by filling grooves in the support with conductive material

Industry

CPC
H05K3/107

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/107by filling grooves in the support with conductive material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring formation method and transfer mold manufacturing method
- Patent number 12,181,796
- Issue date Dec 31, 2024
- CONNECTEC JAPAN CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for holding a heat generating device
- Patent number 12,080,624
- Issue date Sep 3, 2024
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods to improve thermal conduction from SMT and chip...
- Patent number 12,082,334
- Issue date Sep 3, 2024
- Hamilton Sundstrand Corporation
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method of manufacturing the interposer
- Patent number 12,014,935
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,016,125
- Issue date Jun 18, 2024
- Daikin Industries, Ltd.
- Mitsuhiro Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of printed circuit board dielectric molding and electrolytic...
- Patent number 12,004,306
- Issue date Jun 4, 2024
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2D and 3D inductors fabricating photoactive substrates
- Patent number 11,929,199
- Issue date Mar 12, 2024
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern transfer printing systems and methods
- Patent number 11,910,537
- Issue date Feb 20, 2024
- Wuhan DR Laser Technology Corp,. LTD
- Gad Igra
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Soldering structure with groove portion and power module comprising...
- Patent number 11,862,537
- Issue date Jan 2, 2024
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, maintenance method and display device
- Patent number 11,864,326
- Issue date Jan 2, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hongda Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer wiring substrate, method of manufacturing same, and prob...
- Patent number 11,852,655
- Issue date Dec 26, 2023
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board assembly
- Patent number 11,825,595
- Issue date Nov 21, 2023
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin composite transparent conductive film and preparation me...
- Patent number 11,805,598
- Issue date Oct 31, 2023
- IVTOUCH CO., LTD
- Xiaohong Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board
- Patent number 11,792,916
- Issue date Oct 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Han Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for holding a heat generating device
- Patent number 11,776,874
- Issue date Oct 3, 2023
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board production method and wiring board
- Patent number 11,711,895
- Issue date Jul 25, 2023
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedence matching conductive structure for high efficiency RF circ...
- Patent number 11,677,373
- Issue date Jun 13, 2023
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,665,833
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,602,054
- Issue date Mar 7, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,553,601
- Issue date Jan 10, 2023
- Ibiden Co., Ltd.
- Kazuyuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal-based flexible electronic device and preparation metho...
- Patent number 11,490,524
- Issue date Nov 1, 2022
- Harbin Institute of Technology
- Liang Feng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier for electrical/electronic parts for attachment in...
- Patent number 11,401,740
- Issue date Aug 2, 2022
- Kiekert AG
- Sascha Maciolowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD
- Publication number 20240431034
- Publication date Dec 26, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...
- Publication number 20240349425
- Publication date Oct 17, 2024
- TDK Corporation
- Yoshihisa TAMAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Sensor Comprising at Least Two Separate...
- Publication number 20240224429
- Publication date Jul 4, 2024
- LINXENS HOLDING
- Catheline Ramsamy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE WITH CIRCUIT BEARING DIELECTRIC L...
- Publication number 20240196542
- Publication date Jun 13, 2024
- LCP Medical Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240179830
- Publication date May 30, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Woong Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PALLADIUM PLATING CATALYST LAYER BY LASER INDUCED FORWARD TRANSFER
- Publication number 20240179847
- Publication date May 30, 2024
- STMicroelectronics S.r.l.
- Paolo CREMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM
- Publication number 20240091528
- Publication date Mar 21, 2024
- ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Florian FALLEGGER
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT BOARD
- Publication number 20240057253
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Sang Myung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...
- Publication number 20240057263
- Publication date Feb 15, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20240040687
- Publication date Feb 1, 2024
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING FORMATION METHOD AND TRANSFER MOLD MANUFACTURING METHOD
- Publication number 20240032205
- Publication date Jan 25, 2024
- CONNECTEC JAPAN Corporation
- Hiroshi KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedence Matching Conductive Structure for High Efficiency RF Circ...
- Publication number 20240014794
- Publication date Jan 11, 2024
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methods of Forming Bent Display Panels
- Publication number 20230352497
- Publication date Nov 2, 2023
- Apple Inc.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Holding a Heat Generating Device
- Publication number 20230343675
- Publication date Oct 26, 2023
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS TO IMPROVE THERMAL CONDUCTION FROM SMT AND CHIP...
- Publication number 20230337353
- Publication date Oct 19, 2023
- HAMILTON SUNDSTRAND CORPORATION
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20230319999
- Publication date Oct 5, 2023
- KYOCERA CORPORATION
- Keisaku MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230318171
- Publication date Oct 5, 2023
- STMicroelectronics (Grenoble 2) SAS
- Olivier Ptak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND RESONATO...
- Publication number 20230292441
- Publication date Sep 14, 2023
- SEIKO EPSON CORPORATION
- Koji Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20230171875
- Publication date Jun 1, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED DEPOSITION METHOD OF A DONOR MATERIAL ONTO A TARGET SURF...
- Publication number 20230156926
- Publication date May 18, 2023
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230144361
- Publication date May 11, 2023
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...
- Publication number 20230125061
- Publication date Apr 20, 2023
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230113278
- Publication date Apr 13, 2023
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS
- Publication number 20230074639
- Publication date Mar 9, 2023
- CREATIVE IC3D LTD.
- Yacov MAZUZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20230065796
- Publication date Mar 2, 2023
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MANUFACTURING METHOD FOR SELF-ASSEMBLY TO ANOTHE...
- Publication number 20230061111
- Publication date Mar 2, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Alice Bond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH EMBOSSED METALIZED CIRCUIT TRACES
- Publication number 20230047568
- Publication date Feb 16, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by filling grooves in the support with conductive material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring formation method and transfer mold manufacturing method

Printed circuit board

Wiring substrate and method for manufacturing wiring substrate

Apparatus and method for holding a heat generating device

Devices and methods to improve thermal conduction from SMT and chip...

Ceramic-based circuit board assemblies formed using metal nanoparti...

Interposer and method of manufacturing the interposer

Electronic component and method for manufacturing electronic component

Method of printed circuit board dielectric molding and electrolytic...

Method for manufacturing transparent circuit board

2D and 3D inductors fabricating photoactive substrates

Pattern transfer printing systems and methods

High-density soft-matter electronics

Soldering structure with groove portion and power module comprising...

Substrate, maintenance method and display device

Multilayer wiring substrate, method of manufacturing same, and prob...

Manufacturing method of circuit board assembly

Ultra-thin composite transparent conductive film and preparation me...

Printed circuit board

Apparatus and method for holding a heat generating device

Wiring board production method and wiring board

Impedence matching conductive structure for high efficiency RF circ...

Circuit board and manufacturing method thereof

Method of fabricating a glass substrate with a plurality of vias

Circuit board and method for manufacturing the same

Wiring board and method for manufacturing the same

Application specific electronics packaging systems, methods and dev...

Liquid metal-based flexible electronic device and preparation metho...

Catalytic laminate with conductive traces formed during lamination

Component carrier for electrical/electronic parts for attachment in...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD

ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

PRINTED WIRING BOARD

Method for Manufacturing a Sensor Comprising at Least Two Separate...

TRANSPARENT CIRCUIT BOARD

ELECTRICAL INTERCONNECT STRUCTURE WITH CIRCUIT BEARING DIELECTRIC L...

PRINTED CIRCUIT BOARD

PALLADIUM PLATING CATALYST LAYER BY LASER INDUCED FORWARD TRANSFER

HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM

CIRCUIT BOARD

METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...

CIRCUIT BOARD ASSEMBLY

WIRING FORMATION METHOD AND TRANSFER MOLD MANUFACTURING METHOD

Impedence Matching Conductive Structure for High Efficiency RF Circ...

Methods of Forming Bent Display Panels

Apparatus and Method for Holding a Heat Generating Device

DEVICES AND METHODS TO IMPROVE THERMAL CONDUCTION FROM SMT AND CHIP...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ELECTRONIC DEVICE

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND RESONATO...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CONTROLLED DEPOSITION METHOD OF A DONOR MATERIAL ONTO A TARGET SURF...

WIRING SUBSTRATE

INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

ELECTRONIC CIRCUIT MANUFACTURING METHOD FOR SELF-ASSEMBLY TO ANOTHE...

PRINTED CIRCUIT BOARDS WITH EMBOSSED METALIZED CIRCUIT TRACES