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H01L2224/81935

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81935by heating means

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 9,331,042
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140299986
- Publication date Oct 9, 2014
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS