by modifying or reforming the material inside the workpiece

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CPC
B23K26/0057

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BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K26/00Working by laser beam

Current Industry

B23K26/0057by modifying or reforming the material inside the workpiece

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate dividing method
- Patent number 10,622,255
- Issue date Apr 14, 2020
- Hamamatsu Photonics K.K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser cutting transparent and semitranspar...
- Patent number 10,179,374
- Issue date Jan 15, 2019
- Newport Corporation
- James Bovatsek
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical plate, light irradiation device, light measurement device,...
- Patent number 10,180,525
- Issue date Jan 15, 2019
- Hamamatsu Photonics K.K.
- Satoshi Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for rapid laser drilling of holes in glass and products made...
- Patent number 10,144,093
- Issue date Dec 4, 2018
- Corning Incorporated
- Sasha Marjanovic
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined production method for separating a number of thin layers o...
- Patent number 10,141,219
- Issue date Nov 27, 2018
- Siltectra GmbH
- Wolfram Drescher
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laser machining device and laser machining method
- Patent number 10,124,439
- Issue date Nov 13, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device and laser machining method
- Patent number 10,124,440
- Issue date Nov 13, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC wafer producing method
- Patent number 10,112,256
- Issue date Oct 30, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC substrate separating method
- Patent number 10,105,792
- Issue date Oct 23, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical device wafer processing method
- Patent number 10,109,527
- Issue date Oct 23, 2018
- Disco Corporation
- Ryugo Oba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method of single-crystal substrate
- Patent number 10,103,061
- Issue date Oct 16, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,094,047
- Issue date Oct 9, 2018
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for separating substrates and semiconductor chip
- Patent number 10,090,198
- Issue date Oct 2, 2018
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,081,076
- Issue date Sep 25, 2018
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Combined method for producing solids, involving laser treatment and...
- Patent number 10,079,171
- Issue date Sep 18, 2018
- Siltectra, GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,076,804
- Issue date Sep 18, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of laser processing for substrate cleaving or dicing through...
- Patent number 10,074,565
- Issue date Sep 11, 2018
- EVANA TECHNOLOGIES, UAB
- Egidijus Vanagas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate dividing method
- Patent number 10,068,801
- Issue date Sep 4, 2018
- Hamamatsu Photonics K.K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for processing materials, including shape memor...
- Patent number 10,047,421
- Issue date Aug 14, 2018
- SMARTER ALLOYS INC.
- Mohammad Ibrahem Khan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compensation of fiber lensing effect during grating fabrication in...
- Patent number 10,036,849
- Issue date Jul 31, 2018
- OFS Fitel, LLC
- Paul S Westbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for performing laser curved filamentation with...
- Patent number 10,010,971
- Issue date Jul 3, 2018
- ROFIN-SINAR TECHNOLOGIES LLC
- S. Abbas Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet for laser dicing and method for manufacturing semico...
- Patent number 10,008,406
- Issue date Jun 26, 2018
- Denka Company Limited
- Gosuke Nakajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for spiral cutting a glass tube using filament...
- Patent number 10,005,152
- Issue date Jun 26, 2018
- ROFIN-SINAR TECHNOLOGIES LLC
- S. Abbas Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 10,002,808
- Issue date Jun 19, 2018
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 9,981,339
- Issue date May 29, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus
- Patent number 9,981,343
- Issue date May 29, 2018
- Disco Corporation
- Taiki Sawabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a bird protection device and bird protection d...
- Patent number 9,974,298
- Issue date May 22, 2018
- BORAIDENT GMBH
- Hans-Joachim Arnold
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing SiC wafer
- Patent number 9,975,202
- Issue date May 22, 2018
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of separating chips from a wafer
- Patent number 9,978,643
- Issue date May 22, 2018
- Frank Kriebel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sub-surface marking of product housings
- Patent number 9,962,788
- Issue date May 8, 2018
- Apple Inc.
- Matthew S. Scott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE SINGULATION SYSTEMS AND METHODS
- Publication number 20190363020
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING P...
- Publication number 20190279902
- Publication date Sep 12, 2019
- Applied Materials, Inc.
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER CUTTING STRENGTHENED GLASS
- Publication number 20190039940
- Publication date Feb 7, 2019
- Guardian Glass, LLC
- Barry B. CORDEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING APPARATUS
- Publication number 20180354067
- Publication date Dec 13, 2018
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiC WAFER PRODUCING METHOD
- Publication number 20180308679
- Publication date Oct 25, 2018
- Disco Corporation
- Kazuya Hirata
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR LASER-ASSITED SEPARATION OF A PORTION FROM A SHEET-LIKE...
- Publication number 20180297887
- Publication date Oct 18, 2018
- SCHOTT AG
- Martin SPIER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20180294189
- Publication date Oct 11, 2018
- Hamamatsu Photonics K.K.
- Takafumi OGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLITTING OF A SOLID USING CONVERSION OF MATERIAL
- Publication number 20180290232
- Publication date Oct 11, 2018
- SILTECTRA GMBH
- Jan Richter
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LASER PROCESSING METHOD, AND LASER PROCESSING DEVICE
- Publication number 20180281116
- Publication date Oct 4, 2018
- Hamamatsu Photonics K.K.
- Takafumi OGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD, AND LASER PROCESSING DEVICE
- Publication number 20180272465
- Publication date Sep 27, 2018
- Hamamatsu Photonics K.K.
- Takafumi OGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEMTOSECOND LASER-INDUCED FORMATION OF SINGLE CRYSTAL PATTERNED SEM...
- Publication number 20180277366
- Publication date Sep 27, 2018
- The Regents of the University of Michigan
- Michael J. ABERE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20180277456
- Publication date Sep 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20180257171
- Publication date Sep 13, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED SEPARATION OF LASER PROCESSED BRITTLE MATERIAL
- Publication number 20180257170
- Publication date Sep 13, 2018
- COHERENT LASERSYSTEMS GMBH & CO. KG
- Ludger Müllers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING OPTICAL LENS WITH FROSTED INTERFACE
- Publication number 20180259686
- Publication date Sep 13, 2018
- GENIE PRECISION MACHINING CO., LTD.
- YU SHENG CHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE MATERIAL-SAVING PRODUCTION OF WAFERS AND PROCESSING...
- Publication number 20180243944
- Publication date Aug 30, 2018
- SILTECTRA GMBH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MACHINING OBJECT CUTTING METHOD AND MACHINING OBJECT CUTTING DEVICE
- Publication number 20180236597
- Publication date Aug 23, 2018
- Hamamatsu Photonics K.K.
- Junji OKUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20180237947
- Publication date Aug 23, 2018
- Disco Corporation
- Kazuya Hirata
- B24 - GRINDING POLISHING
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20180236608
- Publication date Aug 23, 2018
- Hamamatsu Photonics K.K.
- Junji OKUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiC WAFER PRODUCING METHOD
- Publication number 20180229331
- Publication date Aug 16, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES U...
- Publication number 20180221988
- Publication date Aug 9, 2018
- Corning Incorporated
- Anping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20180214976
- Publication date Aug 2, 2018
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20180200830
- Publication date Jul 19, 2018
- Disco Corporation
- Yoshiaki Yodo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED MACHINING METHOD AND COMPUTER READABLE MEDIUM
- Publication number 20180193945
- Publication date Jul 12, 2018
- FANUC CORPORATION
- Atsushi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING A THIN GLASS LAYER
- Publication number 20180186678
- Publication date Jul 5, 2018
- SAINT-GOBAIN GLASS FRANCE
- Juergen BOEKER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20180185957
- Publication date Jul 5, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PERFORMING LASER CURVED FILAMENTATION WITH...
- Publication number 20180161916
- Publication date Jun 14, 2018
- ROFIN-SINAR TECHNOLOGIES INC.
- S. ABBAS HOSSEINI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20180151370
- Publication date May 31, 2018
- Disco Corporation
- Taewoo Bae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLITTING OF A SOLID USING CONVERSION OF MATERIAL
- Publication number 20180133834
- Publication date May 17, 2018
- SILTECTRA GMBH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR SEPARATION OF GLASS PORTIONS OR GLASS CERAMIC...
- Publication number 20180134604
- Publication date May 17, 2018
- SCHOTT AG
- Andreas ORTNER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by modifying or reforming the material inside the workpiece

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate dividing method

Method and apparatus for laser cutting transparent and semitranspar...

Optical plate, light irradiation device, light measurement device,...

Method for rapid laser drilling of holes in glass and products made...

Combined production method for separating a number of thin layers o...

Laser machining device and laser machining method

Laser machining device and laser machining method

SiC wafer producing method

SiC substrate separating method

Optical device wafer processing method

Processing method of single-crystal substrate

Wafer producing method

Method for separating substrates and semiconductor chip

Wafer producing method

Combined method for producing solids, involving laser treatment and...

Wafer producing method

Method of laser processing for substrate cleaving or dicing through...

Substrate dividing method

Methods and systems for processing materials, including shape memor...

Compensation of fiber lensing effect during grating fabrication in...

Method and apparatus for performing laser curved filamentation with...

Adhesive sheet for laser dicing and method for manufacturing semico...

Method and apparatus for spiral cutting a glass tube using filament...

Semiconductor device manufacturing method and semiconductor device

Wafer producing method

Laser processing apparatus

Method for producing a bird protection device and bird protection d...

Method of producing SiC wafer

Method of separating chips from a wafer

Sub-surface marking of product housings

Patents Applicationslast 30 patents

DIE SINGULATION SYSTEMS AND METHODS

HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING P...

LASER CUTTING STRENGTHENED GLASS

WAFER PRODUCING APPARATUS

SiC WAFER PRODUCING METHOD

METHOD FOR LASER-ASSITED SEPARATION OF A PORTION FROM A SHEET-LIKE...

LASER PROCESSING METHOD

SPLITTING OF A SOLID USING CONVERSION OF MATERIAL

LASER PROCESSING METHOD, AND LASER PROCESSING DEVICE

LASER PROCESSING METHOD, AND LASER PROCESSING DEVICE

FEMTOSECOND LASER-INDUCED FORMATION OF SINGLE CRYSTAL PATTERNED SEM...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

LASER PROCESSING APPARATUS

CONTROLLED SEPARATION OF LASER PROCESSED BRITTLE MATERIAL

METHOD FOR MANUFACTURING OPTICAL LENS WITH FROSTED INTERFACE

METHOD FOR THE MATERIAL-SAVING PRODUCTION OF WAFERS AND PROCESSING...

MACHINING OBJECT CUTTING METHOD AND MACHINING OBJECT CUTTING DEVICE

WAFER PRODUCING METHOD

LASER MACHINING DEVICE AND LASER MACHINING METHOD

SiC WAFER PRODUCING METHOD

APPARATUS AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES U...

LASER PROCESSING APPARATUS

METHOD OF PROCESSING WORKPIECE

COMBINED MACHINING METHOD AND COMPUTER READABLE MEDIUM

METHOD FOR CUTTING A THIN GLASS LAYER

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

METHOD AND APPARATUS FOR PERFORMING LASER CURVED FILAMENTATION WITH...

WAFER PROCESSING METHOD

SPLITTING OF A SOLID USING CONVERSION OF MATERIAL

METHOD AND DEVICE FOR SEPARATION OF GLASS PORTIONS OR GLASS CERAMIC...