by local deposition

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H01L2224/02317

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/02317by local deposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect
- Patent number 11,817,404
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 11,532,577
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers on partial encapsul...
- Patent number 11,424,180
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution line
- Patent number 11,373,970
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polarization defined zero misalignment vias for semiconductor packa...
- Patent number 11,264,239
- Issue date Mar 1, 2022
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,588
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,587
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect
- Patent number 11,114,395
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask assembly and method for fabricating a chip package
- Patent number 11,107,680
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas shower head with plural hole patterns and with corresponding di...
- Patent number 11,041,242
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Hui Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 10,741,511
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers on partial encapsul...
- Patent number 10,672,699
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a composite barrier layer
- Patent number 10,665,556
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and fabrication method therefor
- Patent number 10,541,218
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation apparatus for forming semiconductor structure having...
- Patent number 10,526,703
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Hui Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 10,529,673
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polarization defined zero misalignment vias for semiconductor packa...
- Patent number 10,453,812
- Issue date Oct 22, 2019
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect and fabrication method therefor
- Patent number 10,453,811
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 10,366,960
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Company
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package and manufacturing method thereof
- Patent number 10,249,585
- Issue date Apr 2, 2019
- Powertech Technology Inc.
- Yun-Hsin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers on partial encapsul...
- Patent number 10,199,322
- Issue date Feb 5, 2019
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, redistribution circuit structure, and m...
- Patent number 10,163,832
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor devices
- Patent number 10,153,240
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,128,223
- Issue date Nov 13, 2018
- TOSHIBA MEMORY CORPORATION
- Kazushige Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process of electronic component
- Patent number 10,083,925
- Issue date Sep 25, 2018
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Qin-Jia Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly with facing active surfaces of first...
- Patent number 10,032,756
- Issue date Jul 24, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,929,120
- Issue date Mar 27, 2018
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package including the same, and m...
- Patent number 9,911,688
- Issue date Mar 6, 2018
- Samsung Electronics Co., Ltd.
- Kyo-Seon Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230238305
- Publication date Jul 27, 2023
- XINTEC INC.
- Ching-Ting PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20230057803
- Publication date Feb 23, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20220302060
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CHIP PACKAGE
- Publication number 20210391168
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20200365504
- Publication date Nov 19, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS INCLUDING REDISTRIBUTION LAYER
- Publication number 20200328168
- Publication date Oct 15, 2020
- Samsung Electronics Co., Ltd.
- Junghyun Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200312791
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20200152589
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200144202
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SHOWER HEAD AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20200141004
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HUI HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLARIZATION DEFINED ZERO MISALIGNMENT VIAS FOR SEMICONDUCTOR PACKA...
- Publication number 20190363059
- Publication date Nov 28, 2019
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION APPARATUS AND METHOD FOR FORMING SEMICONDUCTOR STRUC...
- Publication number 20190284695
- Publication date Sep 19, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HUI HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLARIZATION DEFINED ZERO MISALIGNMENT VIAS FOR SEMICONDUCTOR PACKA...
- Publication number 20190198467
- Publication date Jun 27, 2019
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE
- Publication number 20190067001
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20180350756
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20180151525
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION INTERCONNECT AND FABRICATION METHOD THEREFOR
- Publication number 20180151520
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20180138117
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS OF ELECTRONIC COMPONENT
- Publication number 20180122756
- Publication date May 3, 2018
- Delta Electronics Int'l (Singapore) Pte Ltd
- Qin-Jia CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20180096970
- Publication date Apr 5, 2018
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180068963
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package and Methods of Forming Thereof
- Publication number 20180033747
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170317041
- Publication date Nov 2, 2017
- Powertech Technology Inc.
- Yun-Hsin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20170062321
- Publication date Mar 2, 2017
- Samsung Electronics Co., Ltd.
- Kyo-Seon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20170040269
- Publication date Feb 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20170033065
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20170029272
- Publication date Feb 2, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- PENG REN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170033078
- Publication date Feb 2, 2017
- Inotera Memories, Inc.
- Shih-Fan KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20160343695
- Publication date Nov 24, 2016
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS OF ELECTRONIC COMPONENT
- Publication number 20160240498
- Publication date Aug 18, 2016
- Delta Electronics Int'l (Singapore) Pte Ltd
- Qin-Jia CAI
- H01 - BASIC ELECTRIC ELEMENTS

by local deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming brass-coated metals in flip-chip redistribution l...

Method for fabricating a chip package

Post passivation interconnect

Fan-out package and methods of forming thereof

Semiconductor device with redistribution layers on partial encapsul...

Semiconductor device having a redistribution line

Polarization defined zero misalignment vias for semiconductor packa...

Packaged semiconductor devices, methods of packaging semiconductor...

Packaged semiconductor devices, methods of packaging semiconductor...

Post passivation interconnect

Mask assembly and method for fabricating a chip package

Gas shower head with plural hole patterns and with corresponding di...

Fan-out package and methods of forming thereof

Semiconductor device with redistribution layers on partial encapsul...

Semiconductor structure having a composite barrier layer

Redistribution layer structure and fabrication method therefor

Film formation apparatus for forming semiconductor structure having...

Packaged semiconductor devices, methods of packaging semiconductor...

Polarization defined zero misalignment vias for semiconductor packa...

Post passivation interconnect and fabrication method therefor

Fan-out package and methods of forming thereof

Stackable semiconductor package and manufacturing method thereof

Semiconductor device with redistribution layers on partial encapsul...

Integrated fan-out package, redistribution circuit structure, and m...

Method of packaging semiconductor devices

Semiconductor device and manufacturing method thereof

Packaging process of electronic component

Semiconductor package assembly with facing active surfaces of first...

Semiconductor device and its manufacturing method

Semiconductor chip, semiconductor package including the same, and m...

Patents Applicationslast 30 patents

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

METHOD FOR FABRICATING A CHIP PACKAGE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

SEMICONDUCTOR CHIPS INCLUDING REDISTRIBUTION LAYER

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

GAS SHOWER HEAD AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

POLARIZATION DEFINED ZERO MISALIGNMENT VIAS FOR SEMICONDUCTOR PACKA...

FILM FORMATION APPARATUS AND METHOD FOR FORMING SEMICONDUCTOR STRUC...

POLARIZATION DEFINED ZERO MISALIGNMENT VIAS FOR SEMICONDUCTOR PACKA...

MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

REDISTRIBUTION LAYER STRUCTURE AND FABRICATION METHOD THEREFOR

POST PASSIVATION INTERCONNECT AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

PACKAGING PROCESS OF ELECTRONIC COMPONENT

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Fan-Out Package and Methods of Forming Thereof

STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

Methods and Apparatus of Packaging Semiconductor Devices

Methods of Forming Connector Pad Structures, Interconnect Structure...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME

PACKAGING PROCESS OF ELECTRONIC COMPONENT