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H01L2224/11422

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11422by dipping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer carrier for micro light-emitting element
- Patent number 11,450,785
- Issue date Sep 20, 2022
- PlayNitride Inc.
- Tzu-Yu Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing micro light-emitting element array, transfe...
- Patent number 10,991,846
- Issue date Apr 27, 2021
- PLAYNITRIDE INC.
- Tzu-Yu Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,691,676
- Issue date Jun 27, 2017
- SOCIONEXT INC.
- Takeshi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for wafer-level processing of QFN packages
- Patent number 9,472,451
- Issue date Oct 18, 2016
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost low-profile solder bump process for enabling ultra-thin wa...
- Patent number 9,425,064
- Issue date Aug 23, 2016
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate
- Patent number 9,111,818
- Issue date Aug 18, 2015
- Unimicron Technology Corporation
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic device having a liquid crystal polym...
- Patent number 9,059,317
- Issue date Jun 16, 2015
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for wafer-level processing of QFN packages
- Patent number 8,860,222
- Issue date Oct 14, 2014
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic device having a liquid crystal polym...
- Patent number 8,693,203
- Issue date Apr 8, 2014
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical bonding pads on a wafer
- Patent number 8,227,332
- Issue date Jul 24, 2012
- STMicroelectronics (Grenoble) SAS
- Romain Coffy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder contacts and methods of forming same
- Patent number 7,745,321
- Issue date Jun 29, 2010
- Qimonda AG
- Alfred Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...
- Publication number 20180374809
- Publication date Dec 27, 2018
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE
- Publication number 20140182912
- Publication date Jul 3, 2014
- Unimicron Technology Corporation
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...
- Publication number 20140167252
- Publication date Jun 19, 2014
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20140138849
- Publication date May 22, 2014
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140027920
- Publication date Jan 30, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES
- Publication number 20130161817
- Publication date Jun 27, 2013
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20120182703
- Publication date Jul 19, 2012
- Harris Corporation, Corporation of the State of Delaware
- Louis Joseph Rendek, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CONTACTS AND METHODS OF FORMING SAME
- Publication number 20090179333
- Publication date Jul 16, 2009
- Alfred Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER
- Publication number 20090134514
- Publication date May 28, 2009
- STMicroelectronics (Grenoble) SAS
- Romain Coffy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Transfer carrier for micro light-emitting element

System for processing semiconductor devices

Method of manufacturing micro light-emitting element array, transfe...

Contact structures with porous networks for solder connections, and...

Engineered polymer-based electronic materials

Integrated circuit system with carrier construction configuration a...

Tools and systems for processing semiconductor devices, and methods...

Transient interface gradient bonding for metal bonds

Semiconductor device and method for manufacturing the same

Technique for wafer-level processing of QFN packages

Low-cost low-profile solder bump process for enabling ultra-thin wa...

Packaging substrate

Method of making an electronic device having a liquid crystal polym...

Techniques for wafer-level processing of QFN packages

Method of making an electronic device having a liquid crystal polym...

Method for fabricating electrical bonding pads on a wafer

Doping minor elements into metal bumps

Solder contacts and methods of forming same

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

Tools and Systems for Processing Semiconductor Devices, and Methods...

INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...

Tools and Systems for Processing Semiconductor Devices, and Methods...

Methods for Metal Bump Die Assembly

PACKAGING SUBSTRATE

LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES

Doping Minor Elements into Metal Bumps

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

Doping Minor Elements into Metal Bumps

SOLDER CONTACTS AND METHODS OF FORMING SAME

METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER