Patent Application
20250220849
The present concept relates to a liquid cooling system for the effective and efficient refrigeration of heat-generating electronic components and in particular, although not exclusively, to a liquid refrigeration system to cool IT components, servers, computational electronic devices and the like via direct submersion of such components and devices in a dielectric liquid coolant.
The cooling of electronics, specifically IT components, servers, data storage devices and computational electronic devices having graphics and central processing units (GPUs and CPUs) has become a major technical challenge due to the ongoing development of smaller, faster, higher density and higher power capacity electronics.
Computing devices produce heat as a by-product of operational processing. In datacentres, where thousands of such devices are located, the amount of heat generated can be extremely large. As the need for access to greater processing and data storage continues to expand, the density of server systems continues to increase, and the resulting thermal challenges present a significant practical obstacle.
Conventional fan-based cooling systems require large amounts of power. Accordingly, the power demand to drive such systems increases significantly with the increased server densities. Immersion cooling of IT components is a relatively recent development. The operational hot electronics are submerged in direct contact with a dielectric (electrically insulating) coolant liquid that is circulated and cooled through the use of heat exchangers and the likes. Cooling of electronics enhances their performance efficiency enabling higher processing speeds (for example the overclocking of CPUs). The heat generated by the circuit is removed quickly and efficiently by the dielectric liquid directly at the heat source. However, there is a general need for continued improvement of the operational efficiency of existing liquid submersion cooling systems with regard to both the effectiveness of the cooling of the electronic components and also the thermal management and circulation of the coolant liquid for efficient energy reuse.
It is an object of the present disclosure to provide an apparatus and a method for the precise and efficient liquid cooling of electronic devices. It is a specific objective to provide an electronic component liquid cooling system to enable IT components and the like to operate at high temperatures. It is a further specific objective to provide a refrigeration system to maximise the working temperature of the dielectric liquid due to heat transfer with the electronic components for subsequent energy reuse. It is a further specific objective to provide a system to provide an outflow of the dielectric liquid (following heat transfer with the electronic component) at a uniform/constant temperature. Such a configuration maximises the efficiency and effectiveness of the heat energy transfer with a suitable heat exchanger or the like for heat-energy reuse.
The present system provides a liquid submersion/immersion arrangement in which IT electronic components are partitioned/segregated spatially based in their operating temperature and effective power-draw. In particular, the present system is configured for electronic component cooling via direct contact and circulation with the refrigerant liquid to provide a single-liquid refrigeration system for the cooling-on-demand of each electronic component individually and/or independently of one another according to operational performance, type, operating temperature, size and/or configuration of the electronic component.
Reference within this specification to an ‘electronic component’, an ‘electronic device’ or similar, encompasses a heat-generating electronic component for example mounted at a larger IT component/device such as a server, motherboard, data storage device, programmable logic controller board etc. Such heat-generating electronic components include for example the circuitry and/or electronics at a motherboard or other printed circuit board device, random access memory (RAM); graphics processing unit (GPU); central processing unit (CPU); chips, sockets; peripheral component interconnect (PCI) slots; read-only memory (ROM) components, chips and slots; graphics processing components, ports, slots, chips; electronic bridges; battery components, ports and slots; power supply plugs, slots and ports, electronic connectors; electronic heatsinks; switches; jumpers; capacitors; transistors; diodes; operational power associated components; current and/or voltage regulators and modules; power supply convertors etc.
The present system is configured to deliver the coolant liquid to the heat-generating electronic devices based on their typical, normal, average or maximum operating temperature according to a variety of different possible liquid flow circuit configurations. For example, the present system is compatible with in-series, in-parallel and/or combined in-series and in-parallel liquid flow configurations based on the spatial positioning of the electronic components according to their typical, normal, average and/or maximum operating temperature. Accordingly, the present system provides an outgoing liquid flow at a maximised outflow temperature and at a constant/uniform temperature over time. The heated dielectric liquid may then be processed efficiently and effectively for heat-reuse via a heat exchanger or the like with the heat energy transferred from the dielectric liquid to an auxiliary application or device that requires a temporary or continuous supply of heat energy.
The outflow of the dielectric liquid heated to a maximum and uniform working temperature (over time) provides an efficient and effective source of heat for heat reuse technologies. This is achieved via the spatial partitioning/segregation of the heat-generating devices based on their respective operating temperatures. In particular, at least one and in particular a set of first heat-generating electronic components may be partitioned and located within a first region or chamber of the apparatus for a first contact with the dielectric liquid. At least one second component or set of further heat-generating electronic components (having a higher operating temperature than the first electronic devices) may be located at a segregated or partitioned region (or enclosure) of the system/apparatus for separate and/or subsequent contact with the dielectric liquid. Such an arrangement allows the dielectric liquid to flow in direct contact with the first heat-generating electronic components and then the second heat-generating electronic components such that the temperature of the dielectric liquid output at an outflow region of the apparatus is the sum of the temperature increase of the liquid having passed in contact with the electronics at all the spatially segregated regions.
In one aspect, the present system includes an encapsulation (or cover) positionable to enclose (at least partially) an electronic device e.g., a CPU/GPU. This encapsulation may be installed over a chip (with or without the heatsink) or on the top of the chip (e.g., cold-plate technology). The coolant is then be configured to flow through each encapsulation region to capture all the heat generated by the electronic device. Such an arrangement enables the electronic device (GPU/CPU) to operate at its optimal or typical operating temperature independently of an overclocking mode whilst also allowing the temperature of an outgoing flow of the coolant liquid to be as high as possible and uniform over time for improved energy reuse.
In one aspect, the present system provides that the submerged heat generation devices are segregated according to their operating temperature range, so that all of them are in contact with a different portion of the cooling fluid within the fluid container at a given time. The fluid within the container is driven to a cooling device where it is cooled down ready to be driven again into the container, therefore effectively cooling down the submerged heat generation devices in-series. The fluid may be driven in such a way through the system so that it first contacts the segregated heat generation devices with the lowest operating temperature. Then, the partially heated fluid is driven in contact with a next set of segregated heat generation devices with the second lowest operating temperature, where its temperature may increase further. This is repeated until the set of segregated heat generation devices with the highest operating temperature is contacted by the dielectric liquid, which is then driven to a cooling device (i.e., heat exchanger).
According to a first aspect of the present concept there is provided liquid cooling apparatus for an electronic device comprising: a primary housing defining a chamber to accommodate at least one electronic device having at least one heat-generating electronic component; at least one liquid flow inlet and at least one liquid flow outlet provided at the housing to allow a flow of a dielectric cooling liquid to enter and exit the chamber in direct contact with the electronic device; a second housing located within the chamber defining an enclosure to at least partially accommodate the at least one heat-generating electronic component of the device; at least one liquid flow inlet and at least one liquid flow outlet provided at the second housing to allow a flow of the liquid to enter and exit the enclosure in direct contact with the heat-generating electronic component; and a cooling unit connected in fluid communication with at least one of the inlets and at least one of the outlets forming part of a fluid flow network to transfer heat energy from the liquid.
Preferably, the at least one outlet of the primary housing is connected in fluid communication to the at least one inlet of the second housing such that the liquid is configured to flow through the chamber and then through the enclosure.
Preferably, the electronic device comprises at least one first heat-generating electronic component at least partially accommodated within the chamber for immersion in the liquid within the chamber; and at least one second heat-generating electronic component at least partially accommodated within the enclosure for immersion in the liquid within the enclosure. Optionally, the second heat-generating electronic component is capable of comprises a higher operating temperature than the first heat-generating electronic component.
Reference within this specification to a first heat-generating electronic component encompasses relatively low heat generating devices/components (LHGDs) for example RAM, the motherboard and the like. Likewise reference herein to a second heat-generating electronic component encompasses relatively high heat-generating components (HHGDs) for example microprocessors, CPUs, GPUs and the like. The first and second heat-generating electronic components are differentiated herein by their relative normal, typical, standard and/or maximum operating temperatures. This is the heat energy such devices generate in use and/or as detailed in electronic component datasheets, databases and the like. Accordingly, the low heat generating components/devices generally comprises a normal, typical, standard and/or maximum operating temperature that is below that of the high heat-generating components/devices. In certain specific implementations, a low heat generating component/device may be configured to generate heat under normal or typical operation that is less than 200W. Moreover, in certain specific implementations, a high heat generating component/device may be configured to generate heat under normal or typical operation that is more than 200W. However, such values are given for guidance only and the skilled person will understand this value of 200W as applied to the LGHD and HHGDs herein may different specific to the type of electronic component.
Preferably, the at least one outlet of the second housing is connected in fluid communication to an inlet of the cooling unit and an outlet of the cooling unit is connected in fluid communication to the at least one inlet of the primary housing. Optionally, the chamber is connected in fluid communication in-series with the enclosure.
Preferably, the apparatus comprises at least one electronically controllable valve provided in fluid communication with the inlet and/or the outlet of the primary housing and/or the second housing; and a control unit to control the valve and a flow of the liquid to enter and exit the primary housing and/or the second housing via the respective inlet and outlet.
Optionally, the control unit is configured to control the liquid flow through the chamber for a first heat energy exchange with the first heat-generating electronic component and then to control the liquid flow through the enclosure for a second heat energy exchange with the second heat-generating electronic component, the second heat energy exchange being supplemental and additional to the first heat energy exchange such that an increase in a temperature of the liquid at the outlet of the enclosure is a sum of a temperature increase of the liquid having passed through the chamber and the enclosure. The control unit may comprise one or a plurality of electronic control units, modules or devices that may include a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, a server, a printed circuit board, a motherboard or other similar device. The control unit may comprise sensors that include at least one flow rate, temperature, proximity, motion, current, voltage, pH and/or magnet sensor. The control unit may comprise at least one control valve that may comprise a solenoid valve, a diaphragm valve, a pilot-operated, plural-way valve and combinations thereof. The control unit may be located locally or remote to the present system and apparatus for the local and/or remote control of the apparatus. The control unit may be operated via a cloud network, wireless or wired communication pathways and associated components.
Preferably, the primary housing comprises a liquid immersion tank. Preferably, the at least one second housing is smaller in size than the primary housing and is located within the chamber. Optionally, the apparatus comprises a plurality of second housings (alternatively referred to herein as enclosures) that may be positioned in-series and/or in-parallel with one another. Accordingly, liquid may be configured to flow through the chamber according to a first pathway and then to flow through at least one enclosure via a second pathway in-series and then to flow through a further enclosure in-series with the first enclosure. Each enclosure may comprise the same or different heat-generating electronic components having the same or different operating temperatures. When the enclosures are connected in-parallel, the liquid supply may be divided/split into separate streams flowing into each of the respective enclosures in-parallel. The separated parallel flow streams may be then combined to a single flow stream after flowing through the enclosures (in a fluid flow direction).
Optionally, the present system may comprise a plurality of enclosures defined by respective second housings each enclosing a respective heat-generating electronic component provided at the electronic device; the plurality of enclosures arranged in a fluid flow direction in parallel and/or in series with one another. Optionally, the respective heat-generating electronic components may comprise substantially the same operating temperature or may comprise different operating temperatures arranged within respective second housings in order of increasing operating temperature. Optionally, the liquid is capable of flowing through the respective second housings in contact with the respective heat-generating electronic components in parallel or in series. Preferably, the primary housing comprises an immersion tank or bath and the second housing comprises at least one second housing, shroud, container, pocket or sub-chamber to contain respectively the different heat generating electronic components being spatially partitioned relative to the larger primary housing allowing a partitioned/separated liquid flow in contact with the different (sets of) electronic devices. Optionally, the second housing may be contained exclusively and/or entirely within the primary housing.
The apparatus typically comprises a dielectric cooling liquid contained within the chamber of the primary housing and wherein the second housing is at least partially immersed in or completely submerged by the liquid within the chamber of the primary housing. The dielectric cooling liquid may be any liquid type suitable for immersion cooling of IT components having appropriate electrically insulating characteristics to provide safe direct contact with energised electronic components importantly with no liquid electrical conductivity.
Optionally, at least a part of the second heat-generating electronic component is positioned in direct contact with the liquid within the enclosure defined by the second housing and/or at least a part of the first heat-generating electronic component is positioned in direct contact with the liquid within the chamber.
Optionally, the electronic device may comprise any one or a combination of: a computer entity; a server; a motherboard; a printed circuit board comprising a plurality of electronic components. Optionally, the first heat-generating electronic component and/or the second heat-generating electronic component comprise any one or a combination of: a motherboard; random access memory (RAM); a graphics processing unit (GPU); a central processing unit (CPU).
Optionally, the inlet of the second housing is defined by at least a perimeter of an opening by which the second housing is positionable to receive and envelope the heat-generating electronic component at the enclosure. Optionally, the inlet and outlet of the second housing are separate from one another and/or positioned at different regions of the second housing. Optionally, the second housing comprises an opening to enable the second housing to receive and envelope the heat-generating electronic component at the enclosure and a roof positioned opposite the opening. Optionally, the inlet of the second housing is positioned at the roof of the second housing. Optionally, the outlet of the second housing is defined, in part by the opening. Optionally, the inlet and/or outlet of the second housing is defined, in part, by a perimeter of the opening of the second housing. Optionally, the inlet and/or outlet of the second housing is defined, in part, by a gap or region between an outer perimeter of the electronic component and the region immediately inside the perimeter of the enclosure. Such a gap region may be annular such that the liquid flow into and/or from the enclosure occurs via the space/gap between the electronic component and the wall or body of the second housing.
Optionally, the second housing is adjustably mounted at the apparatus via an actuator that by actuation is configured to change an internal volume of the enclosure. Optionally, the apparatus comprises an actuator connected to the second housing to actuate a movement of the second housing, the actuator configured to change any one or a combination of: an internal volume of the enclosure; a position of the enclosure relative to the housing and/or the heat-generating electronic component; a separation distance between the second housing and the heat-generating electronic component; an extent to which the second housing encapsulates or accommodates the heat-generating electronic component within the enclosure. The actuator may comprise an electronic actuator, a magnetic actuator, a pneumatic or hydraulic actuator, a combination of such actuators including optionally an electromagnetic or electromechanical actuator controlled locally or remotely via the control unit.
Optionally, the apparatus comprises a pump connected in fluid communication to the inlet and/or the outlet of the second housing to drive a flow of the liquid through the enclosure.
Optionally, the apparatus comprises a first electronically controllable valve connected in fluid communication to the inlet and/or the outlet of the chamber and a second electronically controllable valve connected in fluid communication to the inlet and/or the outlet of the enclosure. Optionally, the apparatus further comprises at least one electronically controllable valve provided in fluid communication with the inlet and/or the outlet of the second housing.
Optionally, the apparatus further comprises at least one temperature sensor to determine a temperature or relative temperature difference of the liquid and/or the heat-generating electronic component, the temperature sensor provided in electronic communication with the control unit. Optionally, the electronic device or the first and/or second heat-generating electronic components comprise a temperature sensor to determine a temperature or a temperature difference of the liquid and the first and/or second heat-generating electronic components. Optionally, the apparatus comprises at least one sensor. Optionally, the at least one sensor may comprise at least one flow rate, temperature, proximity, motion, current, voltage, pH and/or magnet sensor.
Optionally, the apparatus comprises a liquid return conduit connecting in fluid communication the outlet of the chamber and the inlet of the enclosure to circulate the liquid that exits the chamber into the enclosure. Optionally, the apparatus comprises a temporary storage reservoir connected in fluid communication between the outlet of the chamber and the inlet of the enclosure to temporarily store a volume of the liquid for circulation from the chamber to the enclosure. Optionally, an inlet of the chamber comprises a plenum to distribute a flow of the liquid into the chamber.
Optionally, the cooling unit comprises a heat exchanger to transfer heat energy from the liquid to a heat transfer fluid. Optionally, the heat exchanger comprises a refrigerant fluid configured for circulation within a fluid circuit or network being separate to a dielectric liquid and the dielectric liquid network configured to flow through the chamber and the enclosures. These exchanges configured to allow thermal energy transfer between the dielectric liquid and the refrigerant fluid and in particular the transfer of heat energy from the dielectric liquid to the refrigerant working fluid.
Preferably, the outlet of the primary housing is connected in fluid communication to an inlet of the cooling unit and an outlet of the cooling unit is connected in fluid communication to the inlet of the second housing.
Optionally, the apparatus comprises a plurality of second housings, each having a respective inlet and outlet connected in fluid communication to the cooling unit. Optionally, at least some of the second housings are connected in-series with one another as part of a liquid flow network including the cooling unit. Optionally, at least some of the second housings are connected in-parallel with one another as part of a liquid flow network including the cooling unit.
Optionally, a dielectric cooling liquid is contained within the chamber and capable of flowing through the enclosure. Optionally, at least a part of the electronic device and/or the at least a part of first heat-generating electronic component is positioned within the chamber and immersed in direct contact with the liquid within the chamber and at least a part of the at least one second heat-generating electronic component is positioned within the enclosure and immersed in direct contact with the liquid within the enclosure.
Optionally, the apparatus comprises at least one weir arrangement provided in fluid communication with the inlet and/or the outlet of the primary housing and/or the second housing. Optionally, the apparatus comprises a first weir arrangement provided in fluid communication with the inlet and/or the outlet of the second housing. Optionally, the apparatus may comprise a second weir arrangement provided in fluid communication with the inlet and/or the outlet of the primary housing. Reference within the specification to ‘a weir arrangement’ encompasses at least one aperture, partition wall, flow restriction body and the like configured to at least partially separate a first volume of liquid from a second volume of liquid such that liquid is configured to flow from the first volume to the second volume via a restricted flow pathway at the weir arrangement. Such an arrangement encompasses an overflow or through-flow arrangement. Optionally, the weir arrangement may provide the over- or through-flow under gravity.
Optionally, the apparatus comprises at least one storage reservoir connected in fluid communication to the chamber to feed and/or receive the liquid at the chamber and to maintain a pre-determined volume of liquid at the chamber. Optionally, the apparatus may comprise at least one main storage reservoir connected in fluid communication to at least one of the inlet and outlet of the enclosure/second housing to store the liquid as part of a fluid flow network. Optionally, the main storage reservoir comprises a pressurisation mechanism to change a pressure of the liquid within the fluid flow network. Optionally, the pressurisation mechanism comprises at least one electronically controllable valve to control a volume of liquid within the main storage reservoir and/or the fluid flow network.
According to a further aspect of the present concept there is provided a method of cooling at least part of an electronic device comprising: immersing an electronic device having at least one heat-generating electronic component within a dielectric cooling liquid contained within a chamber defined by a primary housing; immersing the heat-generating electronic component within the liquid within an enclosure defined by a second housing located within the chamber; providing a first flow of the liquid through the chamber via at least one inlet and at least one outlet provided at the primary housing; providing a second flow of the liquid through the enclosure via at least one inlet and at least one outlet provided at the second housing; cooling the liquid heated by the electronic device and/or the heat-generating electronic component using a cooling device forming part of a fluid flow network connected in fluid communication to at least one of the inlets and at least one of the outlets.
Optionally, the electronic device comprises at least a first heat-generating electronic component and at least one second heat-generating electronic component that is capable of or comprises a higher operating temperature than the first heat-generating electronic component, wherein at least a part of the second heat-generating electronic component is positioned in direct contact with the liquid within the enclosure defined by the second housing and/or at least a part of the first heat-generating electronic component is positioned in direct contact with the liquid within the chamber.
Optionally, the chamber is connected in fluid communication in-series with the enclosure such that the liquid is configured to flow through the chamber and then to flow through the enclosure.
Optionally, the method comprises plurality of enclosures defined by respective second housings each enclosing a respective heat-generating electronic component provided at the electronic device; wherein the plurality of enclosures are connected in liquid flow in-series with one another; and wherein the respective heat-generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged within respective second housings in order of increasing operating temperature such that the liquid is configured to flow through the respective enclosures in contact with the respective heat-generating electronic components in-series from the relative low to high operating temperature.
Optionally, the liquid is configured to flow from the outlet of the chamber to the inlet of the enclosure via a return flow conduit and then the liquid is configured to flow from the at least one outlet of the enclosure to a fluid flow network that includes the cooling unit.
Optionally, the method comprises controlling a flow of the liquid to flow along the first pathway through the chamber in direct contact with at least a part of the first heat-generating electronic component and then along a second flow pathway through the enclosure in direct contact with at least a part of the second heat-generating electronic component such that heat energy transferred to the liquid is a sum of a heat energy transferred from the first heat-generating electronic component and the second heat-generating electronic component.
Preferably, the method comprises driving a flow of the liquid through the chamber and/or the enclosure using a pump. Preferably, the method comprises directing a return flow of the liquid from the outlet of the chamber at an end of the first flow pathway to the inlet of the enclosure at a start of the second flow pathway. Preferably, the method further comprises directing the flow of the liquid from the outlet of the enclosure to the cooling unit to reduce the temperature of the liquid; and providing a return flow of the liquid cooled by the cooling unit to the inlet of the enclosure.
Optionally, the method comprises temporarily storing the liquid received from the outlet of the chamber at the end of the first flow pathway at a temperature storage reservoir prior to the step of directing the return flow of the liquid to the inlet of the enclosure. Optionally, the electronic device comprises a plurality of first heat-generating electronic components each immersed in the liquid and a plurality of second housings defining respective enclosures to accommodate the heat-generating electronic components. Optionally, the liquid flows through the enclosures in direct contact with the heat-generating electronic components and the flow through some of the enclosures is in-series and/or the flow through some of the enclosures is in-parallel.
According to a further aspect of the present concept there is provided a liquid immersion cooling bath to cool an electronic device having at least one heat-generating electronic component, the bath comprising the apparatus as described and claimed herein; and an electronic device having at least one heat-generating electronic component, the device and the heat-generating electronic component immersed respectively within the dielectric cooling liquid contained within the chamber as defined by the primary housing and/or the enclosure as defined by the second housing.
Optionally, the liquid immersion cooling bath comprises at least one primary housing defining the chamber to accommodate the at least one electronic device having at least one heat-generating electronic component; a plurality of second housings located within the chamber defining respective enclosures to at least partially accommodate respective heat-generating electronic component of the devices; and a plurality of electronic devices each having at least one heat-generating electronic component, the devices immersed within the liquid contained within the chamber and the at least one heat-generating electronic component immersed within the liquid contained within the respectively enclosures.
Optionally, the liquid immersion cooling bath comprises a plurality of electronic devices each have first and second heat-generating electronic components, the devices and the first heat-generating electronic components at least partially immersed within or completely submerged by the liquid contained within the primary housing and the second heat-generating electronic components at least partially immersed within or completely submerged by the liquid contained within the enclosures.
A specific implementation of the present invention will now be described, by way of example only, and with reference to the accompanying drawings in which:
The present partitioned cooling fluid system seeks to maximise the energy efficiency within a circulating cooling liquid network via the segregated/partitioned delivery of a working liquid to an array of on-board heat generating devices (typically microprocessors) differentiated by their or typical operating temperatures. In particular, the present system provides a multi-stage, in-series cooling liquid circulation network in which a dielectric cooling liquid may be delivered via an initial flow path in direct contact with at least one heat generating device having a relative low operating temperature and then to flow via a second flow path in direct contact with at least one or a plurality of heat generating devices (approximately co-located with the low heat generating devices) such that a transfer of heat energy from the low and then the high heat generating devices occur in-series as a multi-stage heat transfer process. This configuration maximises the temperature change of the circulated cooling liquid. The present system may be implemented either within an immersion cooling bath or a more conventional IT hardware node rack.
Referring to
Referring to
According to the in-series partitioned immersion cooling of the respective LHGDs 17 and HHGDs 19, the temperature differential of the liquid at outlet 23 and inlet 22 is maximised that, in turn, maximises the energy efficiency of the present arrangement. In particular, according to the arrangement of
According to the various embodiments described herein, the present apparatus and system comprises a control unit, sensors and electronically controllable fluid flow valves so as to control and regulate a flow rate of the dielectric liquid flowing through the various regions of the apparatus and to maximise energy efficiency and in particular a desired heat energy exchange with the LHGDs 17 and HHGDs 19. The control unit may comprise a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor and/or a motherboard and the like. The sensors may comprise flow rate, temperature, proximity, motion, current, voltage, pH, and/or magnetism sensors. The control valves may comprise a solenoid valve, a diaphragm valve, or other electromagnetic valve including by way of example direct actuating, pilot-operated, two-way, three-way, four-way valves and combinations thereof. The present system and apparatus may be controlled locally and/or remotely via a cloud network and is configurable for the local or remote monitoring of the various operational characteristics of the present system and apparatus including operational performance of the electronic components and/or the dielectric cooling fluid.
Referring to
Referring to
A variation of the embodiment of
Referring to
The arrangements of
The present apparatus implemented as either an immersion cooling bath of
The encapsulation of each HHGD 19 and the respective partitioning against other HHGDs 19 and LHGDs 17 increases the temperature differential of the dielectric liquid delivered initially to the bath 10 (at inlets 22) relative to the heated liquid delivered to the heat exchanger device 26. Additionally, via the control unit 33 (
Referring to
| Number | Date | Country | Kind |
|---|---|---|---|
| 2207272.2 | May 2022 | GB | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2023/060905 | 4/26/2023 | WO |
