by conversion of the surface of the metal

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CPC
H05K3/385

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/385by conversion of the surface of the metal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for increasing adhesion strength between a surface of copper...
- Patent number 11,963,308
- Issue date Apr 16, 2024
- Atotech Deutschland GmbH & Co. KG
- Norbert Lützow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite copper foil
- Patent number 11,781,236
- Issue date Oct 10, 2023
- Namics Corporation
- Makiko Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and semiconductor apparatus
- Patent number 10,743,412
- Issue date Aug 11, 2020
- Shin-Etsu Chemical Co., Ltd.
- Saiko Akahane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical substrate and transparent routing of light sources
- Patent number 10,718,886
- Issue date Jul 21, 2020
- Facebook Technologies, LLC
- Robin Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board package and display device including the same
- Patent number 10,705,393
- Issue date Jul 7, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board package and display device including the same
- Patent number 10,539,842
- Issue date Jan 21, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a printed circuit board
- Patent number 10,477,700
- Issue date Nov 12, 2019
- Atotech Deutschland GmbH
- Wonjin Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for circuit board based on copper ceramic subs...
- Patent number 10,383,236
- Issue date Aug 13, 2019
- Shunsin Technology (Zhong Shan) Limited
- Fei Ren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 10,375,835
- Issue date Aug 6, 2019
- Atotech Deutchland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Roughened copper foil, copper clad laminate, and printed circuit board
- Patent number 10,280,501
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Satoshi Mogi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Production method for copper-clad laminate plate
- Patent number 10,244,635
- Issue date Mar 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil provided with carrier foil, manufacturing method of the...
- Patent number 10,212,814
- Issue date Feb 19, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Kazuhiro Yoshikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,051,746
- Issue date Aug 14, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing
- Patent number 9,956,756
- Issue date May 1, 2018
- J P Imaging Limited
- John David Adamson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of treating copper surfaces for enhancing adhesion to organ...
- Patent number 9,795,040
- Issue date Oct 17, 2017
- Namics Corporation
- Jen-Chieh Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 9,763,336
- Issue date Sep 12, 2017
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Relating to printing
- Patent number 9,586,392
- Issue date Mar 7, 2017
- J P Imaging Limited
- John David Adamson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of printing using a reimageable printing plate with an alumi...
- Patent number 9,545,785
- Issue date Jan 17, 2017
- J P Imaging Limited
- John David Adamson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,526,169
- Issue date Dec 20, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Gi Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming articles including metal structures having maxim...
- Patent number 9,468,986
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES, INC.
- Ernesto Gene de la Garza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating copper surfaces for enhancing adhesion to organ...
- Patent number 9,345,149
- Issue date May 17, 2016
- eSionic Corp.
- Jen-Chieh Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,161,460
- Issue date Oct 13, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Gi Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum alloy composite and method for joining thereof
- Patent number 8,932,719
- Issue date Jan 13, 2015
- Taisei PLas Co., Ltd.
- Masanori Naritomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the manufacture of double-sided metalized ceramic substr...
- Patent number 8,876,996
- Issue date Nov 4, 2014
- IXYS Semiconductor GmbH
- Werner Weidenauer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Aluminum alloy composite and method for joining thereof
- Patent number 8,845,910
- Issue date Sep 30, 2014
- Taisei PLas Co., Ltd.
- Masanori Naritomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Passivated metal core substrate and process for preparing the same
- Patent number 8,828,152
- Issue date Sep 9, 2014
- PPG Industries Ohio, Inc.
- Michael J. Pawlik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,822,830
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...
- Publication number 20240090138
- Publication date Mar 14, 2024
- Beji SASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...
- Publication number 20230269879
- Publication date Aug 24, 2023
- BYD Company Limited
- Wei ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
One-Step Oxide Bath for Improving Adhesion of Polymeric Materials t...
- Publication number 20230199972
- Publication date Jun 22, 2023
- MacDermid, Incorporated
- Christopher M. Larson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER COMPONENTS
- Publication number 20230142375
- Publication date May 11, 2023
- Namics Corporation
- Naoki OBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230119587
- Publication date Apr 20, 2023
- SEIKO EPSON CORPORATION
- Yoichi MOMOSE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...
- Publication number 20210251085
- Publication date Aug 12, 2021
- Atotech Deutschland GmbH
- Norbert LÜTZOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER FOIL
- Publication number 20200332431
- Publication date Oct 22, 2020
- Makiko SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20200110300
- Publication date Apr 9, 2020
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20190297732
- Publication date Sep 26, 2019
- Atotech Deutschland GmbH
- Wonjin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20190289723
- Publication date Sep 19, 2019
- Avary Holding (Shenzhen) Co., Limited.
- KE-JIAN WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180317325
- Publication date Nov 1, 2018
- Avary Holding (Shenzhen) Co., Limited.
- KE-JIAN WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Circuit Boards
- Publication number 20180279481
- Publication date Sep 27, 2018
- Isola USA Corp.
- Michael Gay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN LAMINATE AND RESIN LAMINATED METALLIC FOIL
- Publication number 20180170007
- Publication date Jun 21, 2018
- ZEON CORPORATION
- Daido CHIBA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180004031
- Publication date Jan 4, 2018
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD FOR CIRCUIT BOARD BASED ON COPPER CERAMIC SUBS...
- Publication number 20170303404
- Publication date Oct 19, 2017
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- FEI REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING
- Publication number 20170239934
- Publication date Aug 24, 2017
- J P IMAGING LIMITED
- John David Adamson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organ...
- Publication number 20170027065
- Publication date Jan 26, 2017
- eSionic Corp.
- Jen-Chieh Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY
- Publication number 20160360623
- Publication date Dec 8, 2016
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesion Promotion in Printed Circuit Boards
- Publication number 20160234947
- Publication date Aug 11, 2016
- ENTHONE, INC.
- Abayomi I. Owei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, AND METHOD FOR PROD...
- Publication number 20150068907
- Publication date Mar 12, 2015
- DIC CORPORATION
- Wataru Fujikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER FOIL, MANUFACTURING METHOD OF THE...
- Publication number 20150044492
- Publication date Feb 12, 2015
- Mitsui Mining and Smelting Co., Ltd.
- Kazuhiro Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Treating Metal Surfaces and Devices Formed Thereby
- Publication number 20140261897
- Publication date Sep 18, 2014
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Treating Metal Surfaces and Devices Formed Thereby
- Publication number 20140251502
- Publication date Sep 11, 2014
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD HAVING COPPER PLATED LAYER WITH ROUGHNESS AND...
- Publication number 20140186651
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER...
- Publication number 20140141169
- Publication date May 22, 2014
- Atotech Deutschland GmbH
- Thomas Huelsmann
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20140030425
- Publication date Jan 30, 2014
- Enthone Inc.
- Abayomi I. OWEI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ALUMINUM ALLOY COMPOSITE AND METHOD FOR JOINING THEREOF
- Publication number 20130256261
- Publication date Oct 3, 2013
- TAISEI PLAS CO., LTD
- Masanori Naritomi
- B32 - LAYERED PRODUCTS

by conversion of the surface of the metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for increasing adhesion strength between a surface of copper...

Method for manufacturing transparent circuit board

Composite copper foil

Circuit board

High-speed interconnects for printed circuit boards

Substrate and semiconductor apparatus

Optical substrate and transparent routing of light sources

Printed circuit board package and display device including the same

Printed circuit board package and display device including the same

Method for manufacturing a printed circuit board

Manufacturing method for circuit board based on copper ceramic subs...

Methods of treating metal surfaces and devices formed thereby

Roughened copper foil, copper clad laminate, and printed circuit board

Production method for copper-clad laminate plate

Copper foil provided with carrier foil, manufacturing method of the...

High-speed interconnects for printed circuit boards

Printing

Methods of treating copper surfaces for enhancing adhesion to organ...

Methods of treating metal surfaces and devices formed thereby

Relating to printing

Method of printing using a reimageable printing plate with an alumi...

Printed circuit board and method for manufacturing the same

Methods of forming articles including metal structures having maxim...

Methods of treating copper surfaces for enhancing adhesion to organ...

Printed circuit board and method for manufacturing the same

Aluminum alloy composite and method for joining thereof

Method for the manufacture of double-sided metalized ceramic substr...

Aluminum alloy composite and method for joining thereof

Passivated metal core substrate and process for preparing the same

Multi-layer printed circuit board and method of manufacturing multi...

Patents Applicationslast 30 patents

TRANSPARENT CIRCUIT BOARD

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...

CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...

One-Step Oxide Bath for Improving Adhesion of Polymeric Materials t...

COMPOSITE COPPER COMPONENTS

ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS

A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...

COMPOSITE COPPER FOIL

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

CIRCUIT BOARD

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Method of Manufacturing Circuit Boards

RESIN COMPOSITION, RESIN LAMINATE AND RESIN LAMINATED METALLIC FOIL

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

MANUFACTURING METHOD FOR CIRCUIT BOARD BASED ON COPPER CERAMIC SUBS...

PRINTING

Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organ...

METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY

Adhesion Promotion in Printed Circuit Boards

LAMINATE, CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, AND METHOD FOR PROD...

COPPER FOIL PROVIDED WITH CARRIER FOIL, MANUFACTURING METHOD OF THE...

Methods of Treating Metal Surfaces and Devices Formed Thereby

Methods of Treating Metal Surfaces and Devices Formed Thereby

PRINTED CIRCUIT BOARD HAVING COPPER PLATED LAYER WITH ROUGHNESS AND...

METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER...

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

ALUMINUM ALLOY COMPOSITE AND METHOD FOR JOINING THEREOF