by direct patterning

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CPC
C23C18/1607

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CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating Contact plating

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C23C18/1607by direct patterning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stress patterning systems and methods for manufacturing free-form d...
- Patent number 11,879,170
- Issue date Jan 23, 2024
- Massachusetts Institute of Technology
- Youwei Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 11,856,694
- Issue date Dec 26, 2023
- National Taiwan University of Science and Technology
- Chen-Hao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metalization of surfaces
- Patent number 10,774,424
- Issue date Sep 15, 2020
- Cuptronic Technology Ltd.
- Björn Atthoff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating polydopamine nanoparticles
- Patent number 10,760,162
- Issue date Sep 1, 2020
- The Research Foundation for the State University of New York
- Siyuan Ma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor devices comprising nickel— and copper—containing inte...
- Patent number 10,446,440
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Salman Akram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing planar coil
- Patent number 10,354,796
- Issue date Jul 16, 2019
- TDK Corporation
- Yuhei Horikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing patterned metallic coatings
- Patent number 10,323,324
- Issue date Jun 18, 2019
- Leibniz-Institut fuer neue Materialien Gemeinnuetzige GmbH
- Peter William de Oliveira
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating polydopamine nanoparticles
- Patent number 10,294,567
- Issue date May 21, 2019
- The Research Foundation for the State University of New York
- Siyuan Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit substrate containing photoimageable dielectric m...
- Patent number 10,190,218
- Issue date Jan 29, 2019
- TWISDEN LTD.
- Loke Chew Low
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices comprising nickel- and copper-containing inte...
- Patent number 10,062,608
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method for printed layer
- Patent number 9,951,424
- Issue date Apr 24, 2018
- HOEY CO., LTD.
- Joseph Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming interconnects and semiconductor structures
- Patent number 9,640,433
- Issue date May 2, 2017
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stable catalysts for electroless metallization
- Patent number 9,597,676
- Issue date Mar 21, 2017
- Rohm and Haas Electronic Materials LLC
- Feng Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a metal silicide using a solution containing gol...
- Patent number 9,564,333
- Issue date Feb 7, 2017
- Alchimer
- Vincent Mevellec
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless copper deposition on laser-direct structure...
- Patent number 9,538,665
- Issue date Jan 3, 2017
- Edwin W. Bastenbeck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stable catalysts for electroless metallization
- Patent number 9,441,300
- Issue date Sep 13, 2016
- Rohm and Haas Electronic Materials LLC
- Feng Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating solution for forming fine gold structure,...
- Patent number 9,345,145
- Issue date May 17, 2016
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition of platinum on copper
- Patent number 9,023,137
- Issue date May 5, 2015
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of metal on plastic substrates
- Patent number 8,974,860
- Issue date Mar 10, 2015
- Robert Hamilton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallization mixtures and electronic devices
- Patent number 8,970,027
- Issue date Mar 3, 2015
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of providing liquid material to selected regions of semicon...
- Patent number 8,790,955
- Issue date Jul 29, 2014
- Massachusetts Institute of Technology
- Emanuel M. Sachs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming interconnects in a semiconductor structure
- Patent number 8,647,982
- Issue date Feb 11, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced methods for fabricating solar cells with textured surfaces
- Patent number 8,569,099
- Issue date Oct 29, 2013
- Massachusetts Institute of Technology
- Emanuel M. Sachs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition of platinum on copper
- Patent number 8,545,998
- Issue date Oct 1, 2013
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallization processes, mixtures, and electronic devices
- Patent number 8,518,826
- Issue date Aug 27, 2013
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping before barrier-removal IC fabrication method
- Patent number 8,415,261
- Issue date Apr 9, 2013
- Novellus Systems, Inc.
- Jonathan D. Reid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solar cells with textured surfaces
- Patent number 8,257,998
- Issue date Sep 4, 2012
- Massachusetts Institute of Technology
- Emanuel M. Sachs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating solution, method for electroless plating using...
- Patent number 8,197,583
- Issue date Jun 12, 2012
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating solution, method for electroless plating using...
- Patent number 8,137,447
- Issue date Mar 20, 2012
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 8,065,794
- Issue date Nov 29, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
GAS SENSOR WITH SUPERLATTICE STRUCTURE
- Publication number 20230243770
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Archana VENUGOPAL
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210392747
- Publication date Dec 16, 2021
- National Taiwan University of Science and Technology
- Chen-Hao Wang
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
STRESS PATTERNING SYSTEMS AND METHODS FOR MANUFACTURING FREE-FORM D...
- Publication number 20210047729
- Publication date Feb 18, 2021
- Massachusetts Institute of Technology
- Youwei Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES
- Publication number 20200157684
- Publication date May 21, 2020
- The Research Foundation for The State University of New York
- Siyuan Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...
- Publication number 20180358263
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Circuit Substrate Containing Photoimageable Dielectric M...
- Publication number 20180209046
- Publication date Jul 26, 2018
- Twisden Ltd.
- Loke Chew Low
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES
- Publication number 20160168715
- Publication date Jun 16, 2016
- The Research Foundation for The State University of New York
- Siyuan Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURES HAVING SELECTIVELY METALLIZED REGIONS AND METHODS OF MAN...
- Publication number 20150176132
- Publication date Jun 25, 2015
- HRL LABORATORIES, LLC
- Jacob M. Hundley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STABLE CATALYSTS FOR ELECTROLESS METALLIZATION
- Publication number 20140272144
- Publication date Sep 18, 2014
- Feng LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOS...
- Publication number 20140255600
- Publication date Sep 11, 2014
- Enthone Inc.
- Edwin W. Bastenbeck
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR FORMING CONDUCTIVE FILM AT ROOM TEMPERATURE
- Publication number 20140161972
- Publication date Jun 12, 2014
- NATIONAL SUN YAT-SEN UNIVERSITY
- Teng-yuan Dong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES
- Publication number 20140154879
- Publication date Jun 5, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF PROVIDING LIQUID MATERIAL TO SELECTED REGIONS OF SEMICON...
- Publication number 20140141561
- Publication date May 22, 2014
- Massachusetts Institute of Technology
- Emanuel M. Sachs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR FABRICATING NANOGAP ELECTRODES, NANOGAP ELECTRODES ARRAY...
- Publication number 20140054788
- Publication date Feb 27, 2014
- Japan Science and Technology Agency
- Yutaka Majima
- B82 - NANO-TECHNOLOGY
Information Patent Application
METALLIZATION MIXTURES AND ELECTRONIC DEVICES
- Publication number 20140034370
- Publication date Feb 6, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless Deposition of Platinum on Copper
- Publication number 20130340648
- Publication date Dec 26, 2013
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Filling Voids in Copper Structures
- Publication number 20130108779
- Publication date May 2, 2013
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLAR CELLS WITH TEXTURED SURFACES
- Publication number 20130045561
- Publication date Feb 21, 2013
- Massachusetts Institute of Technology
- Emanuel M. Sachs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING
- Publication number 20120321781
- Publication date Dec 20, 2012
- Elisabeth Zettelmeyer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Metallising Objects Which Have at Least Two Different Pl...
- Publication number 20120305406
- Publication date Dec 6, 2012
- Atotech Deutschland GmbH
- Arnaldo Pereira
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS
- Publication number 20120279867
- Publication date Nov 8, 2012
- LPKF Laser & Electronics AG
- Bernd Lange
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF MULTI-SHOT INJECTION MOLDING AND METAL-PLATED MULTI-LAYE...
- Publication number 20120156442
- Publication date Jun 21, 2012
- David Reeder
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHODS OF MULTI-SHOT INJECTION MOLDING AND METAL-PLATED SURFACE CO...
- Publication number 20120156443
- Publication date Jun 21, 2012
- David Reeder
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE,...
- Publication number 20120119352
- Publication date May 17, 2012
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Deposition of Platinum on Copper
- Publication number 20120091590
- Publication date Apr 19, 2012
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING...
- Publication number 20120058254
- Publication date Mar 8, 2012
- C. Uyemura & Co., Ltd.
- TERUYUKI HOTTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METALLIZATION PROCESSES, MIXTURES, AND ELECTRONIC DEVICES
- Publication number 20120013008
- Publication date Jan 19, 2012
- Artur Kolics
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS PLATING SOLUTION FOR PROVIDING SOLAR CELL ELECTRODE
- Publication number 20110192316
- Publication date Aug 11, 2011
- E-CHEM ENTERPRISE CORP.
- Chia Wei CHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PREPARING SUBSTRATES CONTAINING POLYMERS FOR METALLIZATION
- Publication number 20110064870
- Publication date Mar 17, 2011
- Rohm and Haas Electronic Materials L.L.C.
- Crystal P. L. LI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...
- Publication number 20110051387
- Publication date Mar 3, 2011
- Sumitomo Bakelite Company, Ltd.
- Kenya TACHIBANA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

by direct patterning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stress patterning systems and methods for manufacturing free-form d...

Circuit substrate and method for manufacturing the same

Metalization of surfaces

Electroless copper plating polydopamine nanoparticles

Semiconductor devices comprising nickel— and copper—containing inte...

Method for manufacturing planar coil

Method for producing patterned metallic coatings

Electroless copper plating polydopamine nanoparticles

Integrated circuit substrate containing photoimageable dielectric m...

Semiconductor devices comprising nickel- and copper-containing inte...

Plating method for printed layer

Methods of forming interconnects and semiconductor structures

Stable catalysts for electroless metallization

Method for forming a metal silicide using a solution containing gol...

Process for electroless copper deposition on laser-direct structure...

Stable catalysts for electroless metallization

Electroless gold plating solution for forming fine gold structure,...

Electroless deposition of platinum on copper

Selective deposition of metal on plastic substrates

Metallization mixtures and electronic devices

Methods of providing liquid material to selected regions of semicon...

Methods of forming interconnects in a semiconductor structure

Enhanced methods for fabricating solar cells with textured surfaces

Electroless deposition of platinum on copper

Metallization processes, mixtures, and electronic devices

Capping before barrier-removal IC fabrication method

Solar cells with textured surfaces

Electroless plating solution, method for electroless plating using...

Electroless plating solution, method for electroless plating using...

Printed wiring board and its manufacturing method

Patents Applicationslast 30 patents

GAS SENSOR WITH SUPERLATTICE STRUCTURE

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

STRESS PATTERNING SYSTEMS AND METHODS FOR MANUFACTURING FREE-FORM D...

ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES

SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...

Integrated Circuit Substrate Containing Photoimageable Dielectric M...

ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES

STRUCTURES HAVING SELECTIVELY METALLIZED REGIONS AND METHODS OF MAN...

STABLE CATALYSTS FOR ELECTROLESS METALLIZATION

AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOS...

METHOD FOR FORMING CONDUCTIVE FILM AT ROOM TEMPERATURE

METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES

METHODS OF PROVIDING LIQUID MATERIAL TO SELECTED REGIONS OF SEMICON...

METHOD FOR FABRICATING NANOGAP ELECTRODES, NANOGAP ELECTRODES ARRAY...

METALLIZATION MIXTURES AND ELECTRONIC DEVICES

Electroless Deposition of Platinum on Copper

Methods of Filling Voids in Copper Structures

SOLAR CELLS WITH TEXTURED SURFACES

PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING

Method for Metallising Objects Which Have at Least Two Different Pl...

METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS

METHODS OF MULTI-SHOT INJECTION MOLDING AND METAL-PLATED MULTI-LAYE...

METHODS OF MULTI-SHOT INJECTION MOLDING AND METAL-PLATED SURFACE CO...

ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE,...

Electroless Deposition of Platinum on Copper

ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING...

METALLIZATION PROCESSES, MIXTURES, AND ELECTRONIC DEVICES

ELECTROLESS PLATING SOLUTION FOR PROVIDING SOLAR CELL ELECTRODE

PREPARING SUBSTRATES CONTAINING POLYMERS FOR METALLIZATION

METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...