by direct bonding

Industry

CPC
H01L21/187

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/187by direct bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 12,148,666
- Issue date Nov 19, 2024
- Kioxia Corporation
- Hidekazu Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,119,318
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding substrates, microchip and method of manufacturing...
- Patent number 12,103,246
- Issue date Oct 1, 2024
- Ushio Denki Kabushiki Kaisha
- Motohiro Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a composite structure comprising a thin monocr...
- Patent number 12,087,631
- Issue date Sep 10, 2024
- Soitec
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,068,321
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device and a semiconductor device
- Patent number 12,027,591
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bonded substrate stack by surface activation
- Patent number 11,948,912
- Issue date Apr 2, 2024
- Infineon Technologies AG
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-assisted method for parting crystalline material along lase...
- Patent number 11,901,181
- Issue date Feb 13, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming lateral heterojunctions in two-dimensional mate...
- Patent number 11,894,449
- Issue date Feb 6, 2024
- The Government of the United States of America, as represented by the Secreta...
- Berend T. Jonker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,862,487
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting devices having lateral heterojunctions in two-dimens...
- Patent number 11,862,716
- Issue date Jan 2, 2024
- The Government of the United States of America, as represented by the Secreta...
- Berend T. Jonker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
- Patent number 11,854,999
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for processing devices
- Patent number 11,855,064
- Issue date Dec 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,728,343
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
- Patent number 11,721,637
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,697,281
- Issue date Jul 11, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with two-dimensional materials
- Patent number 11,688,605
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tse-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuumizing device and vacuumizing method for bonding substrate
- Patent number 11,664,228
- Issue date May 30, 2023
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuangen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 11,664,336
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,652,000
- Issue date May 16, 2023
- Kioxia Corporation
- Hidekazu Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for cleaning non-bonding surface of substrate
- Patent number 11,626,302
- Issue date Apr 11, 2023
- Tokyo Electron Limited
- Yuji Mimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,621,186
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bonded substrate stack
- Patent number 11,594,515
- Issue date Feb 28, 2023
- Infineon Technologies AG
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical-cavity surface-emitting laser fabrication on large wafer
- Patent number 11,588,299
- Issue date Feb 21, 2023
- Mellanox Technologies, Ltd.
- Vladimir Iakovlev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,581,188
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,562,912
- Issue date Jan 24, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer separating method
- Patent number 11,551,934
- Issue date Jan 10, 2023
- Kioxia Corporation
- Sho Kawadahara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,527,410
- Issue date Dec 13, 2022
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014889
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014949
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...
- Publication number 20240404859
- Publication date Dec 5, 2024
- Nikon Corporation
- Mikio USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240395752
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-N SILICON SEMICONDUCTOR WAFER
- Publication number 20240395873
- Publication date Nov 28, 2024
- AZUR SPACE SOLAR POWER GMBH
- Atsushi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Films for Reduced Thermal Resistance and Methods Forming the Same
- Publication number 20240379505
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND...
- Publication number 20240371641
- Publication date Nov 7, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20240371850
- Publication date Nov 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES AND METHODS...
- Publication number 20240322002
- Publication date Sep 26, 2024
- North Carolina State University
- Spyridon Pavlidis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION
- Publication number 20240274573
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...
- Publication number 20240266172
- Publication date Aug 8, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frédéric Allibert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240250166
- Publication date Jul 25, 2024
- DENSO CORPORATION
- Hidemoto TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERED SEMICONDUCTOR SUBSTRATE
- Publication number 20240203804
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS
- Publication number 20240194478
- Publication date Jun 13, 2024
- TOKYO ELECTRON LIMITED
- Satohiko Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20240186298
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A LAYER OF A HETEROSTRUCTURE
- Publication number 20240178056
- Publication date May 30, 2024
- SOITEC
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20240162063
- Publication date May 16, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-Assisted Method for Parting Crystalline Material Along Lase...
- Publication number 20240128085
- Publication date Apr 18, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS
- Publication number 20240071746
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Yu-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION
- Publication number 20240063022
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Christopher Michael Netzband
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PRETREATED COMPOSITE SUBSTRATE, AND PRETREAT...
- Publication number 20240055251
- Publication date Feb 15, 2024
- mi2-factory GmbH
- Constantin CSATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
- Publication number 20240038536
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- YONGIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
- Publication number 20240030033
- Publication date Jan 25, 2024
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240006207
- Publication date Jan 4, 2024
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230343786
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230326757
- Publication date Oct 12, 2023
- EBARA CORPORATION
- Masayuki SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS
- Publication number 20230307234
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-An CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonding Structure and Method of Forming Same
- Publication number 20230253354
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20230245927
- Publication date Aug 3, 2023
- Kioxia Corporation
- Hidekazu HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS

by direct bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, method of manufacturing semiconductor device,...

Bonding structure and method of forming same

Method of bonding substrates, microchip and method of manufacturing...

Method for producing a composite structure comprising a thin monocr...

Semiconductor devices

Method for forming a semiconductor device and a semiconductor device

Method of manufacturing a bonded substrate stack by surface activation

Carrier-assisted method for parting crystalline material along lase...

Discontinuous patterned bonds for semiconductor devices and associa...

Methods for forming lateral heterojunctions in two-dimensional mate...

Device and method for bonding of two substrates

Light-emitting devices having lateral heterojunctions in two-dimens...

Patterning a transparent wafer to form an alignment mark in the tra...

Techniques for processing devices

Wafer scale bonded active photonics interposer

Semiconductor devices

Patterning a transparent wafer to form an alignment mark in the tra...

Device and method for bonding substrates

Semiconductor device with two-dimensional materials

Vacuumizing device and vacuumizing method for bonding substrate

Bonding structure and method of forming same

Semiconductor device, method of manufacturing semiconductor device,...

Bonding method for cleaning non-bonding surface of substrate

Simultaneous bonding approach for high quality wafer stacking appli...

Method of manufacturing a bonded substrate stack

Vertical-cavity surface-emitting laser fabrication on large wafer

Substrate bonding apparatus

Device and method for bonding of two substrates

Wafer separating method

Device and method for bonding of substrates

Patents Applicationslast 30 patents

PROCESSING METHOD OF WAFER

PROCESSING METHOD OF WAFER

SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...

BONDING STRUCTURE AND METHOD OF FORMING SAME

III-N SILICON SEMICONDUCTOR WAFER

Bond Films for Reduced Thermal Resistance and Methods Forming the Same

METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND...

TECHNIQUES FOR PROCESSING DEVICES

HETEROGENEOUS HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES AND METHODS...

METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...

TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ENGINEERED SEMICONDUCTOR SUBSTRATE

APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

METHOD FOR TRANSFERRING A LAYER OF A HETEROSTRUCTURE

BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

Carrier-Assisted Method for Parting Crystalline Material Along Lase...

PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS

WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION

METHOD FOR PRODUCING A PRETREATED COMPOSITE SUBSTRATE, AND PRETREAT...

PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...

METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...

BONDING APPARATUS AND BONDING METHOD

SEMICONDUCTOR DEVICES

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS

DEVICE AND METHOD FOR BONDING SUBSTRATES

Bonding Structure and Method of Forming Same

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...