by exposure and development of a photosensitive insulating layer

Industry

CPC
H05K3/0023

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0023by exposure and development of a photosensitive insulating layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2D and 3D inductors fabricating photoactive substrates
- Patent number 11,929,199
- Issue date Mar 12, 2024
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive insulating paste and electronic component
- Patent number 11,886,114
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Kenta Kondo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma ashing for coated devices
- Patent number 11,849,543
- Issue date Dec 19, 2023
- Sean Clancy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetrical electrolytic plating for a conductive pattern
- Patent number 11,716,819
- Issue date Aug 1, 2023
- AVERATEK CORPORATION
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Impedence matching conductive structure for high efficiency RF circ...
- Patent number 11,677,373
- Issue date Jun 13, 2023
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board, method for manufacturing the same
- Patent number 11,606,862
- Issue date Mar 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Po-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern formation method, laminate, and method of producing touch p...
- Patent number 11,567,410
- Issue date Jan 31, 2023
- FUJIFILM Corporation
- Shinichi Kanna
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Implantable flexible neural microelectrode comb, and preparation me...
- Patent number 11,369,302
- Issue date Jun 28, 2022
- National Center for Nanoscience and Technology, China
- Ying Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask structure and manufacturing method thereof
- Patent number 11,366,381
- Issue date Jun 21, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method of making printed circuit board and laminated structure
- Patent number 11,343,918
- Issue date May 24, 2022
- Sumitomo Electric Industries, Ltd.
- Shigeaki Uemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,291,126
- Issue date Mar 29, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 11,191,164
- Issue date Nov 30, 2021
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor trace structure reducing insertion loss of circuit board
- Patent number 11,178,773
- Issue date Nov 16, 2021
- Sheng-Kun Lan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF integrated power condition capacitor
- Patent number 11,076,489
- Issue date Jul 27, 2021
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method of same
- Patent number 11,075,635
- Issue date Jul 27, 2021
- Jian Hu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,999,935
- Issue date May 4, 2021
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Asymmetric electronic substrate and method of manufacture
- Patent number 10,980,129
- Issue date Apr 13, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wiring board, and wiring board
- Patent number 10,905,012
- Issue date Jan 26, 2021
- Ushio Denki Kabushiki Kaisha
- Tomoyuki Habu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical processing apparatus, method for optical processed object
- Patent number 10,814,423
- Issue date Oct 27, 2020
- Ricoh Company, Limited
- Hiroyuki Suhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezochromic stamp
- Patent number 10,813,223
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,813,231
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,798,825
- Issue date Oct 6, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hye-Jin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates for stretchable electronics and method of manufacture
- Patent number 10,736,212
- Issue date Aug 4, 2020
- ARES MATERIALS INC.
- Radu Reit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,729,014
- Issue date Jul 28, 2020
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2D and 3D inductors antenna and transformers fabricating photoactiv...
- Patent number 10,665,377
- Issue date May 26, 2020
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a fusion bonded circuit structure
- Patent number 10,667,410
- Issue date May 26, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, photosensitive element, cured pro...
- Patent number 10,656,521
- Issue date May 19, 2020
- Hitachi Chemical Company, Ltd.
- Tetsuya Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN
- Publication number 20230345642
- Publication date Oct 26, 2023
- Averatek Corporation
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20230303750
- Publication date Sep 28, 2023
- Showa Denko Materials Co., Ltd.
- Kohei OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230284394
- Publication date Sep 7, 2023
- Nitto Denko Corporation
- Naoki SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230276576
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20230199945
- Publication date Jun 22, 2023
- LG ENERGY SOLUTION, LTD.
- Ga Young WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE WHICH INCLUDE MULTI...
- Publication number 20230042852
- Publication date Feb 9, 2023
- HYEJIN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ENHANCING STRUCTURE AND MANUFACTURE METHOD THEREOF
- Publication number 20230012572
- Publication date Jan 19, 2023
- Unimicron Technology Corp.
- Tse-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH TEMPERATURE PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20220377904
- Publication date Nov 24, 2022
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220174822
- Publication date Jun 2, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- JUN DAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE DRY FILM, AND PRINTED WIRING BOARD WITH PHOTOSENSITI...
- Publication number 20220066322
- Publication date Mar 3, 2022
- TAMURA CORPORATION
- Ryoya TAKASHIMA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20220046801
- Publication date Feb 10, 2022
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220030724
- Publication date Jan 27, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- JUN DAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE AND A BONDING METHOD OF CIRCUIT BOARD
- Publication number 20210348037
- Publication date Nov 11, 2021
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Siheng GAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTOR TRACE STRUCTURE REDUCING INSERTION LOSS OF CIRCUIT BOARD
- Publication number 20210136919
- Publication date May 6, 2021
- SHENG-KUN LAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plasma Ashing for Coated Devices
- Publication number 20210127497
- Publication date Apr 29, 2021
- HZO, Inc.
- Sean Clancy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE INSULATING PASTE AND ELECTRONIC COMPONENT
- Publication number 20210096464
- Publication date Apr 1, 2021
- Murata Manufacturing Co., Ltd.
- Kenta KONDO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD OF MAKING PRINTED CIRCUIT BOARD AND LAMINATED STRUCTURE
- Publication number 20210045250
- Publication date Feb 11, 2021
- Sumitomo Electric Industries, Ltd.
- Shigeaki UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF INTEGRATED POWER CONDITION CAPACITOR
- Publication number 20200383209
- Publication date Dec 3, 2020
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
2D and 3D Inductors Antenna and Transformers Fabricating Photoactiv...
- Publication number 20200243248
- Publication date Jul 30, 2020
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE
- Publication number 20200221577
- Publication date Jul 9, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERN FORMATION METHOD, LAMINATE, AND METHOD OF PRODUCING TOUCH P...
- Publication number 20200159123
- Publication date May 21, 2020
- FUJIFILM CORPORATION
- Shinichi KANNA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200154574
- Publication date May 14, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hye-Jin KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
- Publication number 20200113061
- Publication date Apr 9, 2020
- Ushio Denki Kabushiki Kaisha
- Tomoyuki HABU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20200037455
- Publication date Jan 30, 2020
- Unimicron Technology Corp.
- Po-Hsuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN
- Publication number 20190394887
- Publication date Dec 26, 2019
- Averatek Corporation
- Michael Riley Vinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20190373737
- Publication date Dec 5, 2019
- Unimicron Technology Corp.
- Po-Hsuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE FLEXIBLE NEURAL MICROELECTRODE COMB, AND PREPARATION ME...
- Publication number 20190313933
- Publication date Oct 17, 2019
- National Center for Nanoscience and Technology, China
- Ying FANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND C...
- Publication number 20190278180
- Publication date Sep 12, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Masatoshi ECHIGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

by exposure and development of a photosensitive insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring structure and method of manufacturing the same, semiconducto...

2D and 3D inductors fabricating photoactive substrates

Photosensitive insulating paste and electronic component

Circuit board and method of manufacturing circuit board

Plasma ashing for coated devices

Multilayer coil circuit substrate

Asymmetrical electrolytic plating for a conductive pattern

Impedence matching conductive structure for high efficiency RF circ...

Circuit board, method for manufacturing the same

Pattern formation method, laminate, and method of producing touch p...

Implantable flexible neural microelectrode comb, and preparation me...

Mask structure and manufacturing method thereof

Method of making printed circuit board and laminated structure

Circuit board and method of manufacturing circuit board

Wiring structure and method of manufacturing the same, semiconducto...

Conductor trace structure reducing insertion loss of circuit board

RF integrated power condition capacitor

Display device and manufacturing method of same

Manufacturing method of circuit board

Asymmetric electronic substrate and method of manufacture

Method for producing wiring board, and wiring board

Optical processing apparatus, method for optical processed object

Piezochromic stamp

Method for manufacturing circuit board

Printed circuit board

Substrates for stretchable electronics and method of manufacture

Method for manufacturing circuit board

2D and 3D inductors antenna and transformers fabricating photoactiv...

Method of making a fusion bonded circuit structure

Photosensitive resin composition, photosensitive element, cured pro...

Patents Applicationslast 30 patents

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE WHICH INCLUDE MULTI...

CIRCUIT BOARD ENHANCING STRUCTURE AND MANUFACTURE METHOD THEREOF

HIGH TEMPERATURE PRINTED CIRCUIT BOARD SUBSTRATE

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

PHOTOSENSITIVE DRY FILM, AND PRINTED WIRING BOARD WITH PHOTOSENSITI...

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

CONDUCTIVE ADHESIVE AND A BONDING METHOD OF CIRCUIT BOARD

CONDUCTOR TRACE STRUCTURE REDUCING INSERTION LOSS OF CIRCUIT BOARD

Plasma Ashing for Coated Devices

PHOTOSENSITIVE INSULATING PASTE AND ELECTRONIC COMPONENT

METHOD OF MAKING PRINTED CIRCUIT BOARD AND LAMINATED STRUCTURE

RF INTEGRATED POWER CONDITION CAPACITOR

2D and 3D Inductors Antenna and Transformers Fabricating Photoactiv...

ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE

PATTERN FORMATION METHOD, LAMINATE, AND METHOD OF PRODUCING TOUCH P...

PRINTED CIRCUIT BOARD

METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

METHOD FOR MANUFACTURING CIRCUIT BOARD

ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN

METHOD FOR MANUFACTURING CIRCUIT BOARD

IMPLANTABLE FLEXIBLE NEURAL MICROELECTRODE COMB, AND PREPARATION ME...

COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND C...