by means of an encapsulation layer or foil

Industry

CPC
H01L2224/83904

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83904by means of an encapsulation layer or foil

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package assembly including a semiconductor substrate in which a fir...
- Patent number 9,768,144
- Issue date Sep 19, 2017
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed semiconductor substrates and associated techniques
- Patent number 9,391,045
- Issue date Jul 12, 2016
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless flip-chip assembly with a complaint interposer contractor
- Patent number 7,911,057
- Issue date Mar 22, 2011
- NXP B.V.
- Wayne Nunn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES
- Publication number 20150279806
- Publication date Oct 1, 2015
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL
- Publication number 20140363924
- Publication date Dec 11, 2014
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20140124961
- Publication date May 8, 2014
- Marvell World Trade Ltd.
- Albert WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL
- Publication number 20120068361
- Publication date Mar 22, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20110186960
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES
- Publication number 20110186992
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20110186998
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumpless Flip-Chip Assembly With a Complaint Interposer Contractor
- Publication number 20080315389
- Publication date Dec 25, 2008
- NXP B.V.
- Wayne Nunn
- H01 - BASIC ELECTRIC ELEMENTS

by means of an encapsulation layer or foil

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package assembly including a semiconductor substrate in which a fir...

Recessed semiconductor substrates and associated techniques

Bumpless flip-chip assembly with a complaint interposer contractor

Patents Applicationslast 30 patents

RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES

RECESSED SEMICONDUCTOR SUBSTRATES

Bumpless Flip-Chip Assembly With a Complaint Interposer Contractor