By forming conductive members before deposition of protective insulating material

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CPC
H01L21/76885

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76885By forming conductive members before deposition of protective insulating material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,165,913
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Suli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, semiconductor element group, and method of m...
- Patent number 12,148,662
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Satoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated fan-out packages with built-in heat sink
- Patent number 12,148,661
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned gratings for tight pitch interconnects and methods of...
- Patent number 12,131,991
- Issue date Oct 29, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device suppressing leakage current...
- Patent number 12,125,785
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Junghoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with dielectric fe...
- Patent number 12,107,006
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnection structure and method for forming the same
- Patent number 12,100,652
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zhang-Ying Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,094,823
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line single damascene top via spacer defined by pillar...
- Patent number 12,094,774
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with air gap
- Patent number 12,087,620
- Issue date Sep 10, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via to metal line for interconnect
- Patent number 12,080,640
- Issue date Sep 3, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods of forming the same
- Patent number 12,080,646
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with silicide p...
- Patent number 12,080,598
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,074,060
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,068,254
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut and fin trim isolation for advanced integrated circuit str...
- Patent number 12,057,492
- Issue date Aug 6, 2024
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line structure and method
- Patent number 12,051,646
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor structures and semiconductor stru...
- Patent number 12,051,618
- Issue date Jul 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Nianwang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with reduced capacitances
- Patent number 12,046,506
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...
- Publication number 20240420999
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Myung Ok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387383
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240379548
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240379437
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LINES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240379418
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379558
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS
- Publication number 20240371770
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371690
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FEATURE
- Publication number 20240371692
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Chuan YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240363535
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...
- Publication number 20240355727
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...
- Publication number 20240355499
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- CHANG SEOK LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20240347445
- Publication date Oct 17, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240332399
- Publication date Oct 3, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE FOR ADVANCED INTERCONNECT
- Publication number 20240304547
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20240290656
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240290718
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240282700
- Publication date Aug 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Li Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METAL VIA WITH METAL BRIDGE
- Publication number 20240282704
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT
- Publication number 20240274607
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...
- Publication number 20240266293
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...
- Publication number 20240266294
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS O...
- Publication number 20240251570
- Publication date Jul 25, 2024
- Lodestar Licensing Group LLC
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20240234347
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS

By forming conductive members before deposition of protective insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating redistribution circuit structure

Method for manufacturing semiconductor device and semiconductor device

Semiconductor structure and method for forming the same

Chemical direct pattern plating method

Semiconductor element, semiconductor element group, and method of m...

Method of forming integrated fan-out packages with built-in heat sink

Multi-chip integrated fan-out package

Contact over active gate structures for advanced integrated circuit...

Integrated fan-out package and the methods of manufacturing

Self aligned gratings for tight pitch interconnects and methods of...

Semiconductor integrated circuit device suppressing leakage current...

Semiconductor package with dual sides of metal routing

Method for manufacturing semiconductor structure with dielectric fe...

Method for forming chip package structure

Multilevel interconnection structure and method for forming the same

Interconnection structure and methods of forming the same

Interconnect structure and methods of forming the same

Back-end-of-line single damascene top via spacer defined by pillar...

Semiconductor device structure with air gap

Self-aligned via to metal line for interconnect

Semiconductor structures and methods of forming the same

Method for preparing semiconductor device structure with silicide p...

Semiconductor device structure and methods of forming the same

Interconnection structure and methods of forming the same

Semiconductor device having via sidewall adhesion with encapsulant

Integrated fan-out packaging

Gate cut and fin trim isolation for advanced integrated circuit str...

Metal line structure and method

Methods for forming semiconductor structures and semiconductor stru...

Devices with reduced capacitances

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

SEMICONDUCTOR STRUCTURE

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

SELF-ALIGNED LINES AND METHODS FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FEATURE

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...

SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...

INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

WIRING STRUCTURE FOR ADVANCED INTERCONNECT

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SUBTRACTIVE METAL VIA WITH METAL BRIDGE

POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT

SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...

SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...

MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS O...

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...