by mechanical means

Industry

CPC
H01L2224/83947

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83947by mechanical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,742,319
- Issue date Aug 29, 2023
- Innolux Corporation
- Yi-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS
Information Patent Grant
Laminated element manufacturing method
- Patent number 11,158,601
- Issue date Oct 26, 2021
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,923,465
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,354,985
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,202,519
- Issue date Feb 12, 2019
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,066,118
- Issue date Sep 4, 2018
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,698,072
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,373,559
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20230373018
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20210313297
- Publication date Oct 7, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Taketo KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED ELEMENT MANUFACTURING METHOD
- Publication number 20200176415
- Publication date Jun 4, 2020
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20190273075
- Publication date Sep 5, 2019
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20170365591
- Publication date Dec 21, 2017
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20170233615
- Publication date Aug 17, 2017
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing electronic device

Method for manufacturing electronic device

Laminated element manufacturing method

Inkjet adhesive, manufacturing method for semiconductor device, and...

Semiconductor device having stacked semiconductor chips and method...

Semiconductor device having stacked semiconductor chips and method...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Low-stress dual underfill packaging

Low-stress dual underfill packaging

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

LAMINATED ELEMENT MANUFACTURING METHOD

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...