by mechanical means

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H01L2224/85047

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85047by mechanical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,468,376
- Issue date Nov 5, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of forming an electronic device including a ball bond
- Patent number 9,812,424
- Issue date Nov 7, 2017
- Semiconductor Components Industries, LLC
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire and electrode joining method and joint structure
- Patent number 9,793,238
- Issue date Oct 17, 2017
- Toyota Jidosha Kabushiki Kaisha
- Yoh Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and bonding method
- Patent number 9,337,166
- Issue date May 10, 2016
- Shinkawa Ltd.
- Yoshihito Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a bondable area region on a carrier
- Patent number 8,167,187
- Issue date May 1, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor package and method for processing and bonding a wire
- Patent number 8,053,906
- Issue date Nov 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loop and method of forming the wire loop
- Patent number 8,048,720
- Issue date Nov 1, 2011
- Kulicke and Soffa Industries, Inc.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wire bond inductor and method
- Patent number 7,227,240
- Issue date Jun 5, 2007
- Semiconductor Components Industries, LLC
- James Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 5,101,263
- Issue date Mar 31, 1992
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...
- Publication number 20240055388
- Publication date Feb 15, 2024
- SHINKAWA LTD.
- Kiyotaka TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND IMPEDANCE MATCHING
- Publication number 20220254750
- Publication date Aug 11, 2022
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20220199570
- Publication date Jun 23, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180269179
- Publication date Sep 20, 2018
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE AND ELECTRODE JOINING METHOD AND JOINT STRUCTURE
- Publication number 20170179075
- Publication date Jun 22, 2017
- Toyota Jidosha Kabushiki Kaisha
- Yoh SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME
- Publication number 20170179074
- Publication date Jun 22, 2017
- Semiconductor Components Industries, LLC
- Harold G. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Wire Connection
- Publication number 20170133342
- Publication date May 11, 2017
- NXP B.V.
- Wiwat Tanwongwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20160163673
- Publication date Jun 9, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20140138426
- Publication date May 22, 2014
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
- Publication number 20100230809
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE
- Publication number 20100007009
- Publication date Jan 14, 2010
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT D...
- Publication number 20080293235
- Publication date Nov 27, 2008
- Harris Corporation
- Hector Deju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL
- Publication number 20080185737
- Publication date Aug 7, 2008
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for producing a bondable area region on a carrier
- Publication number 20060261133
- Publication date Nov 23, 2006
- eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor device with wire bond inductor and method
- Publication number 20050285262
- Publication date Dec 29, 2005
- James Knapp
- H01 - BASIC ELECTRIC ELEMENTS

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming wire interconnect structures and related wire bo...

Semiconductor device and method for manufacturing the same

Method for manufacturing wire bonding structure, wire bonding struc...

Process of forming an electronic device including a ball bond

Copper wire and electrode joining method and joint structure

Wire bonding apparatus and bonding method

Method and device for producing a bondable area region on a carrier

Semiconductor package and method for processing and bonding a wire

Wire loop and method of forming the wire loop

Semiconductor device with wire bond inductor and method

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...

BALL BOND IMPEDANCE MATCHING

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

COPPER WIRE AND ELECTRODE JOINING METHOD AND JOINT STRUCTURE

ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME

Bond Wire Connection

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

WIRE BONDING APPARATUS AND BONDING METHOD

WIRE BONDING APPARATUS AND BONDING METHOD

WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP

SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE

COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT D...

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Method and device for producing a bondable area region on a carrier

Semiconductor device with wire bond inductor and method