by detecting inherent features of, or outside, the semiconductor or solid-state body

Industry

CPC
H01L2224/81122

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81122by detecting inherent features of, or outside, the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,943,842
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output cell wire connector
- Patent number 10,763,205
- Issue date Sep 1, 2020
- Seagate Technology LLC
- Pritesh Pawaskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and method of correcting offset amount of the same
- Patent number 10,068,872
- Issue date Sep 4, 2018
- Shinkawa Ltd.
- Makoto Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick-and-place tool for packaging process
- Patent number 9,966,357
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic microelectronic device attachment
- Patent number 8,313,958
- Issue date Nov 20, 2012
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically alignable integrated circuit device
- Patent number 7,994,608
- Issue date Aug 9, 2011
- Infineon Technologies AG
- Ai Min Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and wafer level chip size package therefor
- Patent number 7,830,011
- Issue date Nov 9, 2010
- Yamaha Corporation
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic alignment system for bumps on an integrated circuit device
- Patent number 5,986,348
- Issue date Nov 16, 1999
- Ball Semiconductor Inc.
- Atsuyuki Fukano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20210183716
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20200168517
- Publication date May 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT CELL WIRE CONNECTOR
- Publication number 20190019747
- Publication date Jan 17, 2019
- Pritesh PAWASKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR POSITIONING USING NEAR FIELD TRANSDUCERS, PAR...
- Publication number 20170365497
- Publication date Dec 21, 2017
- Alan S. Edelstein
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME
- Publication number 20160351528
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- MAKOTO TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IN-LINE MEASUREMENT OF PRE-UNDERFILL WETTIN...
- Publication number 20160133485
- Publication date May 12, 2016
- Compass Electro Optical Systems Ltd.
- Yehoshua Shuki BENJAMIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20150333033
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20140030849
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC MICROELECTRONIC DEVICE ATTACHMENT
- Publication number 20110281375
- Publication date Nov 17, 2011
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100308471
- Publication date Dec 9, 2010
- PANASONIC CORPORATION
- Hayato Korogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetically Alignable Integrated Circuit Device
- Publication number 20080265367
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Ai Min Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor element and wafer level chip size package therefor
- Publication number 20050199995
- Publication date Sep 15, 2005
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS

by detecting inherent features of, or outside, the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer substrate

Semiconductor device with a protection mechanism and associated sys...

Semiconductor device with a protection mechanism and associated sys...

Input/output cell wire connector

Photodetector-arrays and methods of fabrication thereof

Multilayer substrate

Mounting apparatus and method of correcting offset amount of the same

Pick-and-place tool for packaging process

Magnetic microelectronic device attachment

Magnetically alignable integrated circuit device

Semiconductor element and wafer level chip size package therefor

Magnetic alignment system for bumps on an integrated circuit device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

INPUT/OUTPUT CELL WIRE CONNECTOR

METHOD AND SYSTEM FOR POSITIONING USING NEAR FIELD TRANSDUCERS, PAR...

MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME

SYSTEMS AND METHODS FOR IN-LINE MEASUREMENT OF PRE-UNDERFILL WETTIN...

Pick-and-Place Tool for Packaging Process

Pick-and-Place Tool for Packaging Process

MAGNETIC MICROELECTRONIC DEVICE ATTACHMENT

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Magnetically Alignable Integrated Circuit Device

Semiconductor element and wafer level chip size package therefor