by mechanical means

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H01L2224/83047

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83047by mechanical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing a semiconductor specimen for failure analysis
- Patent number 11,828,800
- Issue date Nov 28, 2023
- MSSCORPS CO., LTD.
- Chi-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,830,847
- Issue date Nov 28, 2023
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit film, display device, and method of fabricating pri...
- Patent number 11,737,215
- Issue date Aug 22, 2023
- Samsung Display Co., Ltd.
- Dong Hyun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,950,527
- Issue date Mar 16, 2021
- Renesas Electronics Corporation
- Shoji Hashizume
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,811,305
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing RF filters
- Patent number 10,636,776
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Md. Sayed Kaysar Bin Rahim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining a bonding surface for direct bonding
- Patent number 10,032,742
- Issue date Jul 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lamine Benaissa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a chip to a substrate
- Patent number 9,515,041
- Issue date Dec 6, 2016
- Oce-Technologies B.V.
- Norbert H. W. Lamers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a solder joint
- Patent number 9,041,224
- Issue date May 26, 2015
- Robert Bosch GmbH
- Daniel Michels
- B24 - GRINDING POLISHING
Information Patent Grant
Method for bonding semiconductor substrates and devices obtained th...
- Patent number 8,912,044
- Issue date Dec 16, 2014
- IMEC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,820,021
- Issue date Oct 26, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,531,385
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...
- Publication number 20240387501
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF INTEGRATED CIRCUIT WAFERS
- Publication number 20240170451
- Publication date May 23, 2024
- STMicroelectronics (Crolles 2) SAS
- Come De Buttet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogenous Integration Scheme for III-V/Si and Si CMOS Integrated...
- Publication number 20230154912
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing CO.,LTD.
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING A SEMICONDUCTOR SPECIMEN FOR FAILURE ANALYSIS
- Publication number 20220155367
- Publication date May 19, 2022
- MSSCORPS CO., LTD.
- CHI-LUN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220077106
- Publication date Mar 10, 2022
- KIOXIA Corporation
- Gen TOYOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190311974
- Publication date Oct 10, 2019
- RENESAS ELECTRONICS CORPORATION
- Shoji HASHIZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20180082888
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Li-Wen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE
- Publication number 20160204078
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR OBTAINING A BONDING SURFACE FOR DIRECT BONDING
- Publication number 20150364442
- Publication date Dec 17, 2015
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Lamine BENAISSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A CHIP TO A SUBSTRATE
- Publication number 20150062248
- Publication date Mar 5, 2015
- OCE-TECHNOLOGIES B.V.
- Norbert H. W. LAMERS
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR PRODUCING A SOLDER JOINT
- Publication number 20140231976
- Publication date Aug 21, 2014
- Daniel Michels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip mounting method and method for connecting substrates
- Publication number 20090126876
- Publication date May 21, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES
- Publication number 20090115071
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low warpage curing methodology by inducing curvature

Method of preparing a semiconductor specimen for failure analysis

Manufacturing method of semiconductor device and semiconductor device

Printed circuit film, display device, and method of fabricating pri...

Semiconductor device and method for manufacturing the same

Wafer level integration including design/co-design, structure proce...

Methods of manufacturing RF filters

Method of bonding semiconductor substrates

Method for obtaining a bonding surface for direct bonding

Method for bonding a chip to a substrate

Method for producing a solder joint

Method for bonding semiconductor substrates and devices obtained th...

Flip chip mounting method and method for connecting substrates

Flip chip mounting method and method for connecting substrates

Patents Applicationslast 30 patents

HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...

ASSEMBLY OF INTEGRATED CIRCUIT WAFERS

Heterogenous Integration Scheme for III-V/Si and Si CMOS Integrated...

METHOD OF PREPARING A SEMICONDUCTOR SPECIMEN FOR FAILURE ANALYSIS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE

METHOD FOR OBTAINING A BONDING SURFACE FOR DIRECT BONDING

METHOD FOR BONDING A CHIP TO A SUBSTRATE

METHOD FOR PRODUCING A SOLDER JOINT

METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...

Flip chip mounting method and method for connecting substrates

FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES