by plasma etching

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H05K3/0041

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0041by plasma etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,917,756
- Issue date Feb 27, 2024
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma ashing for coated devices
- Patent number 11,849,543
- Issue date Dec 19, 2023
- Sean Clancy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally induced graphene sensing circuitry on intelligent valves,...
- Patent number 11,812,561
- Issue date Nov 7, 2023
- Schlumberger Technology Corporation
- Manuel Marya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating contact pads for electronic substrates
- Patent number 11,765,826
- Issue date Sep 19, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,553,601
- Issue date Jan 10, 2023
- Ibiden Co., Ltd.
- Kazuyuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wiring substrate
- Patent number 11,510,320
- Issue date Nov 22, 2022
- Ulvac, Inc.
- Muneyuki Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,503,709
- Issue date Nov 15, 2022
- Ibiden Co., Ltd.
- Shota Tachibana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing flexible printed circuit...
- Patent number 11,178,754
- Issue date Nov 16, 2021
- Samsung Display Co., Ltd.
- Wi Jin Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 11,062,884
- Issue date Jul 13, 2021
- HITACHI HIGH-TECH CORPORATION
- Yoshiyuki Hironaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Contact pads for electronic substrates and related methods
- Patent number 10,905,007
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,813,231
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates with ultra fine pitch flip chip bumps
- Patent number 10,779,417
- Issue date Sep 15, 2020
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 10,765,011
- Issue date Sep 1, 2020
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,729,014
- Issue date Jul 28, 2020
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating flexible substrate
- Patent number 10,517,171
- Issue date Dec 24, 2019
- LG Chem, Ltd.
- Hye Won Jeong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electrically conducting assemblies
- Patent number 10,506,710
- Issue date Dec 10, 2019
- Solvay Specialty Polymers Italy S.p.A.
- Paula Cojocaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 10,485,109
- Issue date Nov 19, 2019
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,477,701
- Issue date Nov 12, 2019
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 10,477,702
- Issue date Nov 12, 2019
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrically conducting assemblies
- Patent number 10,455,696
- Issue date Oct 22, 2019
- Solvay Specialty Polymers Italy S.p.A.
- Paula Cojocaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,433,426
- Issue date Oct 1, 2019
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit structure and manufacturing method thereof
- Patent number 10,383,226
- Issue date Aug 13, 2019
- Unimicron Technology Corp.
- Chang-Fu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292537
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292536
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...
- Publication number 20240080989
- Publication date Mar 7, 2024
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Manuel Marya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE
- Publication number 20230371189
- Publication date Nov 16, 2023
- Unimicron Technology Corp.
- Chun-Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20230180396
- Publication date Jun 8, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
- Publication number 20230073563
- Publication date Mar 9, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing a Component Carrier
- Publication number 20230044122
- Publication date Feb 9, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian SATTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOAR...
- Publication number 20220361341
- Publication date Nov 10, 2022
- Gebr. Schmid GmbH
- Christian Schmid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...
- Publication number 20220201853
- Publication date Jun 23, 2022
- Rohm and Haas Electronic Materials L.L.C.
- CHIH-LIANG CHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...
- Publication number 20220201852
- Publication date Jun 23, 2022
- Rohm and Haas Electronic Materials L.L.C.
- CHIH-LIANG CHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...
- Publication number 20210321521
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Manuel Marya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATALYZED METAL FOIL AND USES THEREOF
- Publication number 20210259115
- Publication date Aug 19, 2021
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210259106
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Shota TACHIBANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210144853
- Publication date May 13, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210136929
- Publication date May 6, 2021
- IBIDEN CO., LTD.
- Kazuyuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plasma Ashing for Coated Devices
- Publication number 20210127497
- Publication date Apr 29, 2021
- HZO, Inc.
- Sean Clancy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process For Forming Traces on a Catalytic Laminate
- Publication number 20210051804
- Publication date Feb 18, 2021
- CATLAM, LLC
- Kenneth S. BAHL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210007224
- Publication date Jan 7, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WIRING SUBSTRATE
- Publication number 20200315021
- Publication date Oct 1, 2020
- ULVAC, Inc.
- Muneyuki SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT...
- Publication number 20200288563
- Publication date Sep 10, 2020
- SAMSUNG DISPLAY CO., LTD.
- Wi Jin NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20200093007
- Publication date Mar 19, 2020
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20200037455
- Publication date Jan 30, 2020
- Unimicron Technology Corp.
- Po-Hsuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTING ASSEMBLIES
- Publication number 20200008297
- Publication date Jan 2, 2020
- SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Paula COJOCARU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20190394886
- Publication date Dec 26, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CREATING A CAVITY USING PLASMA GAS
- Publication number 20190373736
- Publication date Dec 5, 2019
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT ELECTRODE ARRAY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190297729
- Publication date Sep 26, 2019
- Second Sight Medical Products, Inc.
- Robert Jay Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

by plasma etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier and method of manufacturing a component carrier

Electrical devices with electrodes on softening polymers and method...

Printed wiring board and method for manufacturing printed wiring board

Catalyzed metal foil and uses thereof

Plasma ashing for coated devices

Thermally induced graphene sensing circuitry on intelligent valves,...

Method of fabricating contact pads for electronic substrates

Electroless and electrolytic deposition process for forming traces...

Flexible circuit electrode array and method of manufacturing the same

Circuit board and method for manufacturing the same

Electrical devices with electrodes on softening polymers and method...

Wiring board and method for manufacturing the same

Method of processing wiring substrate

Printed wiring board and method for manufacturing printed wiring board

Display device and method of manufacturing flexible printed circuit...

Plasma processing apparatus and plasma processing method

Contact pads for electronic substrates and related methods

Process for forming traces on a catalytic laminate

Method for manufacturing circuit board

Substrates with ultra fine pitch flip chip bumps

Multilayer wiring board

Method for manufacturing circuit board

Method for fabricating flexible substrate

Electrically conducting assemblies

Electrical devices with electrodes on softening polymers and method...

Circuit board and method for manufacturing the same

Multilayer wiring board

Electrically conducting assemblies

Circuit board and method for manufacturing the same

Multi-layer circuit structure and manufacturing method thereof

Patents Applicationslast 30 patents

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...

METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE

CIRCUIT BOARD

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

PRODUCING METHOD OF WIRED CIRCUIT BOARD

Component Carrier and Method of Manufacturing a Component Carrier

METHOD OF PRODUCING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOAR...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...

METHOD FOR MANUFACTUNRING A MULTILAYER CIRCUIT STRUCTURE HAVING EMB...

THERMALLY INDUCED GRAPHENE SENSING CIRCUITRY ON INTELLIGENT VALVES,...

CATALYZED METAL FOIL AND USES THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Plasma Ashing for Coated Devices

Process For Forming Traces on a Catalytic Laminate

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

METHOD OF PROCESSING WIRING SUBSTRATE

DISPLAY DEVICE AND METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

METHOD FOR MANUFACTURING CIRCUIT BOARD

ELECTRICALLY CONDUCTING ASSEMBLIES

MULTILAYER WIRING BOARD

CREATING A CAVITY USING PLASMA GAS

FLEXIBLE CIRCUIT ELECTRODE ARRAY AND METHOD OF MANUFACTURING THE SAME