090,602
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bruce Cho
- B24 - GRINDING POLISHING
Information Patent Grant
Butted contacts and methods of fabricating the same in semiconducto...
- Patent number 12,094,942
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-up wafer electrochemical planarization apparatus
- Patent number 12,090,600
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device having inter-metal dielectric patterns and met...
- Patent number 12,094,820
- Issue date Sep 17, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Bin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-healing polishing pad
- Patent number 12,087,590
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Kung
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,076,831
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of semiconductor structure and semiconductor s...
- Patent number 12,080,758
- Issue date Sep 3, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Weichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide for group III-nitride devices and methods of fabrication
- Patent number 12,080,763
- Issue date Sep 3, 2024
- Intel Corporation
- Sansaptak Dasgupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition, production method of the same, polishing met...
- Patent number 12,077,680
- Issue date Sep 3, 2024
- Fujimi Incorporated
- Akiko Soumiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for gate electrodes
- Patent number 12,080,779
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing compositions for reduced defectivity and methods of using...
- Patent number 12,065,587
- Issue date Aug 20, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- James McDonough
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,068,163
- Issue date Aug 20, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,068,169
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried connection line for peripheral area of a memory device
- Patent number 12,063,797
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Kyuseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
- Publication number 20240392214
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Naotsugu MURO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...
- Publication number 20240395610
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD,...
- Publication number 20240392162
- Publication date Nov 28, 2024
- Resonac Corporation
- Shogo ARATA
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE
- Publication number 20240395562
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240387658
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES
- Publication number 20240387678
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE
- Publication number 20240387191
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383100
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20240379379
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240379595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION
- Publication number 20240379358
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsong-Hua Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS
- Publication number 20240379775
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Huan Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATEN ROTATION DEVICE
- Publication number 20240367286
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce CHO
- B24 - GRINDING POLISHING
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING POLISHING PAD
- Publication number 20240371648
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240371869
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20240363404
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240363361
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR METAL GATES
- Publication number 20240363441
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-HUANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Source and Drain Structures in Semiconductor Devices
- Publication number 20240363749
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240363447
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
CAPPING LAYER FOR GUIDE ELECTRODES
- Publication number 20240363726
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP COMPOSITION INCLUDING ANIONIC AND CATIONIC INHIBITORS
- Publication number 20240352280
- Publication date Oct 24, 2024
- CMC Materials LLC
- Hsin-Yen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES
- Publication number 20240352279
- Publication date Oct 24, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
- Publication number 20240347339
- Publication date Oct 17, 2024
- Syrnatec, Inc.
- Yash Suresh Mirchandani
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332344
- Publication date Oct 3, 2024
- Kabushiki Kaisha Toshiba
- Masaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240334847
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLI...
- Publication number 20240327677
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Liao
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SE...
- Publication number 20240318039
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Yearin BYUN
- H01 - BASIC ELECTRIC ELEMENTS

by chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ferroelectric MFM capacitor array and methods of making the same

Methods of modifying portions of layer stacks

CMP slurry composition for polishing tungsten pattern wafer and met...

Dishing prevention structure embedded in a gate electrode

Technique for training neural network for use in in-situ monitoring...

Semiconductor structure cutting process and structures formed thereby

Pit-less chemical mechanical planarization process and device struc...

Polishing composition for semiconductor process and method for manu...

Self-stopping polishing composition and method for high topological...

Composition for semiconductor processing and method of fabricating...

Composition for chemical-mechanical polishing and chemical-mechanic...

Method and structure for metal gates

Chemical mechanical polishing slurry and use thereof

Multilevel interconnection structure and method for forming the same

Platen rotation device

Butted contacts and methods of fabricating the same in semiconducto...

Face-up wafer electrochemical planarization apparatus

Semiconductor device having inter-metal dielectric patterns and met...

Self-healing polishing pad

Chemical mechanical polishing apparatus and method

Manufacturing method of semiconductor structure and semiconductor s...

Silicide for group III-nitride devices and methods of fabrication

Barrier-less structures

Polishing composition, production method of the same, polishing met...

Capping layer for gate electrodes

Polishing compositions for reduced defectivity and methods of using...

Method for forming semiconductor structure

Semiconductor processing tool and methods of operation

Buried connection line for peripheral area of a memory device

Substrate processing apparatus, substrate processing system, and su...

Patents Applicationslast 30 patents

COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...

POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD,...

CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES

DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE

VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION

PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS

PLATEN ROTATION DEVICE

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

SELF-HEALING POLISHING PAD

Semiconductor Structure Cutting Process and Structures Formed Thereby

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

METHOD AND STRUCTURE FOR METAL GATES

Asymmetric Source and Drain Structures in Semiconductor Devices

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

CAPPING LAYER FOR GUIDE ELECTRODES

CMP COMPOSITION INCLUDING ANIONIC AND CATIONIC INHIBITORS

PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES

COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

VIA STRUCTURE AND METHODS OF FORMING THE SAME

CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLI...

CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SE...