by physical means only

Industry

CPC
H01L2224/11612

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11612by physical means only

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component module, method for producing the same, endosco...
- Patent number 11,444,049
- Issue date Sep 13, 2022
- Sony Corporation
- Osamu Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive materials on semiconductor devices, a...
- Patent number 9,768,134
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for semiconductor package
- Patent number 9,355,977
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor construct installed on...
- Patent number 9,343,428
- Issue date May 17, 2016
- TERA PROBE, INC.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for semiconductor package
- Patent number 8,970,035
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...
- Publication number 20200219836
- Publication date Jul 9, 2020
- SONY CORPORATION
- Osamu MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20150311181
- Publication date Oct 29, 2015
- TERA PROBE, INC.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20140287555
- Publication date Sep 25, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structures for Semiconductor Package
- Publication number 20140061897
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20110115080
- Publication date May 19, 2011
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS

by physical means only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component module, method for producing the same, endosco...

Semiconductor devices and semiconductor devices including a redistr...

Expanded head pillar for bump bonds

Semiconductor devices including conductive pillars

Methods of forming conductive materials on semiconductor devices, a...

Bump structures for semiconductor package

Semiconductor device including semiconductor construct installed on...

Bump structures for semiconductor package

TSV pillar as an interconnecting structure

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

EXPANDED HEAD PILLAR FOR BUMP BONDS

ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...

Bump Structures for Semiconductor Package

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...