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CPC
H01L2224/85935
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85935
by heating means
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last 30 patents
Information
Patent Grant
Heat isolation structures for high bandwidth interconnects
Patent number
9,859,188
Issue date
Jan 2, 2018
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Sean S. Cahill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die package with low electromagnetic interference interconnection
Patent number
9,824,997
Issue date
Nov 21, 2017
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Sean S. Cahill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die packaging with fully or partially fused dielectric leads
Patent number
9,812,420
Issue date
Nov 7, 2017
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Sean S. Cahill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate less die package having wires with dielectric and metal c...
Patent number
9,711,479
Issue date
Jul 18, 2017
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Sean S. Cahill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device having a lead with selectively modified electrica...
Patent number
9,673,137
Issue date
Jun 6, 2017
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Sean S. Cahill
H01 - BASIC ELECTRIC ELEMENTS