by deposition over sacrificial masking layer

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H01L21/7688

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/7688by deposition over sacrificial masking layer

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with isolation trenches in upper portions o...
- Patent number 12,369,333
- Issue date Jul 22, 2025
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial layers in source/drain contacts and methods of forming th...
- Patent number 12,369,386
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ding-Kang Shih
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of fabrication thereof
- Patent number 12,362,273
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a uniform and thin silicide layer on an...
- Patent number 12,362,187
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-doped trenches for memory
- Patent number 12,354,912
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,354,910
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 12,354,911
- Issue date Jul 8, 2025
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing substrate having through-silicon vias, substra...
- Patent number 12,354,914
- Issue date Jul 8, 2025
- Resonac Corporation
- Yoshinori Ejiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,354,913
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,347,776
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,347,772
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,347,728
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gates of transistors having reduced resistivity
- Patent number 12,347,729
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,347,686
- Issue date Jul 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line for semiconductor device
- Patent number 12,341,057
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 12,341,061
- Issue date Jun 24, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,341,013
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having air cavity
- Patent number 12,341,059
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure by diffusing manganese...
- Patent number 12,341,101
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnect
- Patent number 12,341,066
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 12,341,096
- Issue date Jun 24, 2025
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including graphite and method forming same
- Patent number 12,334,397
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,334,433
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric stack for damascene top-via integration
- Patent number 12,334,398
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive microelectromechanical device and method for forming a c...
- Patent number 12,332,271
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Treatment methods for titanium nitride films
- Patent number 12,327,763
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Xinming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free contact trench fill in gate-all-around FET architecture
- Patent number 12,327,761
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Nicolas Louis Breil
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20250239541
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20250226263
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION STRUCTURE FOR COUPLING BOILING ENHANCED LAYER TO SUBS...
- Publication number 20250226216
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chihting Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH TOPVIA
- Publication number 20250226319
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Gideon Oyibo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bioinformatics Systems, Apparatuses, and Methods Executed on an Int...
- Publication number 20250218549
- Publication date Jul 3, 2025
- Edico Genome Corporation
- Pieter Van Rooyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250218993
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210413
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...
- Publication number 20250203976
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...
- Publication number 20250201696
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANTALUM ELECTRODE WITH TANTALUM NITRIDE LINER AS RIE DIFFUSION BAR...
- Publication number 20250201716
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Luxherta Buzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT FULLY ALIGNED VIA AND METAL LINE
- Publication number 20250201699
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
- Publication number 20250191973
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLY-OVER METAL JUMPER CONNECTION
- Publication number 20250192023
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192044
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTERCONNECTION STRUCTURE
- Publication number 20250191932
- Publication date Jun 12, 2025
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192043
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE ISOLATION DEVICE
- Publication number 20250183152
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kozaburo Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY CONTACTS AND INTERCONNECTS
- Publication number 20250183097
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Chiukin Steven LAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20250183161
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES
- Publication number 20250174494
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...
- Publication number 20250167041
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Fabrizio Fausto Renzo TOIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Contact Metal
- Publication number 20250167047
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS

by deposition over sacrificial masking layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices with through-substrate interconnects and as...

Microelectronic devices with isolation trenches in upper portions o...

Epitaxial layers in source/drain contacts and methods of forming th...

Semiconductor device and method of manufacturing the same

Conductive structures and methods of fabrication thereof

Semiconductor device having a uniform and thin silicide layer on an...

Plasma-doped trenches for memory

Cobalt based interconnects and methods of fabrication thereof

Bi-layer alloy liner for interconnect metallization and methods of...

Cu3Sn via metallization in electrical devices for low-temperature 3...

Method for producing substrate having through-silicon vias, substra...

Contact structure for semiconductor device

Integrated chip with graphene based interconnect

Semiconductor devices and methods of manufacturing thereof

Bi-layer alloy liner for interconnect metallization and methods of...

Metal gates of transistors having reduced resistivity

Semiconductor device structure and method for preparing the same

Interconnect line for semiconductor device

Bottom-up fill dielectric materials for semiconductor structure fab...

Method and structure for barrier-less plug

Semiconductor device having air cavity

Method for forming a semiconductor structure by diffusing manganese...

Advanced metal interconnect

Bare-die smart bridge connected with copper pillars for system-in-p...

Interconnect structure including graphite and method forming same

Semiconductor device and method of fabricating the same

Multilayer dielectric stack for damascene top-via integration

Capacitive microelectromechanical device and method for forming a c...

Treatment methods for titanium nitride films

Void-free contact trench fill in gate-all-around FET architecture

Patents Applicationslast 30 patents

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

Contact Structure For Semiconductor Device

METALLIZATION STRUCTURE FOR COUPLING BOILING ENHANCED LAYER TO SUBS...

INTERCONNECT LINES WITH LINE WIDTH PROFILE

INTERCONNECT WITH TOPVIA

Bioinformatics Systems, Apparatuses, and Methods Executed on an Int...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

MULTI-LAYER LINE STRUCTURE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...

INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...

TANTALUM ELECTRODE WITH TANTALUM NITRIDE LINER AS RIE DIFFUSION BAR...

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

REPLACEMENT FULLY ALIGNED VIA AND METAL LINE

DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

FLY-OVER METAL JUMPER CONNECTION

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF MANUFACTURING INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

HIGH VOLTAGE ISOLATION DEVICE

LOW RESISTIVITY CONTACTS AND INTERCONNECTS

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES

BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...

VIAS WITH SELECTED GRAIN DISTRIBUTION

Method of Forming Contact Metal