by immersion

Industry

CPC
H05K7/20236

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20236by immersion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Immersed liquid cooling apparatus and liquid cooling system
- Patent number 12,328,842
- Issue date Jun 10, 2025
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid circulation systems and methods for cooling having a collector
- Patent number 12,317,450
- Issue date May 27, 2025
- Rhodium Technologies LLC
- Chase Blackmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling arrangement with cooling fluid circuit and power electronics
- Patent number 12,317,458
- Issue date May 27, 2025
- Dr. Ing. h.c.F. Porsche Aktiengesellschaft
- Martin Fuechtner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Validation method, demo board, validation system, and non-transitor...
- Patent number 12,314,097
- Issue date May 27, 2025
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Li-Quan He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Organic heat transfer system, method and fluid
- Patent number 12,305,111
- Issue date May 20, 2025
- The Lubrizol Corporation
- Amy L. Short
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bellows for immersion cooling
- Patent number 12,309,972
- Issue date May 20, 2025
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coolant shroud
- Patent number 12,309,975
- Issue date May 20, 2025
- GREEN REVOLUTION COOLING, INC.
- Derek Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling device mounted on a heat generating electronic compo...
- Patent number 12,309,965
- Issue date May 20, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Modular air cooling device and cooling system
- Patent number 12,302,535
- Issue date May 13, 2025
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Subsea substation system with one enclosure having separate thermal...
- Patent number 12,300,978
- Issue date May 13, 2025
- ABB Schweiz AG
- Harald Fretheim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system and data center
- Patent number 12,302,536
- Issue date May 13, 2025
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Jinliang Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force convection driven by propeller applied in single-phase immers...
- Patent number 12,289,862
- Issue date Apr 29, 2025
- Quanta Computer Inc.
- Chao-Jung Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Liquid-in-liquid cooling system for electronic components
- Patent number 12,289,861
- Issue date Apr 29, 2025
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling electronic devices installed in a subsurface environment
- Patent number 12,284,782
- Issue date Apr 22, 2025
- David Lane Smith
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Dual side direct cooling semiconductor package
- Patent number 12,266,590
- Issue date Apr 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion cooling electronic devices
- Patent number 12,261,098
- Issue date Mar 25, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively applied protective layer on exposed materials of electr...
- Patent number 12,262,478
- Issue date Mar 25, 2025
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Submersible networking enclosure
- Patent number 12,256,518
- Issue date Mar 18, 2025
- FRONTIER COMMUNICATIONS HOLDINGS, LLC
- John Valdez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tank for heat dissipation and a cooling system including the same
- Patent number 12,245,406
- Issue date Mar 4, 2025
- FIRMUS METAL TECHNOLOGIES SINGAPORE PTE LTD
- Jonathan Levee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tank with stable support for lid when lifted and immersion cooling...
- Patent number 12,245,400
- Issue date Mar 4, 2025
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Yen-Lu Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating system using heat extracted from a computer processing unit
- Patent number 12,222,781
- Issue date Feb 11, 2025
- 10130163 Manitoba Ltd.
- Stephane Gauthier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system for the liquid immersion cooling of electronic compo...
- Patent number 12,225,689
- Issue date Feb 11, 2025
- Wieland-Werke AG
- Achim Gotterbarm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable and low insertion force connector system
- Patent number 12,219,706
- Issue date Feb 4, 2025
- Intel Corporation
- Jonathan W. Thibado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with heat-conductive cover
- Patent number 12,200,900
- Issue date Jan 14, 2025
- HTC Corporation
- Li-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Immersion cooling system and immersion cooling method
- Patent number 12,200,904
- Issue date Jan 14, 2025
- Delta Electronics, Inc.
- Wei-Chih Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Boiler enhancement coatings with active boiling management
- Patent number 12,178,005
- Issue date Dec 24, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion cooling apparatus
- Patent number 12,171,082
- Issue date Dec 17, 2024
- NEC Corporation
- Atsuki Tokuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mobile high performance computing platform for cryptocurrency mining
- Patent number 12,167,569
- Issue date Dec 10, 2024
- DaVinci 3.0 Incorporated
- Patrick J. Sweeney
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMER...
- Publication number 20250194044
- Publication date Jun 12, 2025
- OVH
- Ali CHEHADE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME
- Publication number 20250185218
- Publication date Jun 5, 2025
- FIRMUS METAL TECHNOLOGIES SINGAPORE PTE LTD
- Jonathan LEVEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Immersion Cooling Platform with an Adjustable Weir and Multi...
- Publication number 20250185205
- Publication date Jun 5, 2025
- Modine LLC
- Richard Margerison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL TESTING TOOL
- Publication number 20250172519
- Publication date May 29, 2025
- Cooler Master Co., Ltd.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSED LIQUID-COOLING SERVER AND WASTE HEAT RECOVERY SYSTEM THEREOF
- Publication number 20250169029
- Publication date May 22, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Mingyue ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LIQUID COOLING SYSTEM FOR ELECTRONICS
- Publication number 20250151228
- Publication date May 8, 2025
- Apollo Autonomous Driving USA LLC
- Peng Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID IMMERSION COOLING DEVICE
- Publication number 20250142769
- Publication date May 1, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Youji SHIRATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORTHOGONAL COLD PLATE FOR USE IN ACTIVE LIQUID IMMERSION COOLING
- Publication number 20250133692
- Publication date Apr 24, 2025
- Intel Corporation
- Christian Amoah-Kusi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING EQUIPMENT
- Publication number 20250120043
- Publication date Apr 10, 2025
- Wiwynn Corporation
- You-Cheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING DEVICE AND LIQUID COOLING SYSTEM
- Publication number 20250120051
- Publication date Apr 10, 2025
- Beijing Youzhuju Network Technology Co., Ltd.
- Ruidong WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Swappable Battery Modules Comprising Immersion-Thermally Controlled...
- Publication number 20250118831
- Publication date Apr 10, 2025
- DIMAAG-AI, Inc.
- Ian Wright
- B60 - VEHICLES IN GENERAL
Information Patent Application
IMMERSION COOLING SYSTEM AND FEEDTHROUGH MODULE THEREOF
- Publication number 20250104891
- Publication date Mar 27, 2025
- Wiwynn Corporation
- Hsien-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...
- Publication number 20250107036
- Publication date Mar 27, 2025
- Fang-Shou LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID IMMERSION COOLING PLATFORM AND COMPONENTS THEREOF
- Publication number 20250098109
- Publication date Mar 20, 2025
- TMGCore, Inc.
- Edward King
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR-ASSISTED IMMERSION COOLING SYSTEMS
- Publication number 20250098124
- Publication date Mar 20, 2025
- Dell Products L.P.
- Xin Zhi Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
- Publication number 20250089208
- Publication date Mar 13, 2025
- Microsoft Technology Licensing, LLC
- Oscar FARIAS MOGUEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HERMETIC MICROELECTRONIC MODULE USING A SHEATH
- Publication number 20250087540
- Publication date Mar 13, 2025
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULATING SUBMERGED LIQUID COOLING CABINET
- Publication number 20250089207
- Publication date Mar 13, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING APPARATUS
- Publication number 20250089206
- Publication date Mar 13, 2025
- Samsung C & T Corporation
- Eun Young Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING HEAT DISSIPATION DEVICE
- Publication number 20250081387
- Publication date Mar 6, 2025
- JWS TECHNOLOGY CO., LTD.
- Pang-Hung LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR DATACENTER FOR IMMERSIVE COOLING SYSTEMS
- Publication number 20250081388
- Publication date Mar 6, 2025
- OVH
- Ali CHEHADE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION HEAT DISSIPATION SYSTEM HAVING TWO CIRCULATIONS AND HEAT...
- Publication number 20250081392
- Publication date Mar 6, 2025
- Wistron Corporation
- Wen-Hua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluid-Filled Camera Modules
- Publication number 20250080815
- Publication date Mar 6, 2025
- Apple Inc.
- Zachary W. Birnbaum
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SERVER BASKET FOR USE IN AN IMMERSION COOLING TANK
- Publication number 20250081383
- Publication date Mar 6, 2025
- LiquidStack Holding B.V.
- Kar-Wing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID IMMERSION COOLING SYSTEMS
- Publication number 20250081396
- Publication date Mar 6, 2025
- Intel Corporation
- Guangying Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING HEAT SINK WITH TURBULENCE STRUCTURE
- Publication number 20250075989
- Publication date Mar 6, 2025
- JWS TECHNOLOGY CO., LTD.
- Pang-Hung LIAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ORGANIC HEAT TRANSFER SYSTEM, METHOD AND FLUID
- Publication number 20250059425
- Publication date Feb 20, 2025
- The Lubrizol Corporation
- Christopher Frederick McFadden
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Application
IMMERSION WATER TANK AND SERVER COOLING SYSTEM
- Publication number 20250063689
- Publication date Feb 20, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Mingjie LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION-TYPE LIQUID-COOLING DEVICE AND IMMERSION-TYPE LIQUID-COOL...
- Publication number 20250063686
- Publication date Feb 20, 2025
- Beijing Bytedance Network Technology Co., Ltd.
- Jian WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND IMMERSION COOLING SYSTEM
- Publication number 20250056751
- Publication date Feb 13, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- Yu-Lun HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by immersion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Immersed liquid cooling apparatus and liquid cooling system

Fluid circulation systems and methods for cooling having a collector

Cooling arrangement with cooling fluid circuit and power electronics

Validation method, demo board, validation system, and non-transitor...

Organic heat transfer system, method and fluid

Bellows for immersion cooling

Coolant shroud

Liquid cooling device mounted on a heat generating electronic compo...

Modular air cooling device and cooling system

Subsea substation system with one enclosure having separate thermal...

Cooling system and data center

Force convection driven by propeller applied in single-phase immers...

Liquid-in-liquid cooling system for electronic components

Cooling electronic devices installed in a subsurface environment

Dual side direct cooling semiconductor package

Immersion cooling electronic devices

Selectively applied protective layer on exposed materials of electr...

Submersible networking enclosure

Tank for heat dissipation and a cooling system including the same

Tank with stable support for lid when lifted and immersion cooling...

Heating system using heat extracted from a computer processing unit

Cooling system for the liquid immersion cooling of electronic compo...

Removable and low insertion force connector system

Electronic device with heat-conductive cover

Method and extraction system for extracting an electronic device fr...

Immersion cooling system and immersion cooling method

Boiler enhancement coatings with active boiling management

Immersion cooling apparatus

Rack system for housing at least one immersion case

Mobile high performance computing platform for cryptocurrency mining

Patents Applicationslast 30 patents

DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMER...

TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME

Liquid Immersion Cooling Platform with an Adjustable Weir and Multi...

THERMAL TESTING TOOL

IMMERSED LIQUID-COOLING SERVER AND WASTE HEAT RECOVERY SYSTEM THEREOF

HYBRID LIQUID COOLING SYSTEM FOR ELECTRONICS

LIQUID IMMERSION COOLING DEVICE

ORTHOGONAL COLD PLATE FOR USE IN ACTIVE LIQUID IMMERSION COOLING

IMMERSION COOLING EQUIPMENT

IMMERSION LIQUID COOLING DEVICE AND LIQUID COOLING SYSTEM

Swappable Battery Modules Comprising Immersion-Thermally Controlled...

IMMERSION COOLING SYSTEM AND FEEDTHROUGH MODULE THEREOF

SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...

LIQUID IMMERSION COOLING PLATFORM AND COMPONENTS THEREOF

AIR-ASSISTED IMMERSION COOLING SYSTEMS

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

HERMETIC MICROELECTRONIC MODULE USING A SHEATH

CIRCULATING SUBMERGED LIQUID COOLING CABINET

IMMERSION COOLING APPARATUS

LIQUID-COOLING HEAT DISSIPATION DEVICE

MODULAR DATACENTER FOR IMMERSIVE COOLING SYSTEMS

IMMERSION HEAT DISSIPATION SYSTEM HAVING TWO CIRCULATIONS AND HEAT...

Fluid-Filled Camera Modules

SERVER BASKET FOR USE IN AN IMMERSION COOLING TANK

LIQUID IMMERSION COOLING SYSTEMS

LIQUID-COOLING HEAT SINK WITH TURBULENCE STRUCTURE

ORGANIC HEAT TRANSFER SYSTEM, METHOD AND FLUID

IMMERSION WATER TANK AND SERVER COOLING SYSTEM

IMMERSION-TYPE LIQUID-COOLING DEVICE AND IMMERSION-TYPE LIQUID-COOL...

ELECTRONIC DEVICE AND IMMERSION COOLING SYSTEM