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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/7688
by deposition over sacrificial masking layer
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Self-aligned barrier for metal vias
Patent number
11,972,974
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Li Wang
H01 - BASIC ELECTRIC ELEMENTS
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Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
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Semiconductor structure and method of manufacturing a semiconductor...
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11,972,973
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Apr 30, 2024
Chun-Ming Lin
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Power rail and signal conducting line arrangement
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11,967,596
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Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Guo-Huei Wu
G06 - COMPUTING CALCULATING COUNTING
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Selective cobalt deposition on copper surfaces
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11,959,167
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Apr 16, 2024
Applied Materials, Inc.
Sang-Ho Yu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Package component with stepped passivation layer
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11,961,762
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
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Solderless interconnection structure and method of forming same
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11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
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Method and structure for semiconductor interconnect
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11,961,731
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Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ru-Shang Hsiao
B08 - CLEANING
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Dual metal gate structure having portions of metal gate layers in c...
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11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
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Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
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Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
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Heterogeneous metal line compositions for advanced integrated circu...
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11,955,534
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Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
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Etch damage and ESL free dual damascene metal interconnect
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11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
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Low-temperature plasma pre-clean for selective gap fill
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11,955,381
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Apr 9, 2024
Applied Materials, Inc.
Yi Xu
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Reverse selective etch stop layer
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11,955,382
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Apr 9, 2024
Applied Materials, Inc.
Kevin Kashefi
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Methods and apparatus for forming dual metal interconnects
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11,948,885
Issue date
Apr 2, 2024
Applied Materials, Inc.
Suketu A Parikh
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Trench contact structures for advanced integrated circuit structure...
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11,948,997
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Apr 2, 2024
Intel Corporation
Subhash M. Joshi
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Electrostatic discharge protection cell and antenna integrated with...
Patent number
11,942,441
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
HoChe Yu
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and manufacturing method thereof
Patent number
11,942,442
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sen-Kuei Hsu
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Stacked-type semiconductor memory device
Patent number
11,943,917
Issue date
Mar 26, 2024
Kioxia Corporation
Satoshi Nagashima
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Magnetic tunnel junction device with minimum stray field
Patent number
11,944,013
Issue date
Mar 26, 2024
International Business Machines Corporation
Heng Wu
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Methods of manufacturing semiconductor devices
Patent number
11,935,835
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Hyo-Jin Kim
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Method of manufacturing a semiconductor structure, and a semiconduc...
Patent number
11,935,785
Issue date
Mar 19, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Shuai Guo
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Semiconductor device and a method for fabricating the same
Patent number
11,935,787
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Chi Chen
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Liner-free conductive structures with anchor points
Patent number
11,929,327
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Inc.
Hsu-Kai Chang
H01 - BASIC ELECTRIC ELEMENTS
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Power cell for semiconductor devices
Patent number
11,929,360
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
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Via connection to a partially filled trench
Patent number
11,929,258
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Ming Chang
H01 - BASIC ELECTRIC ELEMENTS
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Etching platinum-containing thin film using protective cap layer
Patent number
11,929,423
Issue date
Mar 12, 2024
Texas Instruments Incorporated
Sebastian Meier
C01 - INORGANIC CHEMISTRY
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Method for preparing semiconductor structure and semiconductor stru...
Patent number
11,929,282
Issue date
Mar 12, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zhaopei Cui
H01 - BASIC ELECTRIC ELEMENTS
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Light-driven transition from insulator to conductor
Patent number
11,923,245
Issue date
Mar 5, 2024
Bowling Green State University
Farida Selim
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Via CD controllable top via structure
Patent number
11,923,246
Issue date
Mar 5, 2024
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
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DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
Publication number
20240145376
Publication date
May 2, 2024
International Business Machines Corporation
H01 - BASIC ELECTRIC ELEMENTS
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SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...
Publication number
20240145303
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May 2, 2024
Samsung Electronics Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
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COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
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20240145391
Publication date
May 2, 2024
Tahoe Research, Ltd.
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STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
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20240145299
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May 2, 2024
TESSERA LLC
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THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
Publication number
20240136245
Publication date
Apr 25, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
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REDUCED GATE TOP CD WITH WRAP-AROUND GATE CONTACT
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20240128345
Publication date
Apr 18, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTR...
Publication number
20240120196
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Hyun-Suk Lee
H01 - BASIC ELECTRIC ELEMENTS
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MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
Publication number
20240113024
Publication date
Apr 4, 2024
International Business Machines Corporation
Ching-Tzu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Trench FET Device and Method of Manufacturing Trench FET Device
Publication number
20240113186
Publication date
Apr 4, 2024
Huawei Technologies Co., Ltd
Mo huai Chang
H01 - BASIC ELECTRIC ELEMENTS
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INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
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MOLECULAR LAYER DEPOSITION CARBON MASKS FOR DIRECT SELECTIVE DEPOSI...
Publication number
20240105499
Publication date
Mar 28, 2024
Applied Materials, Inc.
Zeqing Shen
H01 - BASIC ELECTRIC ELEMENTS
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METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED TH...
Publication number
20240105500
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kenichi Sano
H01 - BASIC ELECTRIC ELEMENTS
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PLASMA-DOPED TRENCHES FOR MEMORY
Publication number
20240105510
Publication date
Mar 28, 2024
Micron Technology, Inc.
Yiping Wang
H01 - BASIC ELECTRIC ELEMENTS
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METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240096642
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
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PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVIC...
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20240096644
Publication date
Mar 21, 2024
KIOXIA Corporation
Koki UEHA
H01 - BASIC ELECTRIC ELEMENTS
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CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
Publication number
20240096697
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Joanna Chaw Yane YIN
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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20240096797
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
MINJAE KANG
H01 - BASIC ELECTRIC ELEMENTS
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HYBRID CONDUCTIVE STRUCTURES
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20240096998
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shuen-Shin LIANG
H01 - BASIC ELECTRIC ELEMENTS
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HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...
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20240096692
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Mar 21, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
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MULTI-LAYER LINE STRUCTURE
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20240088040
Publication date
Mar 14, 2024
DAI NIPPON PRINTING CO., LTD.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
Publication number
20240088042
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Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
SHU-WEI LI
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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20240087956
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Mar 14, 2024
Samsung Electronics Co., Ltd.
Woojin LEE
H01 - BASIC ELECTRIC ELEMENTS
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MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
Publication number
20240085803
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tai-I YANG
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20240087895
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Mar 14, 2024
NANYA TECHNOLOGY CORPORATION
Cheng-Hsiang FAN
H01 - BASIC ELECTRIC ELEMENTS
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Metal Contact Structure and Method of Forming the Same in a Semicon...
Publication number
20240087953
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
Publication number
20240079270
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Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Huei-Wen Hsieh
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POST PASSIVATION INTERCONNECT
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20240079357
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-An LIN
H01 - BASIC ELECTRIC ELEMENTS
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Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
Publication number
20240081052
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Mar 7, 2024
Micron Technology, Inc.
Jordan D. Greenlee
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...
Publication number
20240079321
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Mar 7, 2024
NANYA TECHNOLOGY CORPORATION
KUO-HUI SU
H01 - BASIC ELECTRIC ELEMENTS
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LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...
Publication number
20240071822
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Lung CHUNG
H01 - BASIC ELECTRIC ELEMENTS