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H01L2224/03612

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03612by physical means only

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bowl shaped pad
- Patent number 11,694,976
- Issue date Jul 4, 2023
- Intel Corporation
- Yuhong Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for preparing the same
- Patent number 10,923,455
- Issue date Feb 16, 2021
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor apparatus
- Patent number 10,825,794
- Issue date Nov 3, 2020
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 10,665,565
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional chip stack and method of forming the same
- Patent number 10,276,532
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 10,192,848
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bond pad with cobalt interconnect layer and solder thereon
- Patent number 9,960,135
- Issue date May 1, 2018
- Texas Instruments Incorporated
- Helmut Rinck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package assembly
- Patent number 9,780,064
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip stack and method of forming the same
- Patent number 9,698,115
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging structure and method for forming the same
- Patent number 9,620,468
- Issue date Apr 11, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,595,469
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip stack and method of forming the same
- Patent number 9,355,980
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chips having improved solidity, semiconductor package...
- Patent number 9,324,686
- Issue date Apr 26, 2016
- SK hynix Inc.
- Jong Hyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 9,293,338
- Issue date Mar 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and method of forming the same
- Patent number 9,059,109
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnet assisted alignment method for wafer bonding and wafer level...
- Patent number 9,012,265
- Issue date Apr 21, 2015
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
- Publication number 20230307462
- Publication date Sep 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Yong Hoon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOWL SHAPED PAD
- Publication number 20200118954
- Publication date Apr 16, 2020
- Intel Corporation
- Yuhong CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
- Publication number 20180218993
- Publication date Aug 2, 2018
- TEXAS INSTRUMENTS INCORPORATED
- HELMUT RINCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Chip Stack and Method of Forming the Same
- Publication number 20170301641
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
- Publication number 20160284656
- Publication date Sep 29, 2016
- Texas Instruments Deutschland GmbH
- HELMUT RINCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD
- Publication number 20140124914
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20140124928
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...
- Publication number 20140015115
- Publication date Jan 16, 2014
- SK HYNIX INC.
- Jong Hyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...
- Publication number 20130252375
- Publication date Sep 26, 2013
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20130187269
- Publication date Jul 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Stair Arrangement Bump Structures
- Publication number 20110057307
- Publication date Mar 10, 2011
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS

by physical means only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures of integrated circuit devices and method forming...

Bonding structures of integrated circuit devices and method forming...

Bowl shaped pad

Semiconductor device including bonding pads and method of manufactu...

Semiconductor apparatus and method for preparing the same

Method for preparing a semiconductor apparatus

Tall and fine pitch interconnects

Package assembly

Semiconductor chip, method for manufacturing semiconductor chip, in...

Hermetically sealed MEMS device and its fabrication

Three-dimensional chip stack and method of forming the same

Package assembly

Tall and fine pitch interconnects

Metal bond pad with cobalt interconnect layer and solder thereon

Method of forming package assembly

Three-dimensional chip stack and method of forming the same

Semiconductor packaging structure and method for forming the same

Integrated circuit chip using top post-passivation technology and b...

Semiconductor device and method for producing the same

Three-dimensional chip stack and method of forming the same

Semiconductor chips having improved solidity, semiconductor package...

Semiconductor packaging structure and method

Package assembly and method of forming the same

Magnet assisted alignment method for wafer bonding and wafer level...

Patents Applicationslast 30 patents

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...

Bonding Structures of Integrated Circuit Devices and Method Forming...

BOWL SHAPED PAD

TALL AND FINE PITCH INTERCONNECTS

METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON

Tall and Fine Pitch Interconnects

Three-Dimensional Chip Stack and Method of Forming the Same

METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...

Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...

PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

Semiconductor Chip with Stair Arrangement Bump Structures