by forming openings in dielectrics

Industry

CPC
H01L21/76802

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76802by forming openings in dielectrics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip-substrate composite semiconductor device
- Patent number 12,368,052
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having air gap and method for manufacturing th...
- Patent number 12,368,073
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side power rail design and method of making same
- Patent number 12,368,078
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising transistor
- Patent number 12,364,041
- Issue date Jul 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Motomu Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned contact scheme
- Patent number 12,362,239
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,363,895
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving profile of interconnect structure
- Patent number 12,362,227
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,362,228
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an integrated circuit chip including a back-sid...
- Patent number 12,362,236
- Issue date Jul 15, 2025
- Imec VZW
- Anabela Veloso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacture
- Patent number 12,356,867
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Hua Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 12,354,911
- Issue date Jul 8, 2025
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and method of forming...
- Patent number 12,354,906
- Issue date Jul 8, 2025
- Kioxia Corporation
- Toshiaki Komukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 12,354,908
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 12,349,344
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Josh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 12,347,681
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,347,683
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Hong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment of spin on organic material to improve wet resistance
- Patent number 12,347,727
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,347,766
- Issue date Jul 1, 2025
- Winbond Electronics Corp.
- Hao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming the same
- Patent number 12,347,726
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line for semiconductor device
- Patent number 12,341,057
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap through at least two metal layers
- Patent number 12,341,058
- Issue date Jun 24, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei-Hui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and using mask
- Patent number 12,341,011
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,334,395
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 12,334,448
- Issue date Jun 17, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,334,390
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric stack for damascene top-via integration
- Patent number 12,334,398
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY
- Publication number 20250239520
- Publication date Jul 24, 2025
- Lodestar Licensing Group LLC
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239525
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Se Ra HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20250239486
- Publication date Jul 24, 2025
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250234616
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...
- Publication number 20250233069
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-Min Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...
- Publication number 20250226231
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS
- Publication number 20250226322
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ren Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR
- Publication number 20250227942
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...
- Publication number 20250218949
- Publication date Jul 3, 2025
- Intel Corporation
- Sriharsha Karumuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACK-SIDE GATE VIAS
- Publication number 20250218869
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYERS WITH AIR GAPS
- Publication number 20250210411
- Publication date Jun 26, 2025
- Intel Corporation
- Ananya Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PATH FOR PREVENTING PLASMA-INDUCED DAMAGE D...
- Publication number 20250212705
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20250210511
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...
- Publication number 20250203976
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKELETON ETCH FOR SEMICONDUCTOR CHIPS
- Publication number 20250201707
- Publication date Jun 19, 2025
- Intel Corporation
- Shida TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT
- Publication number 20250204000
- Publication date Jun 19, 2025
- Intel Corporation
- Kan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
- Publication number 20250201626
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLY-OVER METAL JUMPER CONNECTION
- Publication number 20250192023
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD
- Publication number 20250192091
- Publication date Jun 12, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MA...
- Publication number 20250194150
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA
- Publication number 20250183159
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-WAFER RDLS IN CONSTRUCTED WAFERS
- Publication number 20250183058
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES
- Publication number 20250174494
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
- Publication number 20250174495
- Publication date May 29, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS

by forming openings in dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip-substrate composite semiconductor device

Methods of forming semiconductor device

Semiconductor device having air gap and method for manufacturing th...

Dual-side power rail design and method of making same

Semiconductor structure and manufacturing method thereof

Semiconductor device comprising transistor

Self aligned contact scheme

Semiconductor device and method of manufacturing the same

Integrated assemblies and methods of forming integrated assemblies

Method for improving profile of interconnect structure

Semiconductor package and method

Method of producing an integrated circuit chip including a back-sid...

Semiconductor structure and method of manufacture

Cu3Sn via metallization in electrical devices for low-temperature 3...

Reconstituted substrate structure and fabrication methods for heter...

Method of manufacturing semiconductor device and method of forming...

Amorphous layers for reducing copper diffusion and method forming same

Semiconductor device and method of manufacturing

Method of forming a semiconductor device

Method of manufacturing a semiconductor device

Treatment of spin on organic material to improve wet resistance

Semiconductor structure and method for forming the same

Interconnect structures and methods of forming the same

Interconnect line for semiconductor device

Air gap through at least two metal layers

Method for forming and using mask

Semiconductor structure and method for forming the same

Front end of line interconnect structures and associated systems an...

Semiconductor device

Multilayer dielectric stack for damascene top-via integration

Patents Applicationslast 30 patents

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SELF-ALIGNED CONTACTS

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...

SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...

INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS

STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR

TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...

SELF-ALIGNED BACK-SIDE GATE VIAS

INTERCONNECT LAYERS WITH AIR GAPS

ELECTROSTATIC DISCHARGE PATH FOR PREVENTING PLASMA-INDUCED DAMAGE D...

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...

SKELETON ETCH FOR SEMICONDUCTOR CHIPS

INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT

ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

FLY-OVER METAL JUMPER CONNECTION

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD

SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MA...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA

CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...