by means of a mounting structure

Industry

CPC
H05K3/301

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/301by means of a mounting structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and grounding assembly thereof
- Patent number 11,956,888
- Issue date Apr 9, 2024
- Delta Electronics, Inc.
- Chia-Hsien Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing components to substrate posts
- Patent number 11,950,375
- Issue date Apr 2, 2024
- X Display Company Technology Limited
- David Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket having solder balls
- Patent number 11,916,328
- Issue date Feb 27, 2024
- Tyco Electronics Japan G.K.
- Naoki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
- Patent number 11,864,327
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 11,856,710
- Issue date Dec 26, 2023
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Speed sensor assembly
- Patent number 11,796,556
- Issue date Oct 24, 2023
- Suzhou Littelfuse OVS Co., Ltd.
- Jiao Yu
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component mounting method
- Patent number 11,770,901
- Issue date Sep 26, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrical interconnects within electronic contact lenses
- Patent number 11,681,164
- Issue date Jun 20, 2023
- Tectus Corporation
- Babak Jamshidi
- G02 - OPTICS
Information Patent Grant
Printed circuit board assembly for edge-coupling to an integrated c...
- Patent number 11,678,433
- Issue date Jun 13, 2023
- D-Wave Systems Inc.
- Richard D. Neufeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with protruding thermally conductive tongue and c...
- Patent number 11,672,076
- Issue date Jun 6, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Naoto Yokoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,631,622
- Issue date Apr 18, 2023
- Fuji Electric Co., Ltd.
- Makoto Isozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DI metal transaction devices and processes for the manufacture thereof
- Patent number 11,618,191
- Issue date Apr 4, 2023
- Composecure, LLC
- Adam Lowe
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing components to substrate posts
- Patent number 11,528,808
- Issue date Dec 13, 2022
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for mounting electroacoustic component on PCB and electroaco...
- Patent number 11,523,512
- Issue date Dec 6, 2022
- Ariose Electronics Co., Ltd.
- Magnus Berggren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB structure and electronic device including the same
- Patent number 11,483,935
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Hwajoong Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and molded circuit board assembly and manufacturing m...
- Patent number 11,477,354
- Issue date Oct 18, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming an electronic device
- Patent number 11,432,448
- Issue date Aug 30, 2022
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component package with reinforced molded pins
- Patent number 11,432,407
- Issue date Aug 30, 2022
- XFMRS, Inc.
- Tung Kong Luk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection terminal unit
- Patent number 11,404,363
- Issue date Aug 2, 2022
- AISIN CORPORATION
- Yutaka Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting aid and method for mounting electrical components on a pri...
- Patent number 11,357,114
- Issue date Jun 7, 2022
- BorgWarner Ludwigsburg GmbH
- Sisay Tadele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, and resin film, metal foil with resin, metal cla...
- Patent number 11,345,784
- Issue date May 31, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kyosuke Michigami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic expansion valve (EEV) controller
- Patent number 11,300,342
- Issue date Apr 12, 2022
- Barry Lee Dusenbury
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Integrated circuit structure
- Patent number 11,291,116
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting bracket having electrical and thermal properties
- Patent number 11,272,641
- Issue date Mar 8, 2022
- Ford Global Technologies, LLC
- Stuart C. Salter
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Overmolded electronic components for transaction cards and methods...
- Patent number 11,267,172
- Issue date Mar 8, 2022
- Composecure, LLC
- Adam Lowe
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Component mounting method and component mounting apparatus
- Patent number 11,266,026
- Issue date Mar 1, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryota Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic components for transaction cards and methods...
- Patent number 11,247,371
- Issue date Feb 15, 2022
- Composecure, LLC
- Adam Lowe
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device including cable fixing apparatus
- Patent number 11,219,136
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Jung Min Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,206,737
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240074062
- Publication date Feb 29, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Hsin-Fa HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20240057264
- Publication date Feb 15, 2024
- Innolux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
- Publication number 20240044946
- Publication date Feb 8, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE FRAME DESIGN FOR THREE-DIMENSIONAL STACKED ELECTRONIC ASS...
- Publication number 20230420351
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Akash Agrawal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPACER ELEMENT FOR A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20230397358
- Publication date Dec 7, 2023
- BorgWarner Inc.
- Kai Homann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20230397341
- Publication date Dec 7, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20230389191
- Publication date Nov 30, 2023
- InnoLux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Device Power Module Arrangement
- Publication number 20230369256
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COIL COMPONENT
- Publication number 20230335331
- Publication date Oct 19, 2023
- Taiyo Yuden Co., Ltd.
- Hidenori AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230300993
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- JOOYOUNG KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...
- Publication number 20230292446
- Publication date Sep 14, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- LAN-TING CHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230240018
- Publication date Jul 27, 2023
- Innolux Corporation
- Wen-Hung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESILIENT PRINTED CIRCUIT BOARD RETENTION ARRANGEMENT
- Publication number 20230085331
- Publication date Mar 16, 2023
- Garrett Transportation I Inc.
- Valeriy Fedorikhin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230040128
- Publication date Feb 9, 2023
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230013032
- Publication date Jan 19, 2023
- Murata Manufacturing Co., Ltd.
- Minoru HATASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ITEM INVENTORY MANAGEMENT APPARATUS, AND A SYSTEM AND METHOD OF MAN...
- Publication number 20220374825
- Publication date Nov 24, 2022
- Henchman Group Pty Ltd
- Alisdair John Chambers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND GROUNDING ASSEMBLY THEREOF
- Publication number 20220248528
- Publication date Aug 4, 2022
- Delta Electronics, Inc.
- Chia-Hsien Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR POWER MODULES
- Publication number 20220240376
- Publication date Jul 28, 2022
- Transportation IP Holdings, LLC
- Alvaro Jorge Mari Curbelo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Component Carrier With Protruding Thermally Conductive Tongue and C...
- Publication number 20220030697
- Publication date Jan 27, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Naoto Yokoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20210391281
- Publication date Dec 16, 2021
- Intel Corporation
- ERIC J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLA...
- Publication number 20210363308
- Publication date Nov 25, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kyosuke MICHIGAMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SPEED SENSOR ASSEMBLY
- Publication number 20210356490
- Publication date Nov 18, 2021
- Hamlin Electronics (Suzhou) LTD.
- Jiao YU
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATION OF MICROINVERTER WITH PHOTOVOLTAIC MODULE
- Publication number 20210344301
- Publication date Nov 4, 2021
- Enphase Energy, Inc.
- Phil Gilchrist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20210289634
- Publication date Sep 16, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20210259114
- Publication date Aug 19, 2021
- X Display Company Technology Limited
- David Gomez
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20210251083
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Hwajoong JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20210202159
- Publication date Jul 1, 2021
- Taiyo Yuden Co., Ltd.
- Hidenori AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF
- Publication number 20210154898
- Publication date May 27, 2021
- COMPOSECURE, LLC
- Adam Lowe
- B22 - CASTING POWDER METALLURGY
Information Patent Application
OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS...
- Publication number 20210138705
- Publication date May 13, 2021
- COMPOSECURE, LLC
- Adam Lowe
- B22 - CASTING POWDER METALLURGY

by means of a mounting structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and grounding assembly thereof

Printing components to substrate posts

Socket having solder balls

Creating inductors, resistors, capacitors and other structures in p...

Method of manufacturing an electronic device

Speed sensor assembly

Electronic component mounting method

Electrical interconnects within electronic contact lenses

Printed circuit board assembly for edge-coupling to an integrated c...

Component carrier with protruding thermally conductive tongue and c...

Semiconductor device and semiconductor device manufacturing method

DI metal transaction devices and processes for the manufacture thereof

Ultra-thin embedded semiconductor device package and method of manu...

Printing components to substrate posts

Method for mounting electroacoustic component on PCB and electroaco...

PCB structure and electronic device including the same

Camera module and molded circuit board assembly and manufacturing m...

Method of forming an electronic device

Electrical component package with reinforced molded pins

Connection terminal unit

Mounting aid and method for mounting electrical components on a pri...

Resin composition, and resin film, metal foil with resin, metal cla...

Electronic expansion valve (EEV) controller

Integrated circuit structure

Mounting bracket having electrical and thermal properties

Overmolded electronic components for transaction cards and methods...

Component mounting method and component mounting apparatus

Overmolded electronic components for transaction cards and methods...

Electronic device including cable fixing apparatus

Composite electronic component and board having the same

Patents Applicationslast 30 patents

Electronic Device

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION

SUBSTRATE FRAME DESIGN FOR THREE-DIMENSIONAL STACKED ELECTRONIC ASS...

SPACER ELEMENT FOR A PRINTED CIRCUIT BOARD ASSEMBLY

ELECTRONIC COMPONENT MOUNTING METHOD

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

Multi-Device Power Module Arrangement

METHOD FOR MANUFACTURING COIL COMPONENT

CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...

ELECTRONIC DEVICE

RESILIENT PRINTED CIRCUIT BOARD RETENTION ARRANGEMENT

ELECTRICAL CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MODULE AND METHOD FOR MANUFACTURING SAME

ITEM INVENTORY MANAGEMENT APPARATUS, AND A SYSTEM AND METHOD OF MAN...

ELECTRONIC DEVICE AND GROUNDING ASSEMBLY THEREOF

SYSTEMS AND METHODS FOR POWER MODULES

Component Carrier With Protruding Thermally Conductive Tongue and C...

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLA...

SPEED SENSOR ASSEMBLY

INTEGRATION OF MICROINVERTER WITH PHOTOVOLTAIC MODULE

ELECTRONIC COMPONENT MOUNTING METHOD

PRINTING COMPONENTS TO SUBSTRATE POSTS

PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

COIL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC DEVICE

DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF

OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS...