By forming conductive members before deposition of protective insulating material

Industry

CPC
H01L21/76885

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76885By forming conductive members before deposition of protective insulating material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power rail and signal conducting line arrangement
- Patent number 11,967,596
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse selective etch stop layer
- Patent number 11,955,382
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection cell and antenna integrated with...
- Patent number 11,942,441
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,942,442
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-type semiconductor memory device
- Patent number 11,943,917
- Issue date Mar 26, 2024
- Kioxia Corporation
- Satoshi Nagashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power cell for semiconductor devices
- Patent number 11,929,360
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching platinum-containing thin film using protective cap layer
- Patent number 11,929,423
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Sebastian Meier
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for preparing semiconductor structure and semiconductor stru...
- Patent number 11,929,282
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhaopei Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via CD controllable top via structure
- Patent number 11,923,246
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,923,304
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with isolation trenches in upper portions o...
- Patent number 11,925,037
- Issue date Mar 5, 2024
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 11,908,789
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,908,796
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin patterning for advanced integrated circuit structure fabrication
- Patent number 11,881,520
- Issue date Jan 23, 2024
- Intel Corporation
- Curtis Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a support pattern on a lower electr...
- Patent number 11,875,992
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Hyun-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,875,987
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including enlarged via and fully aligned...
- Patent number 11,876,017
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Tae Yong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring formation method, method for manufacturing semiconductor dev...
- Patent number 11,869,866
- Issue date Jan 9, 2024
- Kioxia Corporation
- Ryoichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
- Publication number 20240145376
- Publication date May 2, 2024
- International Business Machines Corporation
- Rajiv Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED GATE TOP CD WITH WRAP-AROUND GATE CONTACT
- Publication number 20240128345
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTR...
- Publication number 20240120196
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyun-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
- Publication number 20240113024
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240096642
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVIC...
- Publication number 20240096644
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Koki UEHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240096797
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- MINJAE KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240087956
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Woojin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240087895
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION INTERCONNECT
- Publication number 20240079357
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...
- Publication number 20240079321
- Publication date Mar 7, 2024
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK, METHOD OF MANUFACTURING...
- Publication number 20240071842
- Publication date Feb 29, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsai-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071502
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK AND SYSTEM FOR MANUFACTUR...
- Publication number 20240071843
- Publication date Feb 29, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsai-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE STRUCTURE FOR IMPROVED CURRENT DENSITY IN HR DEVICES
- Publication number 20240063118
- Publication date Feb 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- William Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTIVE INTERCONNECT STRUCTURE
- Publication number 20240038589
- Publication date Feb 1, 2024
- IMEC vzw
- Anna Yurievna HERR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240038665
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20240030133
- Publication date Jan 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20240030132
- Publication date Jan 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240006238
- Publication date Jan 4, 2024
- SK HYNIX INC.
- Seiyon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420402
- Publication date Dec 28, 2023
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20230420545
- Publication date Dec 28, 2023
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXYGEN-FREE ETCHING OF NON-VOLATILE METALS
- Publication number 20230420267
- Publication date Dec 28, 2023
- TOKYO ELECTRON LIMITED
- Stephanie Oyola-Reynoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...
- Publication number 20230411284
- Publication date Dec 21, 2023
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS

By forming conductive members before deposition of protective insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked via structure

Power rail and signal conducting line arrangement

Package component with stepped passivation layer

Solderless interconnection structure and method of forming same

Dual metal gate structure having portions of metal gate layers in c...

Heterogeneous metal line compositions for advanced integrated circu...

Etch damage and ESL free dual damascene metal interconnect

Reverse selective etch stop layer

Trench contact structures for advanced integrated circuit structure...

Electrostatic discharge protection cell and antenna integrated with...

Package structure and manufacturing method thereof

Stacked-type semiconductor memory device

Power cell for semiconductor devices

Via connection to a partially filled trench

Etching platinum-containing thin film using protective cap layer

Method for preparing semiconductor structure and semiconductor stru...

Via CD controllable top via structure

Electro-migration barrier for interconnect

Microelectronic devices with isolation trenches in upper portions o...

Selective formation of conductor nanowires

Semiconductor device and method of fabricating the same

Contact pad for semiconductor device

Conductive traces in semiconductor devices and methods of forming same

Semiconductor device with edge-protecting spacers over bonding pad

Fin patterning for advanced integrated circuit structure fabrication

Semiconductor devices including a support pattern on a lower electr...

Contacts having a geometry to reduce resistance

Integrated circuit devices including enlarged via and fully aligned...

Method for fabricating interconnection using graphene

Wiring formation method, method for manufacturing semiconductor dev...

Patents Applicationslast 30 patents

DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT

REDUCED GATE TOP CD WITH WRAP-AROUND GATE CONTACT

SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTR...

MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER

METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME

PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVIC...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

MULTI-LAYER LINE STRUCTURE

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME

POST PASSIVATION INTERCONNECT

SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...

SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK, METHOD OF MANUFACTURING...

STAIRCASE FORMATION IN A MEMORY ARRAY

SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK AND SYSTEM FOR MANUFACTUR...

BACK END OF LINE STRUCTURE FOR IMPROVED CURRENT DENSITY IN HR DEVICES

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SUPERCONDUCTIVE INTERCONNECT STRUCTURE

INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

DEVICES WITH REDUCED CAPACITANCES

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

OXYGEN-FREE ETCHING OF NON-VOLATILE METALS

SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...