by laminating two or more circuit boards

Industry

CPC
H05K3/4611

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4611by laminating two or more circuit boards

Industries

Patents Grantslast 30 patents

Information Patent Grant
Transformer guard trace
- Patent number 12,176,285
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for pcb with thermal conductor embedded therei...
- Patent number 12,171,057
- Issue date Dec 17, 2024
- SHENGYI ELECTRONICS CO., LTD.
- Lu Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extensible and contractible wiring board and method for manufacturi...
- Patent number 12,133,326
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 12,114,436
- Issue date Oct 8, 2024
- SHENNAN CIRCUITS CO., LTD.
- Zhicheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of improving wire structure of circuit board and improving w...
- Patent number 12,089,347
- Issue date Sep 10, 2024
- Unimicron Technology Corp.
- Chun Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,063,743
- Issue date Aug 13, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, resin sheet, laminate, and printed...
- Patent number 12,006,433
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouichi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with an embedded thermally conductive block and m...
- Patent number 11,864,306
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board utilizing optical signals in addition to electrical s...
- Patent number 11,754,781
- Issue date Sep 12, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Millimeter wave antenna and method of manufacturing the same
- Patent number 11,721,887
- Issue date Aug 8, 2023
- SHENZHEN JAGUAR WAVE TECHNOLOGY LTD.
- Haibo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,558,958
- Issue date Jan 17, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepregs and laminates having a UV curable resin layer
- Patent number 11,558,962
- Issue date Jan 17, 2023
- Isola USA Corp.
- Roland Schönholz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board and method of manufacturing printed wiring board
- Patent number 11,540,390
- Issue date Dec 27, 2022
- Kyocera Corporation
- Tomoya Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing mini smart card
- Patent number 11,526,718
- Issue date Dec 13, 2022
- BEAUTIFUL CARD CORPORATION
- Meng-Jen Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device having first and second component carrier parts w...
- Patent number 11,527,807
- Issue date Dec 13, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fabrizio Gentili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an asymmetric printed circuit board with minimized warpage
- Patent number 11,523,519
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
All-directions embeded module, method for manufacturing the all-dir...
- Patent number 11,483,931
- Issue date Oct 25, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,457,532
- Issue date Sep 27, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module with single or multiple components partially surr...
- Patent number 11,452,199
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,445,606
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,439,019
- Issue date Sep 6, 2022
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with embedded component carrier
- Patent number 11,410,965
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board and multil...
- Patent number 11,277,924
- Issue date Mar 15, 2022
- Fujikura Ltd.
- Akimi Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding known-good component between known-good component carrier...
- Patent number 11,184,983
- Issue date Nov 23, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier connected with a separate tilted component carrie...
- Patent number 11,178,772
- Issue date Nov 16, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRAL ELECTRONIC STACK
- Publication number 20240414845
- Publication date Dec 12, 2024
- 3M Innovative Properties Company
- Jeongwan Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341043
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240276652
- Publication date Aug 15, 2024
- LEOTEK CORPORATION
- Cheng-Ta TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multi-layer flexible circuit board and art...
- Publication number 20240244764
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENSIBLE AND CONTRACTIBLE WIRING BOARD AND METHOD FOR MANUFACTURI...
- Publication number 20230413428
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MODULE
- Publication number 20230413439
- Publication date Dec 21, 2023
- MURATA MANUFACTURING CO., LTD.
- Issei YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD
- Publication number 20230375780
- Publication date Nov 23, 2023
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20230247774
- Publication date Aug 3, 2023
- CATLAM, LLC
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING ASYMMETRIC BOARD
- Publication number 20230164927
- Publication date May 25, 2023
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prepregs and Laminates Having a UV Curable Resin Layer
- Publication number 20230127186
- Publication date Apr 27, 2023
- Isola USA Corp.
- Roland Schönholz
- B32 - LAYERED PRODUCTS
Information Patent Application
Partially Filling a Component Carrier Opening in a Controlled Manner
- Publication number 20230105997
- Publication date Apr 6, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas WULZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS AND MULTILAYER CIR...
- Publication number 20230095254
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Sang Min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF IMPROVING WIRE STRUCTURE OF CIRCUIT BOARD AND IMPROVING W...
- Publication number 20230092278
- Publication date Mar 23, 2023
- Unimicron Technology Corp.
- Chun Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230072239
- Publication date Mar 9, 2023
- SHENNAN CIRCUITS CO.,LTD.
- ZHICHENG YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHODS FOR FABRICATING A CIRCUIT BOARD
- Publication number 20230010064
- Publication date Jan 12, 2023
- The University of British Columbia
- Mirza Sarwar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220394859
- Publication date Dec 8, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- FU-YUN SHEN
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377886
- Publication date Nov 24, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220369466
- Publication date Nov 17, 2022
- Nichia Corporation.
- Masakazu SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD UTILIZING OPTICAL SIGNALS IN ADDITION TO ELECTRICAL S...
- Publication number 20220357508
- Publication date Nov 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- G02 - OPTICS
Information Patent Application
Method for manufacturing multi-layer flexible circuit board and art...
- Publication number 20220330437
- Publication date Oct 13, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Component in Component Carrier by Component Fixation Stru...
- Publication number 20220053633
- Publication date Feb 17, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MINI SMART CARD
- Publication number 20210334616
- Publication date Oct 28, 2021
- BEAUTIFUL CARD CORPORATION
- MENG-JEN CHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Component Carrier With an Embedded Thermally Conductive Block and M...
- Publication number 20210337653
- Publication date Oct 28, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...
- Publication number 20210267064
- Publication date Aug 26, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED-WIRING BOARD AND METHOD OF MANUFACTURING PRINTED-WIRING BOARD
- Publication number 20210185812
- Publication date Jun 17, 2021
- KYOCERA CORPORATION
- Tomoya NAGASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20210161019
- Publication date May 27, 2021
- FUJIKURA LTD.
- Akimi Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLIMETER WAVE ANTENNA AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210135346
- Publication date May 6, 2021
- SHENZHEN JAGUAR WAVE TECHNOLOGY LTD.
- Haibo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...
- Publication number 20210120674
- Publication date Apr 22, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by laminating two or more circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transformer guard trace

Manufacturing method for pcb with thermal conductor embedded therei...

Method for manufacturing photoelectric composite circuit board

Extensible and contractible wiring board and method for manufacturi...

Composite circuit board and method of manufacturing the same

Method of improving wire structure of circuit board and improving w...

Embedding component in component carrier by component fixation stru...

Printed circuit board

Thermosetting resin composition, resin sheet, laminate, and printed...

Method for fabricating asymmetric board

Component carrier with an embedded thermally conductive block and m...

Circuit board utilizing optical signals in addition to electrical s...

Millimeter wave antenna and method of manufacturing the same

Method for manufacturing an electronic module and electronic module

Laminated body and method for manufacturing the same

Prepregs and laminates having a UV curable resin layer

Printed wiring board and method of manufacturing printed wiring board

Method of manufacturing mini smart card

Electronic device having first and second component carrier parts w...

Fabricating an asymmetric printed circuit board with minimized warpage

All-directions embeded module, method for manufacturing the all-dir...

Method of manufacturing circuit board

Electronic module with single or multiple components partially surr...

Laminated body and method for manufacturing the same

Printed circuit board and method of manufacturing the same

Electronic device with embedded component carrier

Method of assembly by direct bonding between two elements, each ele...

Method for manufacturing multilayer printed wiring board and multil...

Embedding known-good component between known-good component carrier...

Component carrier connected with a separate tilted component carrie...

Patents Applicationslast 30 patents

INTEGRAL ELECTRONIC STACK

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF

Method for manufacturing multi-layer flexible circuit board and art...

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...

EXTENSIBLE AND CONTRACTIBLE WIRING BOARD AND METHOD FOR MANUFACTURI...

WIRING BOARD AND MODULE

METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD

Semi-Additive Process for Printed Circuit Boards

METHOD FOR FABRICATING ASYMMETRIC BOARD

Prepregs and Laminates Having a UV Curable Resin Layer

Partially Filling a Component Carrier Opening in a Controlled Manner

MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS AND MULTILAYER CIR...

METHOD OF IMPROVING WIRE STRUCTURE OF CIRCUIT BOARD AND IMPROVING W...

COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND METHODS FOR FABRICATING A CIRCUIT BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

CIRCUIT BOARD UTILIZING OPTICAL SIGNALS IN ADDITION TO ELECTRICAL S...

Method for manufacturing multi-layer flexible circuit board and art...

Embedding Component in Component Carrier by Component Fixation Stru...

METHOD OF MANUFACTURING MINI SMART CARD

Component Carrier With an Embedded Thermally Conductive Block and M...

ELECTRONIC MODULE

ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...

PRINTED-WIRING BOARD AND METHOD OF MANUFACTURING PRINTED-WIRING BOARD

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

MILLIMETER WAVE ANTENNA AND METHOD OF MANUFACTURING THE SAME

ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...