by mechanical means

Industry

CPC
H01L2224/82947

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82947by mechanical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices having conductive plu...
- Patent number 10,304,818
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame, and method for manufac...
- Patent number 9,847,235
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 9,795,033
- Issue date Oct 17, 2017
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional structure for wiring formation
- Patent number 9,082,438
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional structure in which wiring is provided on its surface
- Patent number 9,070,393
- Issue date Jun 30, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 8,901,728
- Issue date Dec 2, 2014
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic package with stacked microelectronic elements and m...
- Patent number 8,786,070
- Issue date Jul 22, 2014
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 8,759,148
- Issue date Jun 24, 2014
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic package with stacked microelectronic elements and m...
- Patent number 8,487,421
- Issue date Jul 16, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 8,482,137
- Issue date Jul 9, 2013
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230068263
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20220208749
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190279974
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20160260682
- Publication date Sep 8, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION
- Publication number 20140182887
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140097004
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140090876
- Publication date Apr 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...
- Publication number 20130300000
- Publication date Nov 14, 2013
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20130200522
- Publication date Aug 8, 2013
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...
- Publication number 20130032944
- Publication date Feb 7, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20110281138
- Publication date Nov 17, 2011
- Panasonic Electric Works Co., Ltd.
- Shingo Yoshioka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method of forming the same

Semiconductor device with plated lead frame

Method of manufacturing semiconductor devices having conductive plu...

Semiconductor device with plated lead frame, and method for manufac...

Method of mounting semiconductor chips, semiconductor device obtain...

Three-dimensional structure for wiring formation

Three-dimensional structure in which wiring is provided on its surface

Method of mounting semiconductor chips, semiconductor device obtain...

Microelectronic package with stacked microelectronic elements and m...

Method of mounting semiconductor chips, semiconductor device obtain...

Microelectronic package with stacked microelectronic elements and m...

Method of mounting semiconductor chips, semiconductor device obtain...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

Semiconductor Devices and Methods of Manufacture Thereof

Semiconductor Device with Plated Lead Frame

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE

THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...