by means of an encapsulation layer or foil

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H01L2224/80904

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80904by means of an encapsulation layer or foil

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 11,804,475
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection between component parts
- Patent number 11,694,977
- Issue date Jul 4, 2023
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 11,594,520
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 10,811,389
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,784,233
- Issue date Sep 22, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,734,356
- Issue date Aug 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,651,152
- Issue date May 12, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,593,646
- Issue date Mar 17, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,529,691
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate and method for manufacturing the same
- Patent number 10,475,765
- Issue date Nov 12, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip-type substrate for producing chip card modules
- Patent number 10,176,420
- Issue date Jan 8, 2019
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip arranging method
- Patent number 9,806,057
- Issue date Oct 31, 2017
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making an integrated circuit module with dual leadframes
- Patent number 9,029,194
- Issue date May 12, 2015
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method and semiconductor device
- Patent number 8,835,227
- Issue date Sep 16, 2014
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded encapsulated electronic component
- Patent number 5,773,322
- Issue date Jun 30, 1998
- Lucent Technologies Inc.
- John David Weld
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package for Thermal Dissipation
- Publication number 20230207531
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package for Thermal Dissipation
- Publication number 20210057387
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Between Component Parts
- Publication number 20210035934
- Publication date Feb 4, 2021
- OSRAM Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package for Thermal Dissipation
- Publication number 20190131280
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20150115458
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE WITH FOOTED LID
- Publication number 20150024535
- Publication date Jan 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES
- Publication number 20140242755
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME
- Publication number 20140191381
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE WITH FOOTED LID
- Publication number 20130126988
- Publication date May 23, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wei Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120306068
- Publication date Dec 6, 2012
- LAPIS Semiconductor Co., Ltd.
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS

by means of an encapsulation layer or foil

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package for thermal dissipation

Method for producing a connection between component parts

Semiconductor package for thermal dissipation

Semiconductor package for thermal dissipation

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Interposer substrate and method for manufacturing the same

Fully molded miniaturized semiconductor module

Strip-type substrate for producing chip card modules

Chip arranging method

Semiconductor device and method for manufacturing a semiconductor d...

Making an integrated circuit module with dual leadframes

Semiconductor device fabrication method and semiconductor device

Molded encapsulated electronic component

Patents Applicationslast 30 patents

Semiconductor Package for Thermal Dissipation

Semiconductor Package for Thermal Dissipation

Method for Producing a Connection Between Component Parts

Semiconductor Package for Thermal Dissipation

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

SEMICONDUCTOR SENSOR DEVICE WITH FOOTED LID

MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES

INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME

SEMICONDUCTOR SENSOR DEVICE WITH FOOTED LID

SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE