by chemical mechanical polishing [CMP]

Industry

CPC
H01L21/3212

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3212by chemical mechanical polishing [CMP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive element for semiconductor devices
- Patent number 11,955,380
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual hydrogen barrier layer for trench capacitors integrated with l...
- Patent number 11,955,512
- Issue date Apr 9, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage polysilicon gate in high-K metal gate device
- Patent number 11,950,413
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around device with protective dielectric layer and method...
- Patent number 11,948,989
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory with improved fill-in window
- Patent number 11,943,921
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for BEOL metal to dielectric adhesion
- Patent number 11,942,324
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Qintao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inhibitor for RuO4 gas generation and method for inhibiting RuO4 ga...
- Patent number 11,932,590
- Issue date Mar 19, 2024
- Tokuyama Corporation
- Tomoaki Sato
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,931,854
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, process for preparing the same, and process for prep...
- Patent number 11,931,856
- Issue date Mar 19, 2024
- SK ENPULSE CO., LTD.
- Sunghoon Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor memory and method of manufacturing the same
- Patent number 11,937,437
- Issue date Mar 19, 2024
- Kioxia Corporation
- Masahiro Kiyotoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable substrate chuck
- Patent number 11,931,857
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Resistor within a via
- Patent number 11,935,829
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,929,213
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SAG nanowire growth with a planarization process
- Patent number 11,929,253
- Issue date Mar 12, 2024
- Microsoft Technology Licensing, LLC
- Geoffrey C. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing solution, polishing solution set, polishing method, and d...
- Patent number 11,926,764
- Issue date Mar 12, 2024
- Resonac Corporation
- Masayuki Hanano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,929,424
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,929,366
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Sunyoung Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,929,419
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing composite article
- Patent number 11,911,871
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Chou Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor chip, and kit
- Patent number 11,914,300
- Issue date Feb 27, 2024
- FUJIFILM Corporation
- Tetsuya Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation method and related structure
- Patent number 11,915,971
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for insitu adjustment of wafer slip detection...
- Patent number 11,904,431
- Issue date Feb 20, 2024
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Stacked connections in 3D memory and methods of making the same
- Patent number 11,910,602
- Issue date Feb 20, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITIONS AND METHODS OF USE THEREOF
- Publication number 20240141205
- Publication date May 2, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Ting-Kai Huang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Embedded Flash Memory Device with Floating Gate Embedded in a Subst...
- Publication number 20240147716
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-DISHING STRUCTURE FOR EMBEDDED MEMORY
- Publication number 20240147718
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING S...
- Publication number 20240145254
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
- Publication number 20240124744
- Publication date Apr 18, 2024
- Hooi-Sung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...
- Publication number 20240116152
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240109163
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113112
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING PADS WITH A DISULFIDE BRIDGE
- Publication number 20240100648
- Publication date Mar 28, 2024
- CMC Materials LLC
- Jaeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL GATE AND POLY GATE
- Publication number 20240096643
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Alexander KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-VT SOLUTION FOR REPLACEMENT METAL GATE BONDED STACKED FET
- Publication number 20240096887
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Ruqiang BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY
- Publication number 20240096700
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICO...
- Publication number 20240090194
- Publication date Mar 14, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yuichi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20240087963
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Akira FUKUNAGA
- B24 - GRINDING POLISHING
Information Patent Application
FORMING A PARTIALLY SILICIDED ELEMENT
- Publication number 20240087886
- Publication date Mar 14, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20240063199
- Publication date Feb 22, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SUBSTRATE OR SUBSTRATE PROCESSING METHOD
- Publication number 20240055487
- Publication date Feb 15, 2024
- National Central University
- Tien-Hsi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240047379
- Publication date Feb 8, 2024
- Infineon Technologies Austria AG
- Norbert Labrenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ruthenium CMP Chemistry Based On Halogenation
- Publication number 20240043721
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Paul Abel
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURI...
- Publication number 20240043720
- Publication date Feb 8, 2024
- Fujimi Incorporated
- Jingzhi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHOD FOR CONDUCTING A MATERIAL REMOVING OPERATION
- Publication number 20240038543
- Publication date Feb 1, 2024
- Saint-Gobain Ceramics & Plastics, Inc.
- Renjie ZHOU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING POLISHING COMPOS...
- Publication number 20240030041
- Publication date Jan 25, 2024
- SK enpulse Co., Ltd.
- Han Teo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING HEIGHT DIFFERENCE BETWEEN GATES
- Publication number 20240021434
- Publication date Jan 18, 2024
- Shanghai Huali Integrated Circuit Corporation
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR TRAINING NEURAL NETWORK FOR USE IN IN-SITU MONITORING...
- Publication number 20240014080
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240014035
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Zhi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD FOR HOLDING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240006204
- Publication date Jan 4, 2024
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Planarization (CMP) For Copper And Through-Sili...
- Publication number 20240006189
- Publication date Jan 4, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
- Publication number 20240002696
- Publication date Jan 4, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Carl Ballesteros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING OF SUBSTRATES CONTAINING COPPER AND R...
- Publication number 20240002698
- Publication date Jan 4, 2024
- BASF SE
- Haci Osman GUEVENC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING OF SUBSTRATES CONTAINING COPPER AND R...
- Publication number 20230416570
- Publication date Dec 28, 2023
- BASF SE
- Haci Osman GUEVENC
- H01 - BASIC ELECTRIC ELEMENTS

by chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Methods of forming interconnect structures in semiconductor fabrica...

Via for semiconductor device connection and methods of forming the...

Parallel-connected trench capacitor structure with multiple electro...

Conductive element for semiconductor devices

Dual hydrogen barrier layer for trench capacitors integrated with l...

High voltage polysilicon gate in high-K metal gate device

Methods and apparatus for forming dual metal interconnects

Gate-all-around device with protective dielectric layer and method...

Semiconductor package and method

Embedded memory with improved fill-in window

Method for BEOL metal to dielectric adhesion

Inhibitor for RuO4 gas generation and method for inhibiting RuO4 ga...

Chemical mechanical polishing using time share control

Polishing pad, process for preparing the same, and process for prep...

Semiconductor memory and method of manufacturing the same

Deformable substrate chuck

Resistor within a via

Parallel-connected trench capacitor structure with multiple electro...

SAG nanowire growth with a planarization process

Via connection to a partially filled trench

Polishing solution, polishing solution set, polishing method, and d...

Semiconductor device and method for forming the same

Semiconductor device

Semiconductor device

Method of manufacturing composite article

Manufacturing method of semiconductor chip, and kit

Contact formation method and related structure

Method and apparatus for insitu adjustment of wafer slip detection...

Stacked connections in 3D memory and methods of making the same

Patents Applicationslast 30 patents

COMPOSITIONS AND METHODS OF USE THEREOF

Embedded Flash Memory Device with Floating Gate Embedded in a Subst...

ANTI-DISHING STRUCTURE FOR EMBEDDED MEMORY

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING S...

POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...

METHOD FOR CMP TEMPERATURE CONTROL

Semiconductor Structure Cutting Process and Structures Formed Thereby

CHEMICAL MECHANICAL POLISHING PADS WITH A DISULFIDE BRIDGE

SEMICONDUCTOR DEVICE HAVING METAL GATE AND POLY GATE

MULTI-VT SOLUTION FOR REPLACEMENT METAL GATE BONDED STACKED FET

SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY

CAPACITOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICO...

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

FORMING A PARTIALLY SILICIDED ELEMENT

DIRECT-BONDED OPTOELECTRONIC DEVICES

SILICON CARBIDE SUBSTRATE OR SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

Ruthenium CMP Chemistry Based On Halogenation

POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURI...

COMPOSITION AND METHOD FOR CONDUCTING A MATERIAL REMOVING OPERATION

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING POLISHING COMPOS...

METHOD FOR IMPROVING HEIGHT DIFFERENCE BETWEEN GATES

TECHNIQUE FOR TRAINING NEURAL NETWORK FOR USE IN IN-SITU MONITORING...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

HEAD FOR HOLDING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS

Chemical Mechanical Planarization (CMP) For Copper And Through-Sili...

POLISHING COMPOSITIONS AND METHODS OF USE THEREOF

CHEMICAL MECHANICAL POLISHING OF SUBSTRATES CONTAINING COPPER AND R...

CHEMICAL MECHANICAL POLISHING OF SUBSTRATES CONTAINING COPPER AND R...