by direct electroplating

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CPC
H05K3/424

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/424by direct electroplating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 11,997,799
- Issue date May 28, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single step electrolytic method of filling through holes in printed...
- Patent number 11,746,433
- Issue date Sep 5, 2023
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Asymmetrical electrolytic plating for a conductive pattern
- Patent number 11,716,819
- Issue date Aug 1, 2023
- AVERATEK CORPORATION
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Intermediate substrate and fabrication method thereof
- Patent number 11,658,104
- Issue date May 23, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic device and method for manufacturing the same
- Patent number 11,450,472
- Issue date Sep 20, 2022
- SHENNAN CIRCUITS CO., LTD.
- Beilei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming circuits using seed layer and etchant compositio...
- Patent number 11,317,514
- Issue date Apr 26, 2022
- Inktec Co., Ltd.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 11,222,813
- Issue date Jan 11, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicone contact element
- Patent number 11,191,170
- Issue date Nov 30, 2021
- Michael Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leveler compositions for use in copper deposition in manufacture of...
- Patent number 11,168,406
- Issue date Nov 9, 2021
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board, laminated circuit board, and method of manufacturing...
- Patent number 10,993,322
- Issue date Apr 27, 2021
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly that includes void free holes
- Patent number 10,856,424
- Issue date Dec 1, 2020
- Intel Corporation
- Sri Ranga Sai Boyapati
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit boards with thick-wall vias
- Patent number 10,820,420
- Issue date Oct 27, 2020
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor built-in substrate
- Patent number 10,818,428
- Issue date Oct 27, 2020
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit plate and method of making same
- Patent number 10,757,806
- Issue date Aug 25, 2020
- Meng-Hsiu Hsieh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 10,738,389
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Takashi Izumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Forming conductive vias using a light guide
- Patent number 10,712,664
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Gerald Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated metallization structures
- Patent number 10,699,948
- Issue date Jun 30, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,645,813
- Issue date May 5, 2020
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-planar on-package via capacitor
- Patent number 10,595,410
- Issue date Mar 17, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 10,590,556
- Issue date Mar 17, 2020
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate
- Patent number 10,542,625
- Issue date Jan 21, 2020
- Shinko Electric Industries Co., Ltd.
- Takayuki Ota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leveler compositions for use in copper deposition in manufacture of...
- Patent number 10,519,557
- Issue date Dec 31, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 10,504,777
- Issue date Dec 10, 2019
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic circuit plate and method of making same
- Patent number 10,506,711
- Issue date Dec 10, 2019
- Meng-Hsiu Hsieh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Printed wiring board
- Patent number 10,368,440
- Issue date Jul 30, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a PCB including a thick-wall via
- Patent number 10,356,906
- Issue date Jul 16, 2019
- ABB Schweiz AG
- Robert Joseph Roessler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing traces of PCB
- Patent number 10,306,768
- Issue date May 28, 2019
- TRIALLIAN CORPORATION
- Albert Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING
- Publication number 20240271307
- Publication date Aug 15, 2024
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Single Step Electrolytic Method of Filling Through-Holes in Printed...
- Publication number 20240224432
- Publication date Jul 4, 2024
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...
- Publication number 20230395395
- Publication date Dec 7, 2023
- TOPPAN INC.
- Takashi KIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN
- Publication number 20230345642
- Publication date Oct 26, 2023
- Averatek Corporation
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230319987
- Publication date Oct 5, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...
- Publication number 20230223324
- Publication date Jul 13, 2023
- Regents of the University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...
- Publication number 20230147650
- Publication date May 11, 2023
- TSE CO., LTD.
- Byeong Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERMEDIATE SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20220285257
- Publication date Sep 8, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leveler Compositions for use in Copper Deposition in Manufacture of...
- Publication number 20210310141
- Publication date Oct 7, 2021
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICONE CONTACT ELEMENT
- Publication number 20210029835
- Publication date Jan 28, 2021
- Michael Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, LAMINATED CIRCUIT BOARD, AND METHOD OF MANUFACTURING...
- Publication number 20200344879
- Publication date Oct 29, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CIRCUITS USING SEED LAYER AND ETCHANT COMPOSITIO...
- Publication number 20200221578
- Publication date Jul 9, 2020
- Ink Tec Co., Ltd.
- Kwang-Choon CHUNG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EMBEDDED CIRCUIT BOARD AND METHOD OF MAKING SAME
- Publication number 20200120805
- Publication date Apr 16, 2020
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME
- Publication number 20200107438
- Publication date Apr 2, 2020
- MENG-HSIU HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20200075396
- Publication date Mar 5, 2020
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Leveler Compositions for use in Copper Deposition in Manufacture of...
- Publication number 20200063280
- Publication date Feb 27, 2020
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN
- Publication number 20190394887
- Publication date Dec 26, 2019
- Averatek Corporation
- Michael Riley Vinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20190380203
- Publication date Dec 12, 2019
- Shinko Electric Industries Co., Ltd.
- Takayuki Ota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH THICK-WALL VIAS
- Publication number 20190343001
- Publication date Nov 7, 2019
- ABB Schweiz AG
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190333681
- Publication date Oct 31, 2019
- SHENNAN CIRCUITS CO., LTD.
- BEILEI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20190252244
- Publication date Aug 15, 2019
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190124765
- Publication date Apr 25, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190104615
- Publication date Apr 4, 2019
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING TRACES OF PCB
- Publication number 20180368266
- Publication date Dec 20, 2018
- TRIALLIAN CORPORATION
- Albert Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING TRACES OF PCB
- Publication number 20180310414
- Publication date Oct 25, 2018
- TRIALLIAN CORPORATION
- Albert Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES VOID FREE HOLES
- Publication number 20180288885
- Publication date Oct 4, 2018
- Sri Ranga Sai Boyapati
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180270958
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Katsutoshi KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180270951
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELECTRICALLY CONTACTING A COMPONENT BY GALVANIC CONNECTI...
- Publication number 20180158757
- Publication date Jun 7, 2018
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

by direct electroplating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board comprising via

Method for manufacturing printed circuit board

Plated metallization structures

Single step electrolytic method of filling through holes in printed...

Asymmetrical electrolytic plating for a conductive pattern

Intermediate substrate and fabrication method thereof

Electromagnetic device and method for manufacturing the same

Method for forming circuits using seed layer and etchant compositio...

Method of manufacturing wafer level low melting temperature interco...

Silicone contact element

Leveler compositions for use in copper deposition in manufacture of...

Method for electrically contacting a component by galvanic connecti...

Circuit board, laminated circuit board, and method of manufacturing...

Electronic assembly that includes void free holes

Printed circuit boards with thick-wall vias

Inductor built-in substrate

Ceramic circuit plate and method of making same

Semiconductor manufacturing apparatus

Forming conductive vias using a light guide

Plated metallization structures

Zero-misalignment via-pad structures

Non-planar on-package via capacitor

Copper electroplating baths containing compounds of reaction produc...

Wiring substrate

Leveler compositions for use in copper deposition in manufacture of...

Method of manufacturing wafer level low melting temperature interco...

Ceramic circuit plate and method of making same

Printed wiring board

Method of manufacturing a PCB including a thick-wall via

Method for manufacturing traces of PCB

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING

Single Step Electrolytic Method of Filling Through-Holes in Printed...

BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...

ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN

PRINTED WIRING BOARD

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...

INTERMEDIATE SUBSTRATE AND FABRICATION METHOD THEREOF

Leveler Compositions for use in Copper Deposition in Manufacture of...

SILICONE CONTACT ELEMENT

CIRCUIT BOARD, LAMINATED CIRCUIT BOARD, AND METHOD OF MANUFACTURING...

METHOD FOR FORMING CIRCUITS USING SEED LAYER AND ETCHANT COMPOSITIO...

EMBEDDED CIRCUIT BOARD AND METHOD OF MAKING SAME

CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

Leveler Compositions for use in Copper Deposition in Manufacture of...

ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN

WIRING SUBSTRATE

PRINTED CIRCUIT BOARDS WITH THICK-WALL VIAS

ELECTROMAGNETIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING TRACES OF PCB

METHOD FOR MANUFACTURING TRACES OF PCB

ELECTRONIC ASSEMBLY THAT INCLUDES VOID FREE HOLES

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

METHOD FOR ELECTRICALLY CONTACTING A COMPONENT BY GALVANIC CONNECTI...