by induction heating

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CPC
H01L2224/75264

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75264by induction heating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip mounting apparatus and semiconductor chip mounti...
- Patent number 10,978,420
- Issue date Apr 13, 2021
- Shinkawa Ltd.
- Yoshihito Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-based additive manufacturing system for 3D structural ele...
- Patent number 10,748,867
- Issue date Aug 18, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Magnetic attachment structure
- Patent number 9,010,618
- Issue date Apr 21, 2015
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reactive bonding of a flip chip package
- Patent number 8,987,130
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of Manufacturing a semiconductor module and device for the same
- Patent number 8,791,564
- Issue date Jul 29, 2014
- Toyota Jidosha Kabushiki Kaisha
- Hiroki Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic attachment structure
- Patent number 8,434,668
- Issue date May 7, 2013
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...
- Publication number 20200251441
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Chip-To-Wafer Integration
- Publication number 20160155720
- Publication date Jun 2, 2016
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...
- Publication number 20150060527
- Publication date Mar 5, 2015
- Weihua Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20130320529
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20130248114
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Seung Dae SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20130224444
- Publication date Aug 29, 2013
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEM FOR 3D STRUCTURAL ELE...
- Publication number 20130170171
- Publication date Jul 4, 2013
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME
- Publication number 20130139380
- Publication date Jun 6, 2013
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...
- Publication number 20120319253
- Publication date Dec 20, 2012
- Toyota Jidosha Kabushiki Kaisha
- Hiroki Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20110278044
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by induction heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip mounting apparatus and semiconductor chip mounti...

Extrusion-based additive manufacturing system for 3D structural ele...

Magnetic intermetallic compound interconnect

Method and apparatus for chip-to-wafer integration

Anisotropic conductive adhesive with reduced migration

Magnetic attachment structure

Reactive bonding of a flip chip package

Method of Manufacturing a semiconductor module and device for the same

Magnetic attachment structure

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...

Method and Apparatus for Chip-To-Wafer Integration

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...

Anisotropic Conductive Adhesive with Reduced Migration

REACTIVE BONDING OF A FLIP CHIP PACKAGE

CHIP BONDING APPARATUS

MAGNETIC ATTACHMENT STRUCTURE

EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEM FOR 3D STRUCTURAL ELE...

CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME

SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...

MAGNETIC ATTACHMENT STRUCTURE