by means of a further bonding area

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H01L2224/80902

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80902by means of a further bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having gaps within the conductive parts
- Patent number 10,090,351
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low-adhesive bond substrate pair
- Patent number 9,679,867
- Issue date Jun 13, 2017
- Kabushiki Kaisha Toshiba
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS