by ion implantation

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H01L21/76859

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76859by ion implantation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for BEOL metal to dielectric adhesion
- Patent number 11,942,324
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Qintao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,923,242
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Tatsuya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,153
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,837,645
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Yoontae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating microelectronic devices and related microelec...
- Patent number 11,784,050
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for selective tungsten contact formation on semiconducto...
- Patent number 11,728,214
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with enhanced contact structure and a...
- Patent number 11,664,427
- Issue date May 30, 2023
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common rail contact
- Patent number 11,652,149
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implant process for defect elimination in metal layer planariza...
- Patent number 11,450,565
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with enhanced contact structure and a...
- Patent number 11,387,325
- Issue date Jul 12, 2022
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 11,335,594
- Issue date May 17, 2022
- Mitsubishi Electric Corporation
- Kohei Nishiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with landing pad of conductive polymer and met...
- Patent number 11,309,313
- Issue date Apr 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foam in ion implantation system
- Patent number 11,222,768
- Issue date Jan 11, 2022
- Varian Semiconductor Equipment Associates, Inc.
- James Alan Pixley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple metallization scheme
- Patent number 11,217,479
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 11,056,505
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,011,468
- Issue date May 18, 2021
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-state device based on ion trapping
- Patent number 10,886,124
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Ning Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for making a semiconductor device including enhanced contact...
- Patent number 10,879,356
- Issue date Dec 29, 2020
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including enhanced contact structures having a...
- Patent number 10,777,451
- Issue date Sep 15, 2020
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-state device based on ion trapping
- Patent number 10,559,463
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Ning Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 10,541,249
- Issue date Jan 21, 2020
- Yangtze Memory Technologies Co., Ltd.
- Ziqi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 10,522,466
- Issue date Dec 31, 2019
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for gap filling improvement
- Patent number 10,283,359
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal interconnect structure and fabrication method thereof
- Patent number 10,090,246
- Issue date Oct 2, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to reduce copper loss during metal cap formation
- Patent number 10,090,151
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to reduce copper loss during metal cap formation
- Patent number 9,947,621
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for gap filling improvement
- Patent number 9,624,576
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact structure for thin film semiconductor
- Patent number 9,627,498
- Issue date Apr 18, 2017
- Macronix International Co., Ltd.
- Jia-Rong Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming MIS contact structures on transistor devices in...
- Patent number 9,613,855
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES Inc.
- Suraj K. Patil
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMMON RAIL CONTACT
- Publication number 20240387655
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING HIGH ASPECT RATIO OPENINGS IN A SEMICONDUCTOR DEVI...
- Publication number 20240379424
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- Bing ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20240363404
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240222191
- Publication date Jul 4, 2024
- WINBOND ELECTRONICS CORP.
- Ping-Lung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND RELATED METHODS OF FABRICATING MICROELE...
- Publication number 20240006179
- Publication date Jan 4, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A CONTACT PLUG WITH IMPROVED CONTACT METAL SEALING
- Publication number 20230420297
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230387222
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE...
- Publication number 20230343641
- Publication date Oct 26, 2023
- Western Digital Technologies, Inc.
- Roshan Jayakhar TIRUKKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION THROUGH AN ETCH STOP LAYER
- Publication number 20230307291
- Publication date Sep 28, 2023
- Intel Corporation
- Moshe Dolejsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON RAIL CONTACT
- Publication number 20230290842
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20230063917
- Publication date Mar 2, 2023
- Yangtze Memory Technologies Co., Ltd.
- Huidan Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SELECTIVE TUNGSTEN CONTACT FORMATION ON SEMICONDUCTO...
- Publication number 20220392804
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20220359277
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICROELECTRONIC DEVICES AND RELATED MICROELEC...
- Publication number 20220344161
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...
- Publication number 20220285498
- Publication date Sep 8, 2022
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BEOL METAL TO DIELECTRIC ADHESION
- Publication number 20220189774
- Publication date Jun 16, 2022
- Applied Materials, Inc.
- Qintao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYNAPTIC MECHANOTRANSISTORS
- Publication number 20220164640
- Publication date May 26, 2022
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Do Hwan KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
- Publication number 20220115505
- Publication date Apr 14, 2022
- Intel Corporation
- KELIN J. KUHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LANDING PAD OF CONDUCTIVE POLYMER AND MET...
- Publication number 20220051992
- Publication date Feb 17, 2022
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220013408
- Publication date Jan 13, 2022
- Mitsubishi Electric Corporation
- Kohei NISHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210320033
- Publication date Oct 14, 2021
- TOKYO ELECTRON LIMITED
- Tatsuya YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having One or More Modifying Substances Distr...
- Publication number 20210313346
- Publication date Oct 7, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20210305092
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having One or More Modifying Substances Distr...
- Publication number 20210175249
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...
- Publication number 20210074814
- Publication date Mar 11, 2021
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200111743
- Publication date Apr 9, 2020
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOAM IN ION IMPLANTATION SYSTEM
- Publication number 20200083021
- Publication date Mar 12, 2020
- Varian Semiconductor Equipment Associates, Inc.
- James Alan Pixley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE METALLIZATION SCHEME
- Publication number 20200043784
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING ENHANCED CONTACT...
- Publication number 20190279897
- Publication date Sep 12, 2019
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS

by ion implantation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated assemblies having one or more modifying substances distr...

Method for BEOL metal to dielectric adhesion

Method of manufacturing semiconductor device

Semiconductor device and method

Method of manufacturing a semiconductor device

Method of fabricating microelectronic devices and related microelec...

Techniques for selective tungsten contact formation on semiconducto...

Vertical semiconductor device with enhanced contact structure and a...

Common rail contact

Ion implant process for defect elimination in metal layer planariza...

Vertical semiconductor device with enhanced contact structure and a...

Method for manufacturing semiconductor device and semiconductor device

Semiconductor device with landing pad of conductive polymer and met...

Foam in ion implantation system

Multiple metallization scheme

Integrated assemblies having one or more modifying substances distr...

Semiconductor structure and method for manufacturing the same

Multi-state device based on ion trapping

Method for making a semiconductor device including enhanced contact...

Semiconductor device including enhanced contact structures having a...

Multi-state device based on ion trapping

Three-dimensional memory devices and fabricating methods thereof

Semiconductor structure and method for manufacturing the same

Systems and methods for gap filling improvement

Metal interconnect structure and fabrication method thereof

Structure and method to reduce copper loss during metal cap formation

Structure and method to reduce copper loss during metal cap formation

Systems and methods for gap filling improvement

Contact structure for thin film semiconductor

Methods of forming MIS contact structures on transistor devices in...

Patents Applicationslast 30 patents

COMMON RAIL CONTACT

SEMICONDUCTOR DEVICE AND METHOD

METHOD OF MAKING HIGH ASPECT RATIO OPENINGS IN A SEMICONDUCTOR DEVI...

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MICROELECTRONIC DEVICES AND RELATED METHODS OF FABRICATING MICROELE...

METHOD FOR FORMING A CONTACT PLUG WITH IMPROVED CONTACT METAL SEALING

SEMICONDUCTOR DEVICE AND METHOD

METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE...

IMPLANTATION THROUGH AN ETCH STOP LAYER

COMMON RAIL CONTACT

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

TECHNIQUES FOR SELECTIVE TUNGSTEN CONTACT FORMATION ON SEMICONDUCTO...

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

METHOD OF FABRICATING MICROELECTRONIC DEVICES AND RELATED MICROELEC...

VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...

METHOD FOR BEOL METAL TO DIELECTRIC ADHESION

SYNAPTIC MECHANOTRANSISTORS

COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT

SEMICONDUCTOR DEVICE WITH LANDING PAD OF CONDUCTIVE POLYMER AND MET...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Integrated Assemblies Having One or More Modifying Substances Distr...

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

Integrated Assemblies Having One or More Modifying Substances Distr...

VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

FOAM IN ION IMPLANTATION SYSTEM

MULTIPLE METALLIZATION SCHEME

METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING ENHANCED CONTACT...