by making a conductive layer having a relief pattern, followed by abrading of the raised portions

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H05K3/045

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/045by making a conductive layer having a relief pattern, followed by abrading of the raised portions

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Patents Grantslast 30 patents

Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB-pinout based packaged module and method for preparing PCB-pinou...
- Patent number 11,641,072
- Issue date May 2, 2023
- Huawei Technologies Co., Ltd.
- Weijian Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method for wiring board
- Patent number 10,874,021
- Issue date Dec 22, 2020
- Disco Corporation
- Ye Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 10,827,622
- Issue date Nov 3, 2020
- Ajinomoto Co., Inc.
- Shigeo Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting component and electronic device
- Patent number 10,672,722
- Issue date Jun 2, 2020
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and method for manufacturing the same
- Patent number 10,631,406
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit patterning feature selective electroless
- Patent number 10,586,715
- Issue date Mar 10, 2020
- Intel Corporation
- Yonggang Yong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded high voltage transformer components and methods
- Patent number 10,522,279
- Issue date Dec 31, 2019
- Radial Electronics, Inc.
- James E. Quilici
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,424,541
- Issue date Sep 24, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 10,412,835
- Issue date Sep 10, 2019
- Qi Ding Technology Qinhuangdao Co., Ltd.
- Yu-Cheng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrayed embedded magnetic components and methods
- Patent number 10,347,409
- Issue date Jul 9, 2019
- Radial Electronics, Inc.
- James E. Quilici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip part and manufacturing method thereof
- Patent number 10,342,138
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Yasuhiro Kondo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrayed embedded magnetic components and methods
- Patent number 10,049,803
- Issue date Aug 14, 2018
- Radial Electronics, Inc.
- James E. Quilici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicular panel and wiring structure for vehicle
- Patent number 10,017,133
- Issue date Jul 10, 2018
- Yazaki Corporation
- Mitsunori Tsunoda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing a package substrate
- Patent number 9,992,873
- Issue date Jun 5, 2018
- Qi Ding Technology Qinhuangdao Co., Ltd.
- Yu-Cheng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a transparent substrate
- Patent number 9,775,236
- Issue date Sep 26, 2017
- LG Chem, Ltd.
- Sung-Hak Bae
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Embedded magnetic components and methods
- Patent number 9,754,712
- Issue date Sep 5, 2017
- Radial Electronics, Inc.
- James E. Quilici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device including a metal substrate for high heat dis...
- Patent number 9,728,697
- Issue date Aug 8, 2017
- SHARP KABUSHIKI KAISHA
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit patterning feature selective electroless copper pl...
- Patent number 9,646,854
- Issue date May 9, 2017
- Intel Corporation
- Yonggang Yong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit substrate
- Patent number 9,532,467
- Issue date Dec 27, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 9,510,464
- Issue date Nov 29, 2016
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a printed circuit board
- Patent number 9,491,866
- Issue date Nov 8, 2016
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating process of embedded circuit structure
- Patent number 9,307,651
- Issue date Apr 5, 2016
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an embedded printed circuit board
- Patent number 9,265,161
- Issue date Feb 16, 2016
- LG Innotek Co., Ltd
- Chi Hee Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards fabricated using congruent molds
- Patent number 9,247,649
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- Craig N. DeVarney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 9,237,643
- Issue date Jan 12, 2016
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Same layer microelectronic circuit patterning using hybrid laser pr...
- Patent number 9,113,547
- Issue date Aug 18, 2015
- Intel Corporation
- John Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 9,078,344
- Issue date Jul 7, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Don Mun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit carrier and the use of the method
- Patent number 8,927,899
- Issue date Jan 6, 2015
- Atotech Deutschland GmbH
- Hannes P. Hofmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
PCB-PINOUT BASED PACKAGED MODULE AND METHOD FOR PREPARING PCB-PINOU...
- Publication number 20210280998
- Publication date Sep 9, 2021
- Huawei Technologies Co., Ltd
- Weijian PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20210243896
- Publication date Aug 5, 2021
- TRANSLARITY, INC.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED HIGH VOLTAGE TRANSFORMER COMPONENTS AND METHODS
- Publication number 20190333674
- Publication date Oct 31, 2019
- RADIAL ELECTRONICS, INC
- James E. Quilici
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS
- Publication number 20190006077
- Publication date Jan 3, 2019
- RADIAL ELECTRONICS, INC
- James E. Quilici
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20180235085
- Publication date Aug 16, 2018
- Qi Ding Technology Qinhuangdao Co., Ltd.
- YU-CHENG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PART AND MANUFACTURING METHOD THEREOF
- Publication number 20180042118
- Publication date Feb 8, 2018
- Rohm Co., Ltd.
- Yasuhiro KONDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PATTERNING COMPOSITE MATERIALS AND FABRICAT...
- Publication number 20160219722
- Publication date Jul 28, 2016
- Michael A. TISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME
- Publication number 20160050761
- Publication date Feb 18, 2016
- Subtron Technology Co., Ltd.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUC...
- Publication number 20150156882
- Publication date Jun 4, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS FABRICATED USING CONGRUENT MOLDS
- Publication number 20140326483
- Publication date Nov 6, 2014
- International Business Machines Corporation
- Craig N. DeVarney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN PROTRUSION FORMING METHOD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20140295065
- Publication date Oct 2, 2014
- Fujitsu Limited
- Tomomi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICALLY DIFFUSE MICRO-CHANNEL
- Publication number 20140284084
- Publication date Sep 25, 2014
- RONALD Steven COK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FLATTENING SURFACE OF CONDUCTIVE STRUCTURE AND CONDUCTIVE...
- Publication number 20140238725
- Publication date Aug 28, 2014
- Industrial Technology Research Institute
- Erh-Hao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20140000953
- Publication date Jan 2, 2014
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME
- Publication number 20130192881
- Publication date Aug 1, 2013
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLURRY FOR COBALT APPLICATIONS
- Publication number 20130186850
- Publication date Jul 25, 2013
- APPLIED MATERIALS, INC.
- You Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130128472
- Publication date May 23, 2013
- SAMSUNG ELECTRO-MECHANICS
- Kyung Don MUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING T...
- Publication number 20130122216
- Publication date May 16, 2013
- Advanced Semiconductor Engineering, Inc.
- Shin-Luh TARNG
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20130105202
- Publication date May 2, 2013
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130068517
- Publication date Mar 21, 2013
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE...
- Publication number 20130068510
- Publication date Mar 21, 2013
- Samsung Techwin Co., Ltd.
- Soon Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20130032485
- Publication date Feb 7, 2013
- NGK SPARK PLUG CO., LTD.
- Masaki MURAMATSU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20120318770
- Publication date Dec 20, 2012
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Printed Circuit Board and Method of Manufacturing the Same
- Publication number 20120312591
- Publication date Dec 13, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sun Uk Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING METHOD FOR MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120308718
- Publication date Dec 6, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20120267157
- Publication date Oct 25, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Gwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120255769
- Publication date Oct 11, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Bum Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CREATING CONDUCTIVIZED TRACES FOR USE IN ELECTRONIC DEVICES
- Publication number 20120186080
- Publication date Jul 26, 2012
- S.D. Warren Company
- Wayne L. Bilodeau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING PROCESS OF EMBEDDED CIRCUIT STRUCTURE
- Publication number 20120168316
- Publication date Jul 5, 2012
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by making a conductive layer having a relief pattern, followed by abrading of the raised portions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Redistribution plate

PCB-pinout based packaged module and method for preparing PCB-pinou...

Redistribution plate

Manufacturing method for wiring board

Method for manufacturing wiring board

Mounting component and electronic device

Substrate structure and method for manufacturing the same

Embedded circuit patterning feature selective electroless

Embedded high voltage transformer components and methods

Component carrier and method for manufacturing the same

Package substrate

Arrayed embedded magnetic components and methods

Chip part and manufacturing method thereof

Arrayed embedded magnetic components and methods

Vehicular panel and wiring structure for vehicle

Method of manufacturing a package substrate

Method of manufacturing a transparent substrate

Embedded magnetic components and methods

Light emitting device including a metal substrate for high heat dis...

Embedded circuit patterning feature selective electroless copper pl...

Circuit substrate

Manufacturing method of circuit board

Method for manufacturing a printed circuit board

Fabricating process of embedded circuit structure

Method of manufacturing an embedded printed circuit board

Printed circuit boards fabricated using congruent molds

Circuit board structure

Same layer microelectronic circuit patterning using hybrid laser pr...

Printed circuit board and manufacturing method thereof

Method of manufacturing a circuit carrier and the use of the method

Patents Applicationslast 30 patents

REDISTRIBUTION PLATE

PCB-PINOUT BASED PACKAGED MODULE AND METHOD FOR PREPARING PCB-PINOU...

REDISTRIBUTION PLATE

EMBEDDED HIGH VOLTAGE TRANSFORMER COMPONENTS AND METHODS

ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS

PACKAGE SUBSTRATE

CHIP PART AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR PATTERNING COMPOSITE MATERIALS AND FABRICAT...

SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME

PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUC...

PRINTED CIRCUIT BOARDS FABRICATED USING CONGRUENT MOLDS

RESIN PROTRUSION FORMING METHOD AND WIRING BOARD MANUFACTURING METHOD

OPTICALLY DIFFUSE MICRO-CHANNEL

METHOD OF FLATTENING SURFACE OF CONDUCTIVE STRUCTURE AND CONDUCTIVE...

CIRCUIT SUBSTRATE

PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

SLURRY FOR COBALT APPLICATIONS

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING T...

CIRCUIT BOARD STRUCTURE

SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE...

METHOD OF FABRICATING CIRCUIT BOARD

MANUFACTURING METHOD OF CIRCUIT BOARD

Printed Circuit Board and Method of Manufacturing the Same

FABRICATING METHOD FOR MULTILAYER PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD

CREATING CONDUCTIVIZED TRACES FOR USE IN ELECTRONIC DEVICES

FABRICATING PROCESS OF EMBEDDED CIRCUIT STRUCTURE