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  • B28D5/02
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/02by rotary tools
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Cutting apparatus
    • Patent number 12,220,782
    • Issue date Feb 11, 2025
    • Disco Corporation
    • Zhibo Su
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Dicing blade including diamond particles
    • Patent number 12,208,541
    • Issue date Jan 28, 2025
    • Samsung Electronics Co., Ltd.
    • Youngja Kim
    • C01 - INORGANIC CHEMISTRY
  • Information Patent Grant

    Edge alignment method
    • Patent number 12,151,401
    • Issue date Nov 26, 2024
    • Disco Corporation
    • Atsushi Komatsu
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Processing apparatus
    • Patent number 11,820,042
    • Issue date Nov 21, 2023
    • Disco Corporation
    • Kazuki Terada
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Blade holding jig
    • Patent number 11,772,300
    • Issue date Oct 3, 2023
    • Disco Corporation
    • Zhibo Su
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic resonator support structure and ultrasonic vibration mac...
    • Patent number 11,759,975
    • Issue date Sep 19, 2023
    • TAKADA CORPORATION
    • Keiichi Yotsumoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Hubbed blade
    • Patent number 11,712,783
    • Issue date Aug 1, 2023
    • Disco Corporation
    • Ryoji Taguchi
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Method for preparing SiC ingot, method for preparing SiC wafer and...
    • Patent number 11,708,644
    • Issue date Jul 25, 2023
    • SENIC INC.
    • Jong Hwi Park
    • C01 - INORGANIC CHEMISTRY
  • Information Patent Grant

    Wafer trimming device
    • Patent number 11,705,323
    • Issue date Jul 18, 2023
    • Samsung Electronics Co., Ltd.
    • Jungseok Ahn
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Cutting apparatus
    • Patent number 11,521,867
    • Issue date Dec 6, 2022
    • Disco Corporation
    • Satoshi Hanajima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cutting apparatus, cutting blade replacement method, and board repl...
    • Patent number 11,491,669
    • Issue date Nov 8, 2022
    • Disco Corporation
    • Kazuki Terada
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Grant

    Outer blade cutting wheel and making method
    • Patent number 11,364,591
    • Issue date Jun 21, 2022
    • Shin-Etsu Chemical Co., Ltd.
    • Masaki Kasashima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Transfer jig and cutting blade changing method
    • Patent number 11,318,573
    • Issue date May 3, 2022
    • Disco Corporation
    • Kazuki Terada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cutting apparatus
    • Patent number 11,173,631
    • Issue date Nov 16, 2021
    • Disco Corporation
    • Takeomi Fukuoka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cutting apparatus
    • Patent number 11,018,031
    • Issue date May 25, 2021
    • Disco Corporation
    • Hiromitsu Ueyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method using a ring frame and a polyester sheet
    • Patent number 11,018,043
    • Issue date May 25, 2021
    • Disco Corporation
    • Shigenori Harada
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Cutting apparatus
    • Patent number 10,974,356
    • Issue date Apr 13, 2021
    • Disco Corporation
    • Kazuki Terada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cutting blade mounting mechanism
    • Patent number 10,974,364
    • Issue date Apr 13, 2021
    • Disco Corporation
    • Kazuma Sekiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Mechanical seed coupling
    • Patent number 10,968,934
    • Issue date Apr 6, 2021
    • Mitsubishi Polycrystalline Silicon America Corporation (MIPSA)
    • Joseph Lovorn
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Grant

    Cutting apparatus
    • Patent number 10,950,451
    • Issue date Mar 16, 2021
    • Disco Corporation
    • Hisashi Arakida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Blade mounting and dismounting jig, blade mounting and dismounting...
    • Patent number 10,933,500
    • Issue date Mar 2, 2021
    • Disco Corporation
    • Hayato Kiuchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Pattern structure and method of manufacturing the pattern structure
    • Patent number 10,928,573
    • Issue date Feb 23, 2021
    • Samsung Electronics Co., Ltd.
    • Sunghoon Lee
    • G02 - OPTICS
  • Information Patent Grant

    Method of processing workpiece
    • Patent number 10,930,512
    • Issue date Feb 23, 2021
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing apparatus
    • Patent number 10,930,558
    • Issue date Feb 23, 2021
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece processing method
    • Patent number 10,872,819
    • Issue date Dec 22, 2020
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Chuck table and processing apparatus including the same
    • Patent number 10,870,220
    • Issue date Dec 22, 2020
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    LED wafer processing method
    • Patent number 10,843,381
    • Issue date Nov 24, 2020
    • Disco Corporation
    • Makiko Ohmae
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Cutting blade mounting method
    • Patent number 10,759,088
    • Issue date Sep 1, 2020
    • Disco Corporation
    • Kazuma Sekiya
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Method of processing a substrate
    • Patent number 10,727,127
    • Issue date Jul 28, 2020
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor sawing method and system
    • Patent number 10,703,016
    • Issue date Jul 7, 2020
    • Texas Instruments Incorporated
    • Chi-Hung Chen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING METHOD FOR WORKPIECE
    • Publication number 20250050541
    • Publication date Feb 13, 2025
    • Disco Corporation
    • Toru TANAKA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    DICING DEVICE
    • Publication number 20250018605
    • Publication date Jan 16, 2025
    • TOKYO SEIMITSU CO., LTD.
    • Yusuke KANESHIRO
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    TECHNIQUES FOR PATTERNING FERRITE MATERIALS
    • Publication number 20240404749
    • Publication date Dec 5, 2024
    • Metamagnetics Inc.
    • Alexander Sokolov
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20230191511
    • Publication date Jun 22, 2023
    • Disco Corporation
    • Takashi FUKAZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DICING BLADE INCLUDING DIAMOND PARTICLES
    • Publication number 20230039736
    • Publication date Feb 9, 2023
    • Samsung Electronics Co., Ltd.
    • Youngja KIM
    • C01 - INORGANIC CHEMISTRY
  • Information Patent Application

    ULTRASONIC RESONATOR SUPPORT STRUCTURE AND ULTRASONIC VIBRATION MAC...
    • Publication number 20220266298
    • Publication date Aug 25, 2022
    • TAKADA CORPORATION
    • Keiichi Yotsumoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EDGE TRIMMING METHOD
    • Publication number 20220184768
    • Publication date Jun 16, 2022
    • Disco Corporation
    • Takashi OKAMURA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULA...
    • Publication number 20220063135
    • Publication date Mar 3, 2022
    • DIA&CO Inc.
    • YOUNG DAE KIM
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    BLADE REPLACING APPARATUS AND ADJUSTING METHOD OF BLADE REPLACING A...
    • Publication number 20210354257
    • Publication date Nov 18, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER TRIMMING DEVICE
    • Publication number 20210320000
    • Publication date Oct 14, 2021
    • Samsung Electronics Co., Ltd.
    • Jungseok AHN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BLADE HOLDING JIG
    • Publication number 20210316477
    • Publication date Oct 14, 2021
    • Disco Corporation
    • Zhibo SU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING APPARATUS, CUTTING BLADE REPLACEMENT METHOD, AND BOARD REPL...
    • Publication number 20210316468
    • Publication date Oct 14, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    EDGE ALIGNMENT METHOD
    • Publication number 20210291404
    • Publication date Sep 23, 2021
    • Disco Corporation
    • Atsushi KOMATSU
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20210107180
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE AND MANUFACTURING METHOD OF CUTTING BLADE
    • Publication number 20210078204
    • Publication date Mar 18, 2021
    • Disco Corporation
    • Takashi FUKAZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20200391410
    • Publication date Dec 17, 2020
    • Disco Corporation
    • Takeomi FUKUOKA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    HUBBED BLADE
    • Publication number 20200324390
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Ryoji TAGUCHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    HUBBED BLADE
    • Publication number 20200324391
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Ryoji TAGUCHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PATTERN STRUCTURE AND METHOD OF MANUFACTURING THE PATTERN STRUCTURE
    • Publication number 20200249384
    • Publication date Aug 6, 2020
    • Samsung Electronics Co., Ltd.
    • Sunghoon LEE
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE MOUNTING METHOD
    • Publication number 20200198183
    • Publication date Jun 25, 2020
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    A Method of Machining Brittle Materials
    • Publication number 20200039109
    • Publication date Feb 6, 2020
    • UNIVERSITY OF NEWCASTLE UPON TYNE
    • Zi Jie Choong
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20200030928
    • Publication date Jan 30, 2020
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor Sawing Method and System
    • Publication number 20190389091
    • Publication date Dec 26, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Chi-Hung Chen
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190378745
    • Publication date Dec 12, 2019
    • Disco Corporation
    • Shigenori HARADA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    TRANSFER JIG AND CUTTING BLADE CHANGING METHOD
    • Publication number 20190358757
    • Publication date Nov 28, 2019
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CORE DRILL BIT AND METHODS OF FORMING THE SAME
    • Publication number 20190329449
    • Publication date Oct 31, 2019
    • Saint-Gobain Abrasives, Inc.
    • Ji WANG
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20190295850
    • Publication date Sep 26, 2019
    • Disco Corporation
    • Hisashi ARAKIDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME
    • Publication number 20190275700
    • Publication date Sep 12, 2019
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20190229018
    • Publication date Jul 25, 2019
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE MOUNTING METHOD
    • Publication number 20190001526
    • Publication date Jan 3, 2019
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE