by diffusing alloying elements

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H01L21/76858

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76858by diffusing alloying elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed gate strcutre with protection layer
- Patent number 12,080,773
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 11,862,567
- Issue date Jan 2, 2024
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structure and method for fabricating the same
- Patent number 11,810,818
- Issue date Nov 7, 2023
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection element and method of manufacturing the same
- Patent number 11,610,813
- Issue date Mar 21, 2023
- STMicroelectronics (Crolles 2) SAS
- Magali Gregoire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,600,569
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,373,903
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier for CMOS under array type memory device and met...
- Patent number 11,296,112
- Issue date Apr 5, 2022
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping of metal barrier layers
- Patent number 11,270,911
- Issue date Mar 8, 2022
- Applied Materials Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese barrier layer
- Patent number 11,232,983
- Issue date Jan 25, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contacts and methods for manufacturing the same
- Patent number 11,195,721
- Issue date Dec 7, 2021
- Princeton Optronics, Inc.
- Guoyang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-free vertical interconnect structure
- Patent number 11,164,778
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection element and method of manufacturing the same
- Patent number 11,152,259
- Issue date Oct 19, 2021
- STMicroelectronics (Crolles 2) SAS
- Magali Gregoire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 11,101,219
- Issue date Aug 24, 2021
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulating metal interconnect surface topography
- Patent number 11,069,567
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Conal Murray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 11,056,505
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,049,810
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnects
- Patent number 11,018,054
- Issue date May 25, 2021
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 10,985,105
- Issue date Apr 20, 2021
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Metal interconnect structure and method for fabricating the same
- Patent number 10,978,339
- Issue date Apr 13, 2021
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to improve reliability in Cu interconnects using Cu inte...
- Patent number 10,943,863
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,903,116
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising silver
- Patent number 10,862,030
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 10,825,724
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to improve reliability in Cu interconnects using Cu inte...
- Patent number 10,818,590
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid source and drain contact formation using metal liner and met...
- Patent number 10,818,599
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER
- Publication number 20240258381
- Publication date Aug 1, 2024
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240014069
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BARRIER LAYERS
- Publication number 20240006235
- Publication date Jan 4, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED GATE STRCUTRE WITH PROTECTION LAYER
- Publication number 20230261072
- Publication date Aug 17, 2023
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FOR ELECTRONIC COMPONENT
- Publication number 20230260835
- Publication date Aug 17, 2023
- STMicroelectronics (Rousset) SAS
- Christian Rivero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER
- Publication number 20230261061
- Publication date Aug 17, 2023
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SWITCH
- Publication number 20230223448
- Publication date Jul 13, 2023
- STMicroelectronics (Rousset) SAS
- Pascal FORNARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES
- Publication number 20220415819
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...
- Publication number 20220336271
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
- Publication number 20220115269
- Publication date Apr 14, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20220076997
- Publication date Mar 10, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tiantian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION ELEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220020640
- Publication date Jan 20, 2022
- STMicroelectronics (Crolles 2) SAS
- Magali GREGOIRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF METAL BARRIER LAYERS
- Publication number 20210351072
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE CONTACTS INCLUDING INTERMETALLIC ALLOY OF NICKEL, PL...
- Publication number 20210343647
- Publication date Nov 4, 2021
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Integrated Assemblies Having One or More Modifying Substances Distr...
- Publication number 20210313346
- Publication date Oct 7, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210233860
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- SU-HYUN BARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210202307
- Publication date Jul 1, 2021
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE CONTACTS INCLUDING INTERMETALLIC ALLOY OF NICKEL, PL...
- Publication number 20210193576
- Publication date Jun 24, 2021
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BARRIER-FREE VERTICAL INTERCONNECT STRUCTURE
- Publication number 20210159117
- Publication date May 27, 2021
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20210050254
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20200402848
- Publication date Dec 24, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION ELEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200381297
- Publication date Dec 3, 2020
- STMicroelectronics (Crolles 2) SAS
- Magali GREGOIRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER FOR CMOS UNDER ARRAY TYPE MEMORY DEVICE AND MET...
- Publication number 20200258909
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20200051854
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECTS
- Publication number 20200013673
- Publication date Jan 9, 2020
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING SILVER
- Publication number 20190363253
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190355618
- Publication date Nov 21, 2019
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATING METAL INTERCONNECT SURFACE TOPOGRAPHY
- Publication number 20190318962
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Conal Murray
- B24 - GRINDING POLISHING

by diffusing alloying elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated assemblies having one or more modifying substances distr...

Recessed gate strcutre with protection layer

Low resistance contacts including intermetallic alloy of nickel, pl...

Doped selective metal caps to improve copper electromigration with...

Low resistance contacts including intermetallic alloy of nickel, pl...

Metal contact structure and method of forming the same in a semicon...

Metal interconnect structure and method for fabricating the same

Method of forming copper interconnect structure with manganese barr...

Interconnection element and method of manufacturing the same

Integrated circuit device and method of manufacturing the same

Doped selective metal caps to improve copper electromigration with...

Multi-layer barrier for CMOS under array type memory device and met...

Doping of metal barrier layers

Copper interconnect structure with manganese barrier layer

Ohmic contacts and methods for manufacturing the same

Barrier-free vertical interconnect structure

Interconnection element and method of manufacturing the same

Low resistance contacts including intermetallic alloy of nickel, pl...

Modulating metal interconnect surface topography

Integrated assemblies having one or more modifying substances distr...

Integrated circuit device and method of manufacturing the same

Integrated circuit interconnects

Low resistance contacts including intermetallic alloy of nickel, pl...

Metal interconnect structure and method for fabricating the same

Techniques to improve reliability in Cu interconnects using Cu inte...

Void-free metallic interconnect structures with self-formed diffusi...

Semiconductor devices comprising silver

Metal contact structure and method of forming the same in a semicon...

Techniques to improve reliability in Cu interconnects using Cu inte...

Hybrid source and drain contact formation using metal liner and met...

Patents Applicationslast 30 patents

METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER

Metal Contact Structure and Method of Forming the Same in a Semicon...

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

COMPOSITE BARRIER LAYERS

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

RECESSED GATE STRCUTRE WITH PROTECTION LAYER

CONTACT FOR ELECTRONIC COMPONENT

METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER

RADIO FREQUENCY SWITCH

DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES

DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...

COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

INTERCONNECTION ELEMENT AND METHOD OF MANUFACTURING THE SAME

DOPING OF METAL BARRIER LAYERS

LOW RESISTANCE CONTACTS INCLUDING INTERMETALLIC ALLOY OF NICKEL, PL...

Integrated Assemblies Having One or More Modifying Substances Distr...

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

LOW RESISTANCE CONTACTS INCLUDING INTERMETALLIC ALLOY OF NICKEL, PL...

BARRIER-FREE VERTICAL INTERCONNECT STRUCTURE

Metal Contact Structure and Method of Forming the Same in a Semicon...

INTERCONNECT STRUCTURE

INTERCONNECTION ELEMENT AND METHOD OF MANUFACTURING THE SAME

MULTI-LAYER BARRIER FOR CMOS UNDER ARRAY TYPE MEMORY DEVICE AND MET...

INTERCONNECT STRUCTURE

INTEGRATED CIRCUIT INTERCONNECTS

SEMICONDUCTOR DEVICES COMPRISING SILVER

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

MODULATING METAL INTERCONNECT SURFACE TOPOGRAPHY