by dipping

Industry

CPC
H01L2224/11822

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11822by dipping

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for manufacturing semiconductor package structure
- Patent number 11,837,572
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Min Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,791,313
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,456,280
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,833,053
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder deposits
- Patent number 10,118,240
- Issue date Nov 6, 2018
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component, semiconductor-mounted product including th...
- Patent number 9,925,612
- Issue date Mar 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuo Fukuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnect solder mask
- Patent number 9,545,014
- Issue date Jan 10, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnect solder mask
- Patent number 9,545,013
- Issue date Jan 10, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe feature to minimize flip-chip semiconductor die collapse...
- Patent number 9,449,900
- Issue date Sep 20, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of coated copper pillars
- Patent number 9,331,040
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetallic compound layer on a pillar between a chip and substrate
- Patent number 9,293,433
- Issue date Mar 22, 2016
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interposers and stacked memory devices
- Patent number 9,287,235
- Issue date Mar 15, 2016
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming narrow interconnect site...
- Patent number 9,258,904
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip MLP with conductive ink
- Patent number 9,147,627
- Issue date Sep 29, 2015
- Fairchild Semiconductor Corporation
- Seung-Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit constructions having through substrate vias and...
- Patent number 9,123,700
- Issue date Sep 1, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 9,105,532
- Issue date Aug 11, 2015
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of solder transfer substrate, solder precoatin...
- Patent number 9,027,822
- Issue date May 12, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for soldering and soldering process
- Patent number 8,960,526
- Issue date Feb 24, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming protective coating over...
- Patent number 8,912,650
- Issue date Dec 16, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 8,890,315
- Issue date Nov 18, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure o...
- Patent number 8,587,120
- Issue date Nov 19, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect forming method
- Patent number 8,541,299
- Issue date Sep 24, 2013
- Ultratech, Inc.
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 8,530,360
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230369288
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220392868
- Publication date Dec 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Min WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220392872
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210057382
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Method for Semiconductor Components
- Publication number 20190006301
- Publication date Jan 3, 2019
- IMEC vzw
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Solder Deposits
- Publication number 20170320155
- Publication date Nov 9, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES
- Publication number 20150228615
- Publication date Aug 13, 2015
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES
- Publication number 20140263585
- Publication date Sep 18, 2014
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure O...
- Publication number 20140008791
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Over...
- Publication number 20130228919
- Publication date Sep 5, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...
- Publication number 20130181041
- Publication date Jul 18, 2013
- PANASONIC CORPORATION
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuit Constructions Having Through Substrate Vias And...
- Publication number 20130175698
- Publication date Jul 11, 2013
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED C...
- Publication number 20130128485
- Publication date May 23, 2013
- HUAWEI DEVICE CO., LTD.
- David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Forming Solder Deposits
- Publication number 20130087539
- Publication date Apr 11, 2013
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure O...
- Publication number 20120326296
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Over...
- Publication number 20120326297
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnect Solder Mask
- Publication number 20120319272
- Publication date Dec 20, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnect Solder Mask
- Publication number 20120319273
- Publication date Dec 20, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER
- Publication number 20120220117
- Publication date Aug 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Method of Forming Narrow Interconnect Site...
- Publication number 20120208326
- Publication date Aug 16, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20120043655
- Publication date Feb 23, 2012
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL FLEX CONTACT CARRIERS #2
- Publication number 20120012365
- Publication date Jan 19, 2012
- GABE CHERIAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF ASSEMBLING CHIPS
- Publication number 20110291275
- Publication date Dec 1, 2011
- MEGICA CORPORATION
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and method for manufacturing semiconductor package structure

Semiconductor package and method of forming the same

Semiconductor device with a heterogeneous solder joint and method f...

Semiconductor package and method of forming the same

Assembly comprising hybrid interconnecting means including intermed...

Method for electrical coupling and electric coupling arrangement

Semiconductor package and method of forming the same

Chip packages with sintered interconnects formed out of pads

3D packaging method for semiconductor components

Method for forming solder deposits

Semiconductor component, semiconductor-mounted product including th...

Transient interface gradient bonding for metal bonds

Electronic component mounting method

Flip chip interconnect solder mask

Flip chip interconnect solder mask

Leadframe feature to minimize flip-chip semiconductor die collapse...

Manufacture of coated copper pillars

Intermetallic compound layer on a pillar between a chip and substrate

Method for forming interposers and stacked memory devices

Semiconductor device and method of forming narrow interconnect site...

Flip chip MLP with conductive ink

Integrated circuit constructions having through substrate vias and...

Semiconductor device and method of forming interconnect structure o...

Manufacturing method of solder transfer substrate, solder precoatin...

Flux for soldering and soldering process

Semiconductor device and method of forming protective coating over...

Semiconductor device and method of forming interconnect structure o...

Semiconductor device and method of forming interconnect structure o...

Electrical interconnect forming method

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

3D Packaging Method for Semiconductor Components

Method for Forming Solder Deposits

METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

Semiconductor Device and Method of Forming Interconnect Structure O...

Semiconductor Device and Method of Forming Protective Coating Over...

MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...

Integrated Circuit Constructions Having Through Substrate Vias And...

METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED C...

Method and Device for Forming Solder Deposits

Semiconductor Device and Method of Forming Interconnect Structure O...

Semiconductor Device and Method of Forming Protective Coating Over...

Flip Chip Interconnect Solder Mask

Flip Chip Interconnect Solder Mask

Doping Minor Elements into Metal Bumps

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Semiconductor Device and Method of Forming Narrow Interconnect Site...

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

Doping Minor Elements into Metal Bumps

THERMAL FLEX CONTACT CARRIERS #2

METHOD OF ASSEMBLING CHIPS