by liquid etching only

Industry

CPC
H01L21/32134

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32134by liquid etching only

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,272,557
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon etching solution and method for producing silicon device us...
- Patent number 12,269,980
- Issue date Apr 8, 2025
- Tokuyama Corporation
- Yoshiki Seike
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,261,198
- Issue date Mar 25, 2025
- SK Hynix Inc.
- Jun Hyuk Seo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure having two N-type devices and two P-type de...
- Patent number 12,256,568
- Issue date Mar 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiaojie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,255,107
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer treatment liquid and production method thereof
- Patent number 12,247,298
- Issue date Mar 11, 2025
- Tokuyama Corporation
- Tomoaki Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etch apparatus
- Patent number 12,249,520
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,249,517
- Issue date Mar 11, 2025
- Hon Hai Precision Industry Co., Ltd.
- Kuang-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical solution, etching method, and method for manufacturing sem...
- Patent number 12,243,751
- Issue date Mar 4, 2025
- Kioxia Corporation
- Hakuba Kitagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical solution, method for manufacturing chemical solution, and...
- Patent number 12,234,399
- Issue date Feb 25, 2025
- FUJIFILM Corporation
- Nobuaki Sugimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with doped semiconductor bridge str...
- Patent number 12,225,720
- Issue date Feb 11, 2025
- SanDisk Technologies LLC
- Ryousuke Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,219,762
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device and etching liquid
- Patent number 12,203,021
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Koukichi Hiroshiro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Treatment liquid for semiconductor wafers
- Patent number 12,195,658
- Issue date Jan 14, 2025
- Tokuyama Corporation
- Yuki Kikkawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and patterning a layer and/or substrate
- Patent number 12,183,578
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested and non-nested SEI messages in video bitstreams
- Patent number 12,184,899
- Issue date Dec 31, 2024
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Ye-Kui Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etching method
- Patent number 12,183,588
- Issue date Dec 31, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tianyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device forming method and substrate processing apparatus
- Patent number 12,176,219
- Issue date Dec 24, 2024
- SCREEN Holdings Co., Ltd.
- Eiji Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent surface charge induced cd-dependent etching of m...
- Patent number 12,148,625
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,142,565
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment liquid and method for treating object to be treated
- Patent number 12,139,693
- Issue date Nov 12, 2024
- FUJIFILM Corporation
- Yasuo Sugishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method (and related apparatus) for forming a resistor over a semico...
- Patent number 12,132,075
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etchant compositions and methods
- Patent number 12,129,418
- Issue date Oct 29, 2024
- Entegris, Inc.
- Hsing-Chen Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Co/Cu selective wet etchant
- Patent number 12,110,436
- Issue date Oct 8, 2024
- VERSUM MATERIALS US, LLC
- Chung-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming vertically-stacked mem...
- Patent number 12,114,500
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing systems and platforms for roughness reduction of materia...
- Patent number 12,112,959
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Omid Zandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching compositions
- Patent number 12,104,108
- Issue date Oct 1, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Tomonori Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etch process and method to provide uniform etching of material...
- Patent number 12,100,599
- Issue date Sep 24, 2024
- Tokyo Electron Limited
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor structures
- Patent number 12,094,821
- Issue date Sep 17, 2024
- Winbond Electronics Corp.
- Chia-Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20250101303
- Publication date Mar 27, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Jieying Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET PROCESSING WITH AUTOMATIC PROCESS CONTROL
- Publication number 20250105036
- Publication date Mar 27, 2025
- Yield Engineering Systems, Inc.
- Venugopal Govindarajulu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED AND NON-NESTED SEI MESSAGES IN VIDEO BITSTREAMS
- Publication number 20250088671
- Publication date Mar 13, 2025
- Beijing Bytedance Network Technology Co., Ltd.
- Ye-Kui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PROCESSING SOLUTION
- Publication number 20250084309
- Publication date Mar 13, 2025
- Tokuyama Corporation
- Yuzan SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
- Publication number 20250069897
- Publication date Feb 27, 2025
- SEMES CO., LTD.
- Min Jung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNS ON A SUBSTRATE
- Publication number 20250062134
- Publication date Feb 20, 2025
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250054782
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Takumi HONDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...
- Publication number 20250034427
- Publication date Jan 30, 2025
- NISSAN CHEMICAL CORPORATION
- Shun KUBODERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...
- Publication number 20250011650
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Cheol HAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES
- Publication number 20250006506
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Julien LADROUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...
- Publication number 20240425754
- Publication date Dec 26, 2024
- FUJIFILM CORPORATION
- Yuta SHIGENOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME
- Publication number 20240417620
- Publication date Dec 19, 2024
- YCCHEM CO., LTD.
- Jun Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRENCH ISOLATION WITH CONDUCTIVE STRUCTURES
- Publication number 20240395629
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...
- Publication number 20240387185
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379366
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...
- Publication number 20240371918
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371962
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME
- Publication number 20240347622
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Ho Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE
- Publication number 20240342672
- Publication date Oct 17, 2024
- SCREEN Holdings Co., Ltd.
- Hajime NISHIDE
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
TiN ETCHANT COMPOSITION AND METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240336839
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- GAYOUNG SONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE ACTIVE REGION PROFILE AND METHOD OF FORMING TH...
- Publication number 20240339541
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Ching Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240339320
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET
- Publication number 20240332402
- Publication date Oct 3, 2024
- Hua Hong Semiconductor (Wuxi) Limited
- Zhaozhao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...
- Publication number 20240318320
- Publication date Sep 26, 2024
- Infineon Technologies Austria AG
- Saurabh Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...
- Publication number 20240318077
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyuyoung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITION FOR TITANIUM-CONTAINING LAYER, ETCHING METHOD O...
- Publication number 20240318078
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Byungjoon KANG
- H01 - BASIC ELECTRIC ELEMENTS

by liquid etching only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Silicon etching solution and method for producing silicon device us...

Semiconductor device and method for fabricating the same

Semiconductor structure having two N-type devices and two P-type de...

Semiconductor device and method of manufacture

Semiconductor wafer treatment liquid and production method thereof

Wet etch apparatus

Manufacturing method of semiconductor structure

Chemical solution, etching method, and method for manufacturing sem...

Hard mask removal without damaging top epitaxial layer

Chemical solution, method for manufacturing chemical solution, and...

Three-dimensional memory device with doped semiconductor bridge str...

Memory arrays comprising strings of memory cells and methods used i...

Substrate processing device and etching liquid

Treatment liquid for semiconductor wafers

Method for forming and patterning a layer and/or substrate

Nested and non-nested SEI messages in video bitstreams

Wet etching method

Semiconductor device forming method and substrate processing apparatus

Methods to prevent surface charge induced cd-dependent etching of m...

Different via configurations for different via interface requirements

Treatment liquid and method for treating object to be treated

Method (and related apparatus) for forming a resistor over a semico...

Selective etchant compositions and methods

Co/Cu selective wet etchant

Integrated structures and methods of forming vertically-stacked mem...

Processing systems and platforms for roughness reduction of materia...

Etching compositions

Wet etch process and method to provide uniform etching of material...

Methods for forming semiconductor structures

Patents Applicationslast 30 patents

ETCHING COMPOSITIONS

WET PROCESSING WITH AUTOMATIC PROCESS CONTROL

NESTED AND NON-NESTED SEI MESSAGES IN VIDEO BITSTREAMS

SEMICONDUCTOR PROCESSING SOLUTION

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

METHOD FOR FORMING PATTERNS ON A SUBSTRATE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...

ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...

SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES

COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...

MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME

Semiconductor Device and Method

WET ETCH APPARATUS

TRENCH ISOLATION WITH CONDUCTIVE STRUCTURES

BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

SEMICONDUCTOR DEVICES

METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME

CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE

TiN ETCHANT COMPOSITION AND METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ACTIVE REGION PROFILE AND METHOD OF FORMING TH...

CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME

METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND...

ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...

ETCHING COMPOSITION FOR TITANIUM-CONTAINING LAYER, ETCHING METHOD O...