Membership
Tour
Register
Log in
by ion implantation
Follow
Industry
CPC
H01L21/76859
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/76859
by ion implantation
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for BEOL metal to dielectric adhesion
Patent number
11,942,324
Issue date
Mar 26, 2024
Applied Materials, Inc.
Qintao Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,923,242
Issue date
Mar 5, 2024
Tokyo Electron Limited
Tatsuya Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,855,153
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Po-Chuan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
11,837,645
Issue date
Dec 5, 2023
Samsung Electronics Co., Ltd.
Yoontae Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating microelectronic devices and related microelec...
Patent number
11,784,050
Issue date
Oct 10, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for selective tungsten contact formation on semiconducto...
Patent number
11,728,214
Issue date
Aug 15, 2023
Applied Materials, Inc.
Sipeng Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical semiconductor device with enhanced contact structure and a...
Patent number
11,664,427
Issue date
May 30, 2023
ATOMERA INCORPORATED
Robert John Stephenson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Common rail contact
Patent number
11,652,149
Issue date
May 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Wei Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ion implant process for defect elimination in metal layer planariza...
Patent number
11,450,565
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical semiconductor device with enhanced contact structure and a...
Patent number
11,387,325
Issue date
Jul 12, 2022
ATOMERA INCORPORATED
Robert John Stephenson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device and semiconductor device
Patent number
11,335,594
Issue date
May 17, 2022
Mitsubishi Electric Corporation
Kohei Nishiguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with landing pad of conductive polymer and met...
Patent number
11,309,313
Issue date
Apr 19, 2022
NANYA TECHNOLOGY CORPORATION
Chia-Hsiang Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Foam in ion implantation system
Patent number
11,222,768
Issue date
Jan 11, 2022
Varian Semiconductor Equipment Associates, Inc.
James Alan Pixley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple metallization scheme
Patent number
11,217,479
Issue date
Jan 4, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hsin-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated assemblies having one or more modifying substances distr...
Patent number
11,056,505
Issue date
Jul 6, 2021
Micron Technology, Inc.
John D. Hopkins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for manufacturing the same
Patent number
11,011,468
Issue date
May 18, 2021
NANYA TECHNOLOGY CORPORATION
Hsih-Yang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-state device based on ion trapping
Patent number
10,886,124
Issue date
Jan 5, 2021
International Business Machines Corporation
Ning Li
G11 - INFORMATION STORAGE
Information
Patent Grant
Method for making a semiconductor device including enhanced contact...
Patent number
10,879,356
Issue date
Dec 29, 2020
ATOMERA INCORPORATED
Robert John Stephenson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including enhanced contact structures having a...
Patent number
10,777,451
Issue date
Sep 15, 2020
ATOMERA INCORPORATED
Robert John Stephenson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-state device based on ion trapping
Patent number
10,559,463
Issue date
Feb 11, 2020
International Business Machines Corporation
Ning Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory devices and fabricating methods thereof
Patent number
10,541,249
Issue date
Jan 21, 2020
Yangtze Memory Technologies Co., Ltd.
Ziqi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for manufacturing the same
Patent number
10,522,466
Issue date
Dec 31, 2019
NANYA TECHNOLOGY CORPORATION
Hsih-Yang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for gap filling improvement
Patent number
10,283,359
Issue date
May 7, 2019
Taiwan Semiconductor Manufacturing Company Limited
Chi-Yuan Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Metal interconnect structure and fabrication method thereof
Patent number
10,090,246
Issue date
Oct 2, 2018
Semiconductor Manufacturing International (Beijing) Corporation
Jiquan Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method to reduce copper loss during metal cap formation
Patent number
10,090,151
Issue date
Oct 2, 2018
International Business Machines Corporation
Praneet Adusumilli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method to reduce copper loss during metal cap formation
Patent number
9,947,621
Issue date
Apr 17, 2018
International Business Machines Corporation
Praneet Adusumilli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for gap filling improvement
Patent number
9,624,576
Issue date
Apr 18, 2017
Taiwan Semiconductor Manufacturing Company Limited
Chi-Yuan Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Contact structure for thin film semiconductor
Patent number
9,627,498
Issue date
Apr 18, 2017
Macronix International Co., Ltd.
Jia-Rong Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming MIS contact structures on transistor devices in...
Patent number
9,613,855
Issue date
Apr 4, 2017
GLOBALFOUNDRIES Inc.
Suraj K. Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of the same
Patent number
9,559,052
Issue date
Jan 31, 2017
Renesas Electronics Corporation
Tatsuya Usami
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC DEVICES AND RELATED METHODS OF FABRICATING MICROELE...
Publication number
20240006179
Publication date
Jan 4, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A CONTACT PLUG WITH IMPROVED CONTACT METAL SEALING
Publication number
20230420297
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD
Publication number
20230387222
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Chuan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE...
Publication number
20230343641
Publication date
Oct 26, 2023
Western Digital Technologies, Inc.
Roshan Jayakhar TIRUKKONDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPLANTATION THROUGH AN ETCH STOP LAYER
Publication number
20230307291
Publication date
Sep 28, 2023
Intel Corporation
Moshe Dolejsi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMMON RAIL CONTACT
Publication number
20230290842
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Wei Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
Publication number
20230063917
Publication date
Mar 2, 2023
Yangtze Memory Technologies Co., Ltd.
Huidan Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR SELECTIVE TUNGSTEN CONTACT FORMATION ON SEMICONDUCTO...
Publication number
20220392804
Publication date
Dec 8, 2022
Applied Materials, Inc.
Sipeng Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
Publication number
20220359277
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Cheng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING MICROELECTRONIC DEVICES AND RELATED MICROELEC...
Publication number
20220344161
Publication date
Oct 27, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...
Publication number
20220285498
Publication date
Sep 8, 2022
ATOMERA INCORPORATED
Robert John Stephenson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR BEOL METAL TO DIELECTRIC ADHESION
Publication number
20220189774
Publication date
Jun 16, 2022
Applied Materials, Inc.
Qintao Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYNAPTIC MECHANOTRANSISTORS
Publication number
20220164640
Publication date
May 26, 2022
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
Do Hwan KIM
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
Publication number
20220115505
Publication date
Apr 14, 2022
Intel Corporation
KELIN J. KUHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH LANDING PAD OF CONDUCTIVE POLYMER AND MET...
Publication number
20220051992
Publication date
Feb 17, 2022
NANYA TECHNOLOGY CORPORATION
Chia-Hsiang HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication number
20220013408
Publication date
Jan 13, 2022
Mitsubishi Electric Corporation
Kohei NISHIGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20210320033
Publication date
Oct 14, 2021
TOKYO ELECTRON LIMITED
Tatsuya YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Assemblies Having One or More Modifying Substances Distr...
Publication number
20210313346
Publication date
Oct 7, 2021
Micron Technology, Inc.
John D. Hopkins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
Publication number
20210305092
Publication date
Sep 30, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Cheng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Assemblies Having One or More Modifying Substances Distr...
Publication number
20210175249
Publication date
Jun 10, 2021
Micron Technology, Inc.
John D. Hopkins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...
Publication number
20210074814
Publication date
Mar 11, 2021
ATOMERA INCORPORATED
Robert John Stephenson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20200111743
Publication date
Apr 9, 2020
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FOAM IN ION IMPLANTATION SYSTEM
Publication number
20200083021
Publication date
Mar 12, 2020
Varian Semiconductor Equipment Associates, Inc.
James Alan Pixley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE METALLIZATION SCHEME
Publication number
20200043784
Publication date
Feb 6, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING ENHANCED CONTACT...
Publication number
20190279897
Publication date
Sep 12, 2019
ATOMERA INCORPORATED
Robert John Stephenson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
Publication number
20190123054
Publication date
Apr 25, 2019
Yangtze Memory Technologies Co., Ltd.
Ziqi CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD TO REDUCE COPPER LOSS DURING METAL CAP FORMATION
Publication number
20180190592
Publication date
Jul 5, 2018
International Business Machines Corporation
Praneet Adusumilli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD TO REDUCE COPPER LOSS DURING METAL CAP FORMATION
Publication number
20180040507
Publication date
Feb 8, 2018
International Business Machines Corporation
Praneet Adusumilli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20170062344
Publication date
Mar 2, 2017
Semiconductor Manufacturing International (Beijing ) Corporation
JIQUAN LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20150228586
Publication date
Aug 13, 2015
Renesas Electronics Corporation
Tatsuya Usami
H01 - BASIC ELECTRIC ELEMENTS