by means of a bump or layer connector

Industry

CPC
H01L2224/80903

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80903by means of a bump or layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,580,758
- Issue date Mar 3, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,037,976
- Issue date Jul 31, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 9,793,244
- Issue date Oct 17, 2017
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a chip in a flexible substrate
- Patent number 9,179,586
- Issue date Nov 3, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor chip
- Patent number 4,955,132
- Issue date Sep 11, 1990
- Sharp Kabushiki Kaisha
- Kazuhito Ozawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20180005997
- Publication date Jan 4, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103536
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE
- Publication number 20130074331
- Publication date Mar 28, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS

by means of a bump or layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Scalable package architecture and associated techniques and configu...

Scalable package architecture and associated techniques and configu...

Scalable package architecture and associated techniques and configu...

Methods of manufacturing a semiconductor device

Component built-in board and method of manufacturing the same, and...

Method for assembling a chip in a flexible substrate

Chip package and a method for manufacturing a chip package

Method for mounting a semiconductor chip

Patents Applicationslast 30 patents

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE