by contacting the layer with gases, liquids or plasmas

Industry

CPC
H01L21/76826

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76826by contacting the layer with gases, liquids or plasmas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayer for selective deposition
- Patent number 11,967,523
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 11,942,362
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer in integrated circuits
- Patent number 11,942,419
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,935,835
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silyl pseudohalides for silicon containing films
- Patent number 11,932,940
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Keenan N. Woods
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and device manufactured by using the same
- Patent number 11,908,733
- Issue date Feb 20, 2024
- ASM IP Holding B.V.
- Yoon Ki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device including stair step st...
- Patent number 11,903,211
- Issue date Feb 13, 2024
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,901,437
- Issue date Feb 13, 2024
- Marlin Semiconductor Limited
- Te-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer seal material for air gaps in semiconductor devices
- Patent number 11,901,220
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck device
- Patent number 11,887,877
- Issue date Jan 30, 2024
- Sumitomo Osaka Cement Co., Ltd.
- Mamoru Kosakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and display device including the same
- Patent number 11,862,454
- Issue date Jan 2, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 11,791,154
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs for semiconductor device
- Patent number 11,756,864
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of via opening
- Patent number 11,749,732
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric layer
- Patent number 11,749,563
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multi-layer diffusion barrier and met...
- Patent number 11,742,393
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin Field-Effect Transistor device and method of forming the same
- Patent number 11,728,215
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal process chamber lid with backside pumping
- Patent number 11,715,667
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Anqing Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controllable metal and barrier-liner recess
- Patent number 11,705,366
- Issue date Jul 18, 2023
- Micromaterials LLC
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition on non-metallic surfaces
- Patent number 11,680,313
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,670,546
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 11,664,272
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a porous low-k structure
- Patent number 11,637,010
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for manufacturing the interconnec...
- Patent number 11,637,062
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Khaderbad Mrunal Abhijith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 11,621,190
- Issue date Apr 4, 2023
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 11,615,984
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor device and methods of fabr...
- Patent number 11,610,841
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ta Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 11,600,521
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240147727
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...
- Publication number 20240145302
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shien SHIAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Via With Improved Gap Filling Performance
- Publication number 20240071813
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240063126
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN GAP FILL WITH HYDROGEN PLASMA TREATMENT
- Publication number 20240047267
- Publication date Feb 8, 2024
- Tsung-Han YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047270
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MATERIAL IN M...
- Publication number 20240038528
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240021501
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...
- Publication number 20230411209
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cyclic Spin-On Coating Process for Forming Dielectric Material
- Publication number 20230411150
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230387221
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE PROCESS AND RELATED STRUCTURE
- Publication number 20230386920
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20230377955
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20230369106
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230369105
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- LI-HAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230369104
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- LI-HAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF VIA OPENING
- Publication number 20230361185
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...
- Publication number 20230343643
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING
- Publication number 20230335434
- Publication date Oct 19, 2023
- Applied Materials, Inc.
- Anqing Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20230298934
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Layers Having Nitrogen-Containing Crusted Surfaces
- Publication number 20230290674
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Jung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230274975
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE INTERCONNEC...
- Publication number 20230268268
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- KHADERBAD MRUNAL ABHIJITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230268276
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Sang Hoon AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE DIFFUSION BARRIERS
- Publication number 20230260834
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Lee J. BROGAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
System And Method Of Forming A Porous Low-K Structure
- Publication number 20230260781
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20230238278
- Publication date Jul 27, 2023
- InnoLux Corporation
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230215765
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-NAN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Modification Layer for Conductive Feature Formation
- Publication number 20230207384
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA IN SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230197515
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jui HUANG
- H01 - BASIC ELECTRIC ELEMENTS

by contacting the layer with gases, liquids or plasmas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Self-assembled monolayer for selective deposition

Surface modification layer for conductive feature formation

Etch stop layer in integrated circuits

Methods of manufacturing semiconductor devices

Silyl pseudohalides for silicon containing films

Substrate processing method and device manufactured by using the same

Methods of forming a microelectronic device including stair step st...

Semiconductor device and method for fabricating the same

Bilayer seal material for air gaps in semiconductor devices

Interconnect structures and methods of fabrication

Electrostatic chuck device

Semiconductor device and display device including the same

Cyclic spin-on coating process for forming dielectric material

Contact plugs for semiconductor device

Etch profile control of via opening

Interlayer dielectric layer

Semiconductor device having a multi-layer diffusion barrier and met...

Fin Field-Effect Transistor device and method of forming the same

Thermal process chamber lid with backside pumping

Methods for controllable metal and barrier-liner recess

Selective deposition on non-metallic surfaces

Semiconductor structure and manufacturing method thereof

Etch profile control of gate contact opening

System and method of forming a porous low-k structure

Interconnect structure and method for manufacturing the interconnec...

Method for filling recessed features in semiconductor devices with...

Method of dielectric material fill and treatment

Interconnect structure for semiconductor device and methods of fabr...

Surface modification layer for conductive feature formation

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...

Conductive Via With Improved Gap Filling Performance

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

TUNGSTEN GAP FILL WITH HYDROGEN PLASMA TREATMENT

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MATERIAL IN M...

CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...

Cyclic Spin-On Coating Process for Forming Dielectric Material

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METAL GATE PROCESS AND RELATED STRUCTURE

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

INTERLAYER DIELECTRIC LAYER

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ETCH PROFILE CONTROL OF VIA OPENING

GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...

THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

Dielectric Layers Having Nitrogen-Containing Crusted Surfaces

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE INTERCONNEC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METAL OXIDE DIFFUSION BARRIERS

System And Method Of Forming A Porous Low-K Structure

MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Surface Modification Layer for Conductive Feature Formation

VIA IN SEMICONDUCTOR DEVICE STRUCTURE