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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76802
by forming openings in dielectrics
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last 30 patents
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Semiconductor device and methods of forming the same
Patent number
11,973,027
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Singulation process for chiplets
Patent number
11,972,970
Issue date
Apr 30, 2024
HRL Laboratories, LLC
Florian G. Herrault
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,973,117
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of manufacturing a semiconductor...
Patent number
11,972,973
Issue date
Apr 30, 2024
Chun-Ming Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
SRAM layout for double patterning
Patent number
11,974,421
Issue date
Apr 30, 2024
Texas Instruments Incorporated
James Walter Blatchford
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3D NAND gate stack reinforcement
Patent number
11,967,524
Issue date
Apr 23, 2024
Applied Materials, Inc.
Praket Prakash Jha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
Patent number
11,967,522
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jyh-Nan Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Integrated circuit
Patent number
11,967,560
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shih-Wei Peng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated semiconductor device and method for manufacturing the same
Patent number
11,967,519
Issue date
Apr 23, 2024
INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
Kai Cao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
Patent number
11,967,552
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Han Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Manufacturing method for integrating gate dielectric layers of diff...
Patent number
11,961,740
Issue date
Apr 16, 2024
Shanghai Huali Integrated Circuit Corporation
Lian Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package component with stepped passivation layer
Patent number
11,961,762
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor substrate structure and method of manufacturing the same
Patent number
11,961,799
Issue date
Apr 16, 2024
Advanced Semiconductor Engineering, Inc.
Wen Hung Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Structure and method for interlevel dielectric layer with regions o...
Patent number
11,955,421
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Conductive element for semiconductor devices
Patent number
11,955,380
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Chiang Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with redistribution structure and manufacturi...
Patent number
11,955,439
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Cheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
Patent number
11,953,826
Issue date
Apr 9, 2024
Intel Corporation
James M. Blackwell
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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Patent Grant
Method of manufacturing a semiconductor device
Patent number
11,955,336
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing Hong Huang
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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Patent Grant
Trench contact structures for advanced integrated circuit structure...
Patent number
11,948,997
Issue date
Apr 2, 2024
Intel Corporation
Subhash M. Joshi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method
Patent number
11,948,890
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of fabricating the same
Patent number
11,948,882
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Jihoon Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etch profile control of via opening
Patent number
11,942,371
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Te-Chih Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via patterning for integrated circuits
Patent number
11,942,424
Issue date
Mar 26, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded memory with improved fill-in window
Patent number
11,943,921
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Han Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing a memory device and memory device manufact...
Patent number
11,943,938
Issue date
Mar 26, 2024
Micron Technology, Inc.
Paolo Fantini
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
Publication number
20240145376
Publication date
May 2, 2024
International Business Machines Corporation
Rajiv Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
Publication number
20240145597
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER
Publication number
20240145459
Publication date
May 2, 2024
Silicon Genesis Corporation
Michael I. CURRENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cross-Wafer RDLs in Constructed Wafers
Publication number
20240145257
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
Publication number
20240145381
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Barrier-Free Approach for Forming Contact Plugs
Publication number
20240136227
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDU...
Publication number
20240136411
Publication date
Apr 25, 2024
Infineon Technologies Austria AG
Seung Hwan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD
Publication number
20240138152
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Feng-Cheng Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
Publication number
20240136295
Publication date
Apr 25, 2024
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING AND USING MASK
Publication number
20240136184
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240136191
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Min-Hsiu Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN...
Publication number
20240136225
Publication date
Apr 25, 2024
IMEC vzw
Boon Teik Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
Publication number
20240128119
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Stefan LANDIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LITHOGRAPHY
Publication number
20240126174
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Che Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDCUTOR STRUCTURES AND METHODS OF SEMICONDUCTOR STRUCTURE
Publication number
20240128160
Publication date
Apr 18, 2024
Semiconductor Manufacturing International (Shanghai) Corporation
Zhaoxu SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240120272
Publication date
Apr 11, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Wei-Hao LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
Publication number
20240113040
Publication date
Apr 4, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Stefan LANDIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER GATING DUMMY POWER TRANSISTORS FOR BACK SIDE POWER DELIVERY N...
Publication number
20240113125
Publication date
Apr 4, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20240112905
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
Publication number
20240112924
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsu-Hsien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS
Publication number
20240105601
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-An LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIDDLE OF LINE DIELECTRIC LAYER ENGINEERING FOR VIA VOID PREVENTION
Publication number
20240105509
Publication date
Mar 28, 2024
Applied Materials, Inc.
Nicolas Louis BREIL
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...
Publication number
20240096971
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Xusheng WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
Publication number
20240096750
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Qingqing LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALL...
Publication number
20240096790
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Mustafa Badaroglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE LAYER INTERCONNECTS
Publication number
20240096791
Publication date
Mar 21, 2024
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240088019
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHIA CHEN LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO IN...
Publication number
20240088022
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Teng Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
Publication number
20240088023
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shao-Kuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
Publication number
20240087949
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Zhen YU
H01 - BASIC ELECTRIC ELEMENTS