by heating means

Industry

CPC
H01L2224/81035

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81035by heating means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer
- Patent number 11,728,180
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer and method fo...
- Patent number 11,302,537
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20240387192
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20230335411
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER
- Publication number 20220238352
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...
- Publication number 20210313195
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20180350767
- Publication date Dec 6, 2018
- Intel Corporation
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20170179069
- Publication date Jun 22, 2017
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by heating means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with nickel layer

Chip package structure with conductive adhesive layer

Chip package structure with conductive adhesive layer and method fo...

Method for producing semiconductor chip

Method for producing semiconductor package

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

BALL GRID ARRAY SOLDER ATTACHMENT

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

BALL GRID ARRAY SOLDER ATTACHMENT