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H01L2224/03422

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,373,284
- Issue date Feb 12, 2013
- NEC Corporation
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140264888
- Publication date Sep 18, 2014
- INPAQ TECHNOLOGY CO., LTD.
- CHU-CHUN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
- Publication number 20130323884
- Publication date Dec 5, 2013
- The Charles Stark Draper Laboratory
- Maurice Samuel Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
- Publication number 20130316497
- Publication date Nov 28, 2013
- The Charles Stark Draper Laboratory
- Maurice Samuel Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100213622
- Publication date Aug 26, 2010
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS