by forming openings in dielectrics

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CPC
H01L21/76802

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76802by forming openings in dielectrics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device
- Patent number 12,327,787
- Issue date Jun 10, 2025
- Kioxia Corporation
- Takashi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,322,703
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric layer
- Patent number 12,322,648
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure and method for forming the same
- Patent number 12,322,698
- Issue date Jun 3, 2025
- Winbond Electronics Corp.
- Hung-Jung Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,322,590
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high density, high shorting margin, and low capac...
- Patent number 12,322,699
- Issue date Jun 3, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers with rounded corners
- Patent number 12,322,646
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect structure
- Patent number 12,322,723
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,324,140
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGY, INC.
- Xiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including a stair step structure adjacent a substantially p...
- Patent number 12,317,489
- Issue date May 27, 2025
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric on wire structure to increase processing window for over...
- Patent number 12,315,817
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lines and methods for fabricating the same
- Patent number 12,315,762
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and method of manufacturing the same
- Patent number 12,315,797
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,315,772
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing copper line resistance
- Patent number 12,315,807
- Issue date May 27, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention in conductive structures
- Patent number 12,308,314
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,310,000
- Issue date May 20, 2025
- Windbond Electronics Corp.
- Te-Hsuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,310,043
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device having contact plugs with re-ent...
- Patent number 12,310,051
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 12,308,282
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with barrier po...
- Patent number 12,308,291
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected stacked circuits
- Patent number 12,308,347
- Issue date May 20, 2025
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer on interconnection vias for magnetic tunnel...
- Patent number 12,310,248
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,310,002
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for manufacturing the interconnec...
- Patent number 12,308,312
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Khaderbad Mrunal Abhijith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,308,317
- Issue date May 20, 2025
- SK Hynix Inc.
- Se Ra Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided routing in 3D semiconductor system-in-package structure...
- Patent number 12,308,322
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLY-OVER METAL JUMPER CONNECTION
- Publication number 20250192023
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD
- Publication number 20250192091
- Publication date Jun 12, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MA...
- Publication number 20250194150
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA
- Publication number 20250183159
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-WAFER RDLS IN CONSTRUCTED WAFERS
- Publication number 20250183058
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES
- Publication number 20250174494
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
- Publication number 20250174495
- Publication date May 29, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SVIA FORMATION USING VFTL SCHEME
- Publication number 20250174549
- Publication date May 29, 2025
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...
- Publication number 20250174551
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20250174553
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20250174493
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Removal of an Etching Stop Layer for Improving Overlay Sh...
- Publication number 20250167002
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING A STAIRCASE STRUCTURE ADJACENT A SUBSTANTIALLY PL...
- Publication number 20250169069
- Publication date May 22, 2025
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250157957
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- YONGBUM KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS
- Publication number 20250157938
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention In Conductive Structures
- Publication number 20250157919
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative...
- Publication number 20250151284
- Publication date May 8, 2025
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...
- Publication number 20250149382
- Publication date May 8, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250149391
- Publication date May 8, 2025
- Micron Technology, Inc.
- Haruka Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250142820
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS
- Publication number 20250142901
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250140698
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250140608
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsia-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20250142949
- Publication date May 1, 2025
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE
- Publication number 20250140607
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

by forming openings in dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device

Contact with a silicide region

Eccentric via structures for stress reduction

Interlayer dielectric layer

Semiconductor memory structure and method for forming the same

Semiconductor device and method

Method of forming high density, high shorting margin, and low capac...

Passivation layers with rounded corners

Self-aligned interconnect structure

Semiconductor structure and manufacturing method thereof

Devices including a stair step structure adjacent a substantially p...

Graphene barrier layer for reduced contact resistance

Dielectric on wire structure to increase processing window for over...

Self-aligned lines and methods for fabricating the same

Semiconductor substrate structure and method of manufacturing the same

Package and manufacturing method thereof

Reducing copper line resistance

Metal loss prevention in conductive structures

Manufacturing method of semiconductor device

Method of fabricating a semiconductor device

Fin field-effect transistor device having contact plugs with re-ent...

Interconnect structure without barrier layer on bottom surface of via

Method for preparing semiconductor device structure with barrier po...

Interconnected stacked circuits

Diffusion barrier layer on interconnection vias for magnetic tunnel...

Semiconductor device

Interconnect structure and method for manufacturing the interconnec...

Semiconductor device and method for fabricating the same

Dual-sided routing in 3D semiconductor system-in-package structure...

Package structure and method of fabricating the same

Patents Applicationslast 30 patents

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

FLY-OVER METAL JUMPER CONNECTION

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD

SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MA...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA

CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...

SVIA FORMATION USING VFTL SCHEME

SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF

INTERLAYER DIELECTRIC LAYER

Selective Removal of an Etching Stop Layer for Improving Overlay Sh...

DEVICES INCLUDING A STAIRCASE STRUCTURE ADJACENT A SUBSTANTIALLY PL...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS

Metal Loss Prevention In Conductive Structures

Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Integrated Assemblies and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

INTEGRATED CIRCUIT STRUCTURE

GATE CUT WITH INTEGRATED ETCH STOP LAYER

THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE