by mechanical means

Industry

CPC
H01L2224/82047

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82047by mechanical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 11,676,944
- Issue date Jun 13, 2023
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 11,133,242
- Issue date Sep 28, 2021
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 11,024,607
- Issue date Jun 1, 2021
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 10,818,578
- Issue date Oct 27, 2020
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming substrate including embe...
- Patent number 10,665,662
- Issue date May 26, 2020
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 10,643,975
- Issue date May 5, 2020
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio die package with backside conductive plate
- Patent number 10,453,804
- Issue date Oct 22, 2019
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,418,319
- Issue date Sep 17, 2019
- Infineon Technologies AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient heat removal from component carrier with embedded diode
- Patent number 10,332,818
- Issue date Jun 25, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Backside drill embedded die substrate
- Patent number 10,325,855
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming substrate including embe...
- Patent number 10,236,337
- Issue date Mar 19, 2019
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package with stacked microelectronic units and meth...
- Patent number 9,876,002
- Issue date Jan 23, 2018
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming substrate including embe...
- Patent number 9,837,484
- Issue date Dec 5, 2017
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of laminate MEMS in BBUL coreless package
- Patent number 9,708,178
- Issue date Jul 18, 2017
- Intel Corporation
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic packages and methods of making and using the same
- Patent number 9,666,516
- Issue date May 30, 2017
- General Electric Company
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and chip assembly
- Patent number 9,530,754
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,391,027
- Issue date Jul 12, 2016
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,385,094
- Issue date Jul 5, 2016
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic multilayer substrate and method for producing the same
- Patent number 9,370,111
- Issue date Jun 14, 2016
- Murata Manufacturing Co., Ltd.
- Yoshiko Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile surface mount package with isolated tab
- Patent number 9,337,163
- Issue date May 10, 2016
- General Electric Company
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging using reconstituted wafers
- Patent number 9,293,393
- Issue date Mar 22, 2016
- Broadcom Corporation
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making an embedded wafer level b...
- Patent number 9,269,691
- Issue date Feb 23, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,209,151
- Issue date Dec 8, 2015
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked type power device module
- Patent number 9,142,473
- Issue date Sep 22, 2015
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,981,573
- Issue date Mar 17, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS electronic article surveillance, RF and/or RF identification ta...
- Patent number 8,960,558
- Issue date Feb 24, 2015
- Thin Film Electronics ASA
- J. Devin MacKenzie
- G08 - SIGNALLING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20210013134
- Publication date Jan 14, 2021
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20200212013
- Publication date Jul 2, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES
- Publication number 20180145055
- Publication date May 24, 2018
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Substrate Including Embe...
- Publication number 20180053819
- Publication date Feb 22, 2018
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
- Publication number 20140367848
- Publication date Dec 18, 2014
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140312539
- Publication date Oct 23, 2014
- Yoshiko OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF LAMINATE MEMS IN BBUL CORELESS PACKAGE
- Publication number 20140203379
- Publication date Jul 24, 2014
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED TYPE POWER DEVICE MODULE
- Publication number 20140159212
- Publication date Jun 12, 2014
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20140151900
- Publication date Jun 5, 2014
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB
- Publication number 20140133104
- Publication date May 15, 2014
- GENERAL ELECTRIC COMPANY
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20140110866
- Publication date Apr 24, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20140042639
- Publication date Feb 13, 2014
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140024177
- Publication date Jan 23, 2014
- NEC Corporation
- KENTARO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20130341780
- Publication date Dec 26, 2013
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20130334707
- Publication date Dec 19, 2013
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...
- Publication number 20130328213
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20130286615
- Publication date Oct 31, 2013
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130252382
- Publication date Sep 26, 2013
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Methods of Formation Thereof
- Publication number 20130241077
- Publication date Sep 19, 2013
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...
- Publication number 20130181356
- Publication date Jul 18, 2013
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Packaging Using Reconstituted Wafers
- Publication number 20130154106
- Publication date Jun 20, 2013
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Package with Embedded Die and Manufacturing Methods T...
- Publication number 20120235309
- Publication date Sep 20, 2012
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Kay Stephan Essig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING TWO MOUNTING SURFACES
- Publication number 20120178216
- Publication date Jul 12, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20120108053
- Publication date May 3, 2012
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20120018857
- Publication date Jan 26, 2012
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20120006469
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD
- Publication number 20120009733
- Publication date Jan 12, 2012
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing printed circuit board including electronic...
- Publication number 20110314667
- Publication date Dec 29, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jin Baek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for interconnecting stacked semiconductor devices

Method for interconnecting stacked semiconductor devices

Method of manufacturing semiconductor devices, corresponding device...

Method for interconnecting stacked semiconductor devices

Systems and methods for flash stacking

Method of manufacturing semiconductor devices, corresponding device...

Electronics package having a multi-thickness conductor layer and me...

Semiconductor device and method of forming substrate including embe...

Method for interconnecting stacked semiconductor devices

Radio die package with backside conductive plate

Method of manufacturing a semiconductor device

Efficient heat removal from component carrier with embedded diode

Backside drill embedded die substrate

Semiconductor device and method of forming substrate including embe...

Microelectronic package with stacked microelectronic units and meth...

Semiconductor device and method of forming substrate including embe...

Apparatus, system, and method for wireless connection in integrated...

Integration of laminate MEMS in BBUL coreless package

Electronic packages and methods of making and using the same

Chip package and chip assembly

Embedded semiconductor device package and method of manufacturing t...

Apparatus, system, and method for wireless connection in integrated...

Ceramic multilayer substrate and method for producing the same

Low profile surface mount package with isolated tab

Stacked packaging using reconstituted wafers

Semiconductor device and method of making an embedded wafer level b...

Embedded semiconductor device package and method of manufacturing t...

Stacked type power device module

Apparatus, system, and method for wireless connection in integrated...

MOS electronic article surveillance, RF and/or RF identification ta...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR FLASH STACKING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

SYSTEMS AND METHODS FOR FLASH STACKING

METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES

Semiconductor Device and Method of Forming Substrate Including Embe...

Semiconductor Device and Method of Making an Embedded Wafer Level B...

CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME

INTEGRATION OF LAMINATE MEMS IN BBUL CORELESS PACKAGE

STACKED TYPE POWER DEVICE MODULE

STACKED PACKAGING USING RECONSTITUTED WAFERS

LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor Package and Methods of Formation Thereof

MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...

Stacked Packaging Using Reconstituted Wafers

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

Semiconductor Package with Embedded Die and Manufacturing Methods T...

DEVICE INCLUDING TWO MOUNTING SURFACES

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD

Method of manufacturing printed circuit board including electronic...