TREA

by detecting inherent features of, or outside, the semiconductor or solid-state body

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  • CPC
  • H01L2224/83122
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83122by detecting inherent features of, or outside, the semiconductor or solid-state body
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Multilayer substrate
    • Patent number 11,901,325
    • Issue date Feb 13, 2024
    • Dexerials Corporation
    • Seiichiro Shinohara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Assembly process for circuit carrier and circuit carrier
    • Patent number 10,991,632
    • Issue date Apr 27, 2021
    • A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
    • Andreas Karch
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding system
    • Patent number 10,840,213
    • Issue date Nov 17, 2020
    • Tokyo Electron Limited
    • Masataka Matsunaga
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Placement method for circuit carrier and circuit carrier
    • Patent number 10,672,672
    • Issue date Jun 2, 2020
    • A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
    • Andreas Karch
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Grant

    Bonding systems
    • Patent number 10,340,248
    • Issue date Jul 2, 2019
    • Tokyo Electron Limited
    • Masataka Matsunaga
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Multilayer substrate
    • Patent number 10,199,358
    • Issue date Feb 5, 2019
    • Dexerials Corporation
    • Yasushi Akutsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Enhanced fiducial visibility and recognition
    • Patent number 10,049,987
    • Issue date Aug 14, 2018
    • Intel Corporation
    • Chia-Pin Chiu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ENHANCED FIDUCIAL VISIBILITY AND RECOGNITION
    • Publication number 20180182712
    • Publication date Jun 28, 2018
    • Intel Corporation
    • Chia-Pin Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING SYSTEM
    • Publication number 20180019226
    • Publication date Jan 18, 2018
    • TOKYO ELECTRON LIMITED
    • Masataka MATSUNAGA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Bonding System
    • Publication number 20180019225
    • Publication date Jan 18, 2018
    • TOKYO ELECTRON LIMITED
    • Masataka MATSUNAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
    • Publication number 20160155721
    • Publication date Jun 2, 2016
    • TOKYO ELECTRON LIMITED
    • Kenji SUGAKAWA
    • H01 - BASIC ELECTRIC ELEMENTS