by infrared heating

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H01L2224/78283

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78283by infrared heating

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Top infrared heating for bonding operations
- Patent number 6,384,366
- Issue date May 7, 2002
- Advanced Micro Devices, Inc.
- Pak C. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid and selective heating method in integrated circuit package as...
- Patent number 6,041,994
- Issue date Mar 28, 2000
- Texas Instruments Incorporated
- Ming Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR