by forming openings in dielectrics

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CPC
H01L21/76802

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76802by forming openings in dielectrics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure having air gap and method for manufacturi...
- Patent number 12,272,636
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck structure with holes in upper surface to improve temper...
- Patent number 12,272,585
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor memory device
- Patent number 12,272,646
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with top electrode via
- Patent number 12,274,183
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ku
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with identification structure, method for manu...
- Patent number 12,272,643
- Issue date Apr 8, 2025
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 12,266,604
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for forming the same
- Patent number 12,266,602
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact formed using bottom-...
- Patent number 12,266,688
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarging contact area and process window for a contact via
- Patent number 12,266,563
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact resistance between via and conductive line
- Patent number 12,266,566
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 12,266,571
- Issue date Apr 1, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,261,124
- Issue date Mar 25, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with etch stop layers for advan...
- Patent number 12,261,122
- Issue date Mar 25, 2025
- Intel Corporation
- Atul Madhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,095
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned active regions and passivation layer and methods of ma...
- Patent number 12,255,236
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a thermal conductive layer a...
- Patent number 12,249,555
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having integrated magnetic core inductors
- Patent number 12,249,584
- Issue date Mar 11, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside via
- Patent number 12,249,575
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and barrier layer in dual damascene cu interconnect for enhan...
- Patent number 12,243,773
- Issue date Mar 4, 2025
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Zhaosheng Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,815
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure having raised via...
- Patent number 12,243,826
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,237,342
- Issue date Feb 25, 2025
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,237,213
- Issue date Feb 25, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Libin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 12,237,214
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymerization protective liner for reactive ion etch in patterning
- Patent number 12,237,175
- Issue date Feb 25, 2025
- Lam Research Corporation
- Bhaskar Nagabhirava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising multilevel bitlines, and related meth...
- Patent number 12,237,259
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,230,534
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250118600
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250118595
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR INTERCONNECTS
- Publication number 20250112156
- Publication date Apr 3, 2025
- Intel Corporation
- Gowtham Sriram JAWAHARRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250112087
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20250112149
- Publication date Apr 3, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- SHU HUI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...
- Publication number 20250107089
- Publication date Mar 27, 2025
- Lodestar Licensing Group LLC
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FILLING METHOD
- Publication number 20250105060
- Publication date Mar 27, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zhiqi YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...
- Publication number 20250107204
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD OF INTERCONNECT STRUCTURE
- Publication number 20250105058
- Publication date Mar 27, 2025
- HON HAI PRECISION INDUSTRY CO., LTD.
- Yun-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20250105148
- Publication date Mar 27, 2025
- Intel Corporation
- Marvin PAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20250098160
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE
- Publication number 20250095987
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION
- Publication number 20250096113
- Publication date Mar 20, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
- Publication number 20250092508
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES
- Publication number 20250087533
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsing Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20250087581
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL HARD MASKS FOR REDUCING LINE BENDING
- Publication number 20250079172
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250081594
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Ting PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HIGH STRENGTH DIELECTRIC IN HYBRID BONDING
- Publication number 20250079312
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...
- Publication number 20250079294
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE
- Publication number 20250079348
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20250079298
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD F...
- Publication number 20250072003
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Fabricating Method Thereof
- Publication number 20250062222
- Publication date Feb 20, 2025
- UNITED MICROELECTRONICS CORP.
- Tai-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DEVICE DIE
- Publication number 20250062224
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SYSTEM
- Publication number 20250054857
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT
- Publication number 20250054858
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Kai Huang
- H01 - BASIC ELECTRIC ELEMENTS

by forming openings in dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnection structure having air gap and method for manufacturi...

Wafer chuck structure with holes in upper surface to improve temper...

Semiconductor memory device

Memory cell with top electrode via

Semiconductor device with identification structure, method for manu...

Techniques to inhibit delamination from flowable gap-fill dielectric

Semiconductor device and methods of manufacture

Integrated circuit structure and method for forming the same

Semiconductor device with source/drain contact formed using bottom-...

Enlarging contact area and process window for a contact via

Contact resistance between via and conductive line

Self-aligned contacts

Embedded die architecture and method of making

Contact over active gate structures with etch stop layers for advan...

Semiconductor structure and manufacturing method thereof

Trench contact structures for advanced integrated circuit structure...

Self-aligned active regions and passivation layer and methods of ma...

Semiconductor device package including a thermal conductive layer a...

Microelectronic assemblies having integrated magnetic core inductors

Integrated circuit structure with backside via

Liner and barrier layer in dual damascene cu interconnect for enhan...

Semiconductor device and method of fabricating the same

Method for manufacturing semiconductor structure having raised via...

Semiconductor device and method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Method of forming a semiconductor device

Polymerization protective liner for reactive ion etch in patterning

Electronic devices comprising multilevel bitlines, and related meth...

Semiconductor device and method of manufacture

Word line structure of three-dimensional memory device

Patents Applicationslast 30 patents

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

BARRIER LAYERS FOR INTERCONNECTS

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...

CONTACT FILLING METHOD

MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...

FORMING METHOD OF INTERCONNECT STRUCTURE

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

METHOD FOR FORMING SEMICONDUCTOR DIE

SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME

LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

METAL HARD MASKS FOR REDUCING LINE BENDING

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHODS AND STRUCTURES FOR HIGH STRENGTH DIELECTRIC IN HYBRID BONDING

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE

HYBRID METAL LINE STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD F...

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

Semiconductor Device and Fabricating Method Thereof

METHOD OF MANUFACTURING DEVICE DIE

INTEGRATED CIRCUIT DEVICE AND SYSTEM

SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT