by liquid etching only

Industry

CPC
H01L21/32134

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32134by liquid etching only

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming and patterning a layer and/or substrate
- Patent number 12,183,578
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching method
- Patent number 12,183,588
- Issue date Dec 31, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tianyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested and non-nested SEI messages in video bitstreams
- Patent number 12,184,899
- Issue date Dec 31, 2024
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Ye-Kui Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device forming method and substrate processing apparatus
- Patent number 12,176,219
- Issue date Dec 24, 2024
- SCREEN Holdings Co., Ltd.
- Eiji Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent surface charge induced cd-dependent etching of m...
- Patent number 12,148,625
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,142,565
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment liquid and method for treating object to be treated
- Patent number 12,139,693
- Issue date Nov 12, 2024
- FUJIFILM Corporation
- Yasuo Sugishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method (and related apparatus) for forming a resistor over a semico...
- Patent number 12,132,075
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etchant compositions and methods
- Patent number 12,129,418
- Issue date Oct 29, 2024
- Entegris, Inc.
- Hsing-Chen Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Processing systems and platforms for roughness reduction of materia...
- Patent number 12,112,959
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Omid Zandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co/Cu selective wet etchant
- Patent number 12,110,436
- Issue date Oct 8, 2024
- VERSUM MATERIALS US, LLC
- Chung-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming vertically-stacked mem...
- Patent number 12,114,500
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching compositions
- Patent number 12,104,108
- Issue date Oct 1, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Tomonori Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etch process and method to provide uniform etching of material...
- Patent number 12,100,599
- Issue date Sep 24, 2024
- Tokyo Electron Limited
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor structures
- Patent number 12,094,821
- Issue date Sep 17, 2024
- Winbond Electronics Corp.
- Chia-Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling oxygen vacancy concentration in a semiconduct...
- Patent number 12,080,801
- Issue date Sep 3, 2024
- The Board of Trustees of the University of Illinois
- Edmund G. Seebauer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etchant compositions
- Patent number 12,074,034
- Issue date Aug 27, 2024
- Entegris, Inc.
- Chia-Jung Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for partially removing tungsten in semiconductor manufacturi...
- Patent number 12,074,035
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical liquid preparation device, and substrate processing device
- Patent number 12,064,739
- Issue date Aug 20, 2024
- SCREEN Holdings Co., Ltd.
- Hajime Nishide
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Oxidation to mitigate dry etch and/or wet etch fluorine residue
- Patent number 12,068,385
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing amorphous silicon sacrifice film and amorphous...
- Patent number 12,060,276
- Issue date Aug 13, 2024
- Merck Patent GmbH
- Naoko Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective metal residue and liner cleanse for post-subtractive etch
- Patent number 12,046,511
- Issue date Jul 23, 2024
- International Business Machines Corporation
- Devika Sarkar Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conformal capping layer and method forming same
- Patent number 12,046,660
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Ho Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
By-site-compensated etch back for local planarization/topography ad...
- Patent number 12,046,477
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching composition for metal nitride layer and etching method usin...
- Patent number 12,031,077
- Issue date Jul 9, 2024
- ENF TECHNOLOGY CO., LTD.
- Hyeon Woo Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trench isolation with conductive structures
- Patent number 12,033,900
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device active region profile and method of forming th...
- Patent number 12,027,626
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Ching Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES
- Publication number 20250006506
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Julien LADROUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...
- Publication number 20240425754
- Publication date Dec 26, 2024
- FUJIFILM CORPORATION
- Yuta SHIGENOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME
- Publication number 20240417620
- Publication date Dec 19, 2024
- YCCHEM CO., LTD.
- Jun Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRENCH ISOLATION WITH CONDUCTIVE STRUCTURES
- Publication number 20240395629
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...
- Publication number 20240387185
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379366
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...
- Publication number 20240371918
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371962
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME
- Publication number 20240347622
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Ho Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE
- Publication number 20240342672
- Publication date Oct 17, 2024
- SCREEN Holdings Co., Ltd.
- Hajime NISHIDE
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
TiN ETCHANT COMPOSITION AND METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240336839
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- GAYOUNG SONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE ACTIVE REGION PROFILE AND METHOD OF FORMING TH...
- Publication number 20240339541
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Ching Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240339320
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET
- Publication number 20240332402
- Publication date Oct 3, 2024
- Hua Hong Semiconductor (Wuxi) Limited
- Zhaozhao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...
- Publication number 20240318077
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyuyoung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...
- Publication number 20240318320
- Publication date Sep 26, 2024
- Infineon Technologies Austria AG
- Saurabh Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING COMPOSITION FOR TITANIUM-CONTAINING LAYER, ETCHING METHOD O...
- Publication number 20240318078
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Byungjoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240312792
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...
- Publication number 20240297078
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20240297074
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20240287384
- Publication date Aug 29, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Joshua Guske
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
USE OF A COMPOSITION AND A PROCESS FOR SELECTIVELY ETCHING SILICON
- Publication number 20240282584
- Publication date Aug 22, 2024
- BASF SE
- Francisco Javier LOPEZ VILLANUEVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240243179
- Publication date Jul 18, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Hui Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Array And Method Used In Forming A Memory Array Comprising S...
- Publication number 20240244840
- Publication date Jul 18, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURE AND PATTERNING METHOD
- Publication number 20240234214
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lung-Kun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
- Publication number 20240222470
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS

by liquid etching only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming and patterning a layer and/or substrate

Wet etching method

Nested and non-nested SEI messages in video bitstreams

Semiconductor device forming method and substrate processing apparatus

Methods to prevent surface charge induced cd-dependent etching of m...

Different via configurations for different via interface requirements

Treatment liquid and method for treating object to be treated

Method (and related apparatus) for forming a resistor over a semico...

Selective etchant compositions and methods

Processing systems and platforms for roughness reduction of materia...

Co/Cu selective wet etchant

Integrated structures and methods of forming vertically-stacked mem...

Etching compositions

Wet etch process and method to provide uniform etching of material...

Methods for forming semiconductor structures

Method of controlling oxygen vacancy concentration in a semiconduct...

Etchant compositions

Method for partially removing tungsten in semiconductor manufacturi...

Chemical liquid preparation device, and substrate processing device

Oxidation to mitigate dry etch and/or wet etch fluorine residue

Method for producing amorphous silicon sacrifice film and amorphous...

Semiconductor device having via sidewall adhesion with encapsulant

Substrate processing apparatus, substrate processing system, and su...

Microelectronic assembly from processed substrate

Selective metal residue and liner cleanse for post-subtractive etch

Non-conformal capping layer and method forming same

By-site-compensated etch back for local planarization/topography ad...

Etching composition for metal nitride layer and etching method usin...

Trench isolation with conductive structures

Semiconductor device active region profile and method of forming th...

Patents Applicationslast 30 patents

SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES

COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...

MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME

Semiconductor Device and Method

WET ETCH APPARATUS

TRENCH ISOLATION WITH CONDUCTIVE STRUCTURES

BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

SEMICONDUCTOR DEVICES

METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME

CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE

TiN ETCHANT COMPOSITION AND METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ACTIVE REGION PROFILE AND METHOD OF FORMING TH...

CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME

METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET

ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...

ETCHING COMPOSITION FOR TITANIUM-CONTAINING LAYER, ETCHING METHOD O...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...

Conductive Feature Formation and Structure

ETCHING COMPOSITIONS

USE OF A COMPOSITION AND A PROCESS FOR SELECTIVELY ETCHING SILICON

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Memory Array And Method Used In Forming A Memory Array Comprising S...

GATE STRUCTURE AND PATTERNING METHOD

ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER